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  • 1. Andrae, Anders S.G.
    et al.
    Möller, Patrik
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Embedded Systems.
    Andersson, Johan
    Liu, Johan
    Uncertainty estimation by Monte Carlo Simulation applied to life cycle inventory of cordless phones and microscale metallization Processes2004In: IEEE transactions on electronics packaging manufacturing (Print), ISSN 1521-334X, E-ISSN 1558-0822, Vol. 27, no 4, p. 233-245Article in journal (Other academic)
  • 2.
    Andreasson, Daniel
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Embedded Systems.
    Slack-Time Aware Dynamic Routing Schemes for on-chip networks2007Licentiate thesis, monograph (Other academic)
    Abstract [en]

    Network-on-Chip (NoC) is a new on-chip communication paradigm for future IP-core based System-on-Chip (SoC), designed to remove a number of limitations of today’s on-chip interconnect solutions. A NoC interconnects cores by means of a packet switched micro-network, which improves scalability and reusability, resulting in a shorter time to market. A typical NoC will be running many applications concurrently, which results in shared network capacity between different kinds of traffic flows. Due to the diverse characteristic of applications, some traffic flows will require real-time communication guarantees while others are tolerant to even some loss of data. In order to provide different levels of Quality-of-Service (QoS) for traffic flows, the communication traffic is separated into different service classes. Traffic in NoC is typically classified into two service classes: the guaranteed throughput (GT) and the best-effort (BE) service class. The GT class offers strict QoS guarantees by setting up a virtual path with reserved bandwidth between the source (GT-producer) and destination (GT-consumer), called a GT-path. The BE class offers no strict QoS guarantees, but tries to efficiently use any network capacity which may become available from the GT traffic. The GT traffic may not fully utilize its bandwidth reservation if its communication volume varies, leading to time intervals where there is no GT traffic using the bandwidth reservation. These intervals are referred to as slack-time. If the slack can not be used this leads to unnecessarily reduced performance of BE traffic, since a part of the available network capacity becomes blocked. This thesis deals with methods to efficiently use the slack-time for BE traffic. The contributions include three new dynamic schemes for slack distribution in NoC. First, a scheme to inform the routers of a GT-path about available slack is evaluated. The GT-producer plans its traffic using a special playout buffer, and issues control packets containing the actual amount of slack-time available. The results show that this scheme leads to decreased latency, jitter and packet drops for BE traffic. Secondly, an extension to this scheme is evaluated, where slack is distributed among multiple GT-paths (slack distribution in space). This opens up the possibility to balance the QoS of BE traffic flows which overlap with the GT-paths. Thirdly, a scheme to distribute slack among the links of a GT-path (slack distribution in time) is proposed. In this approach, arriving GT-packets, at a certain router along the GT-path, can wait for a maximum defined amount of time. During this time, any waiting BE traffic in the buffers can be forwarded over the GT-path. The results confirm that this is especially important during high BE-traffic load, where this technique decreases the jitter of BE traffic considerably.

  • 3.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Anti-Moisture Methodology for Electronics Enclosures in Harsh Storage Environments2008Conference paper (Other academic)
  • 4.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Evaluation of Anti-Moisture Measures in Electronics Enclosure: Application of CFD Modelling2009Conference paper (Other academic)
  • 5.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Humidity Management in Electronics Enclosure under Severe Climatic Conditions2008Conference paper (Other academic)
  • 6.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Optimization of PCB Heater Heating Profile for Power-efficient Humidity Management in Electronics Enclosures: OPTIMUS Worldwide User Meeting 2010, Antwerp, Belgium, November 22-23, 20102010Other (Other academic)
  • 7.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bespalov, Michail
    Klochkova, Ludmila
    Kuleshov, Alexander
    Suzan, Dmitriy
    Tishkin, Vladimir
    Транспортная модель распространения газообразных примесей в атмосфере города = Transport model of gas impurities spread processes in urban area2000In: Математическое моделирование: (Mathematical Modelling), ISSN 0234-0879, Vol. 12, no 11, p. 38-46Article in journal (Refereed)
  • 8.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bespalov, Michail
    Klochkova, Ludmila
    Pavlova, Natalya
    Suzan, Dmitriy
    Tishkin, Vladimir
    Сравнение моделей распространения загрязнений в атмосфере = Comparative Analysis of models of pollutions spreading in atmosphere1999In: Математическое моделирование: (Mathematical Modelling), ISSN 0234-0879, Vol. 11, no 8, p. 52-64Article in journal (Refereed)
  • 9.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Carlsson, Jan
    SP Swedish National Testing and Research Institute, Borås, Sweden.
    Investigation of the coupling to a wire inside a box with apertures by means of FDTD simulations2002In: 9th International Symposium on Antenna Technology and Applied Electromagnetics: ANTEM 2002, Montreal, Canada, 2002, p. 125-128Conference paper (Refereed)
    Abstract [en]

    The induced current in a wire placed inside a conducting box due to field penetration through apertures has been studied using FDTD simulations. Two box configurations have been investigated in order to evaluate the difference in coupling with one large aperture and the combination of a large and a narrow aperture. The coupling to a wire placed above a ground plane has also been studied to compare it with the test cases involving the box.

  • 10.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Chedid, Michel
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Investigation of Snap-on Feeding Arrangements for a Wearable UHF Textile Patch Antenna2008In: Ambience 08 International Scientific Conference: proceedings 2008 : smart textiles - technology and design : Borås, Sweden / [ed] Lars Hallnäs, Pernilla Walkenström, Lennart Wasling, Borås: Centrum för textilforskning (CTF), The Swedish School of Textiles, University College of Borås , 2008, p. 84-88Conference paper (Refereed)
  • 11.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Johansson, Alf
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Magnhagen, Bengt
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Vladimir
    A methodology of using simulation tools in teaching of robust electronics for electronics engineers2004In: 15th EAEEIE Annual Conference on Innovation in Education for Electrical and Information Engineering: Sofia, Bulgaria, 2004, p. 256-261Conference paper (Refereed)
  • 12.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Johansson, Alf
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Danielsson, Torkel
    Sarius, Niklas
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Thermal Analysis of a Power Electronics Module in the Prototyping Phase2009In: Electronic Environment, no 4, p. 6-9Article in journal (Other academic)
  • 13.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bergner, Fredrik
    Bornoff, Robin
    CFD aided reflow oven profiling for PCB preheating in a soldering process2007In: Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems: EuroSimE 2007, Piscataway, NJ.: IEEE , 2007, p. 535-542Conference paper (Refereed)
    Abstract [en]

    A CFD-aided reflow oven profile prediction algorithm has been developed and applied to modelling of preheating of a PCB with non-uniform distribution of component thermal mass in a forced air convection solder reflow oven. The iterative algorithm combines an analytic approach with CFD modelling. It requires an experimentally validated CFD model of the solder reflow oven and a CFD model of the PCB as main inputs. Results of computational experiments have been presented to reveal good agreement between predicted PCB profiles and corresponding CFD calculations. Application guidelines contained in the description of the algorithm will assist potential users both during the virtual prototyping phase of a PCB including designing for assembly and in the phase of reflow oven profiling.

  • 14.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bergner, Fredrik
    Bornoff, Robin
    CFD aided reflow oven profiling for PCB preheating in a soldering process: Part 1(2)2007In: Electronic Environment, no 3, p. 25-28Article in journal (Other academic)
  • 15.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bergner, Fredrik
    Bornoff, Robin
    CFD aided reflow oven profiling for PCB preheating in a soldering process: Part 2(2)2007In: Electronic Environment, no 4, p. 25-27Article in journal (Other academic)
  • 16.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Ryden, Jan
    Alavizadeh, Zahra
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    CFD Assisted Design Evaluation and Experimental Verification of a Logic-Controlled Local PCB Heater for Humidity Management in Electronics Enclosure2010In: IEEE EuroSimE 2010, 26-28 April, Bordeaux, France, 2010Conference paper (Refereed)
    Abstract [en]

    Humidity management of commercial-of-the-shelf electronic components in non-controlled climatic environments can be realized e.g. by introducing a local printed circuit board heater. By choosing appropriate size and location of the heater plate in the vicinity of the critical electronic packages, and utilizing logic control function, it is possible to improve the quality of local humidity management and reduce power consumption of the heater, which is important especially in case of battery driven portable or vehicle mounted devices. A computational fluid dynamics assisted methodology has been developed to determine the best feasible design of the heater, followed by experimental verification of the constructed logic controlled heater. The experiment has been performed in a harsh climatic environment including temperature variation from +33°C to +40°C, and relative humidity variation from 54% to 80%. Analysis of the experimental %RH and temperature curves as well as power profile of the heater has confirmed the feasibility of the chosen approach to maintain greater than 9°C difference between the electronics package surface temperature and the local dew point temperature, by applying discrete power pulses with the amplitude less than 6 W.

  • 17.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Rydén, Jan
    Lindblom, Joakim
    Zhang, Yafan
    Hansson, T
    Bergner, Fredrik
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Application of CFD Modelling for Energy Efficient Humidity Mangement of an Electronics Enclosure in Storage under Severe Climatic Conditions2008In: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008: EuroSimE 2008., IEEE , 2008, p. 430-437Conference paper (Refereed)
    Abstract [en]

    A CFD modelling methodology including experimental validation has been developed and applied for investigation of anti-moisture measures in a non- hermetic electronics enclosure containing a number of printed circuit boards, and placed in a severe storage environment. In the climatic test the temperature and the relative humidity have been varried from +33degC to +71degC and from 14% to 80%, respectively. Enclosure heater solutions have been parametrically studied by simulation. A heating strategy involving various power levels has been determined, which is just sufficient to maintain the internal relative humidity below 60%, thereby reducing the risk for dew formation on the electronics assembly.

  • 18.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wingbrant, Helena
    Spetz, Anita-Lloyd
    Sundgren, Hans
    Thuner, Bo
    Svenningstorp, Henrick
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Thermal and flow analysis of SiC-based gas sensors for automotive applications2004In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004: EuroSimE 2004., IEEE , 2004, p. 475-482Conference paper (Refereed)
    Abstract [en]

    Different block and tube mounting alternatives for SiC-based gas sensors were studied by means of temperature measurements and simulation of heat transfer and gas flow for steady state conditions. The most preferable tube mounting design was determined. Simulation-based guidelines were developed for designing tube-mounted gas sensors in the exhaust pipes of diesel and petrol engines, taking into account thermal constraints and flow conditions.

  • 19.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wingbrant, Helena
    Spetz, Anita-Lloyd
    Sundgren, Hans
    Thuner, Bo
    Svenningstorp, Henrik
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    CFD analysis of packaging and mounting solutions for SiC-based gas sensors in automotive applications2006In: Sensor Letters, ISSN 1546-198X, Vol. 4, no 1, p. 29-37Article in journal (Refereed)
    Abstract [en]

    Simulation-based guidelines were developed for designing tube-mounted gas sensors in the exhaust pipes of diesel and petrol engines, taking into account thermal constraints and gas flow conditions. Different block and tube mounting alternatives for SiC-based gas sensors were studied by means of temperature measurements and simulation of steady state heat transfer and gas flow. Design variables included the number of fins in the heat sink mounted on the inlet tube, the inlet construction, the mounting tube orientation, and the micro-heater substrate placement inside the mounting tube. The most preferable tube mounting design was determined with respect to the thermal performance of the sensor structure and with respect to the gas flow parameters, which are important for the sensor's selectivity, sensitivity and response time.

  • 20. Belov, Vladimir
    et al.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Nemoykin, Vladimir
    Johansson, Alf
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Computer modelling and analysis of EMC in a multi-phase electrical system2004In: Conference proceedings: EMB 04 : computational electromagnetics - methods and applications : October 18-19, 2004, Göteborg: Department of Electromagnetics, Chalmers University of Technology , 2004, p. 294-301Conference paper (Refereed)
  • 21. Belov, Vladimir
    et al.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Johansson, Alf
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Magnhagen, Bengt
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    A Simulation-based Spectral Strategy for Power Filter Design in an Electrical System2004In: Power Electronics, Machines and Drives, 2004. (PEMD 2004): Second International Conference on (Conf. Publ. No. 498), London: IEEE , 2004, p. 6-10Conference paper (Refereed)
  • 22. Belov, Vladimir
    et al.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Johansson, Alf
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Paldyaev, Nikolay
    Shamaev, Alexey
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Mathematical modelling of a wind power system with an integrated active filter2009In: Electric power systems research, ISSN 0378-7796, E-ISSN 1873-2046, Vol. 79, no 1, p. 117-125Article in journal (Refereed)
  • 23. Belov, Vladimir
    et al.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Paldyaev, Nikolay
    Shamaev, Alexey
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Methods and Models for Computer Aided Design of Wind Power Systems for EMC and Power Quality2010In: Wind Power / [ed] S. M. Muyeen, IN-TECH , 2010Chapter in book (Other (popular science, discussion, etc.))
  • 24. Belov, Vladimir
    et al.
    Paldyaev, Nikolay
    Johansson, Alf
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Mathematical model of a multi-phase active power filter based on multi-phase bridge elements2005In: 5th WSEAS International Conference on power systems and electromagnetic compatibility: PSE'05, 2005Conference paper (Refereed)
  • 25. Belov, Vladimir
    et al.
    Paldyaev, Nikolay
    Shamaev, Alexey
    Johansson, Alf
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    A complete mathematical model of an independent multi-phase power supply system based on multi-phase bridge-element concept2005In: WSEAS Transactions on Circuits and Systems, ISSN 1109-2734, Vol. 4, no 9, p. 1009-1018Article in journal (Other academic)
  • 26. Belov, Vladimir
    et al.
    Paldyaev, Nikolay
    Shamaev, Alexey
    Johansson, Alf
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Matlab/Simulink Model of an Active Power Filter Based on Multi-stage Inverter Architecture2005In: 5th WSEAS International Conference on power systems and electromagnetic compatibility: PSE'05, 2005Conference paper (Refereed)
  • 27. Belov, Vladimir
    et al.
    Paldyaev, Nikolay
    Shamaev, Alexey
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Johansson, Alf
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Mathematical Modeling of Conducted EMI in an Independent Power Supply System Including Power Line Communication Technology2007In: IEEE International Symposium on Power Line Communications and Its Applications: ISPLC 2007, Pisa, Italy, Piscataway, N.J.: IEEE , 2007, p. 360-365Conference paper (Refereed)
  • 28. Belov, Vladimir
    et al.
    Shamaev, Alexey
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Johansson, Alf
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Magnhagen, Bengt
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    A simulation-based spectral technique for power quality and EMC design of an independent power system2006In: International Journal of Emerging Electric Power Systems: IJEEPS, ISSN 1553-779X, Vol. 7, no 1, p. 1-22Article in journal (Refereed)
  • 29.
    Bengtsson, Tomas
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Kumar, Shashi
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    A Survey of High Level Test Generation: Methodologies and Fault Models2004Report (Other academic)
    Abstract [en]

    Test of electronic circuits for fabrication fault is important if the circuits should have reasonable quality. To make the development of complex circuits manageable, methods and computer tools that work on a high level of abstraction are required. Development of test methodologies have however been left behind the increase of abstraction level used for the design. There is a risk that testing aspects become a bottle neck in the development of complex circuits if the test methods fail to cope up with the abstraction level for the design methods.

    System on Chips is often used to implement complex systems. The methods to make test for those circuits consists of three main parts. First part is the development of test procedures for the cores, which is preferably made at high level of abstraction. This area includes fault modeling and test pattern generation at behavior level of abstraction or higher as well as design of extra logic for insertion to facilitate testing. The second part requires development of methods to test the interconnections among cores.

    The third part is to develop a test access mechanism which can be used to test the cores and interconnections within a SoC. This survey is about development of fault models and test pattern for testing of cores at higher level of abstraction than logic level. A promising architecture for the interconnection is the Network on Chip architecture in which cores are interconnected through a network of packet switched switches. Testing of these switches will be identical to testing of a core.

    Models of physical and fabrication faults are needed at higher levels of abstraction in order to be able to develop test patterns from functional or behavioral description of cores. Researchers have experienced that the stuck-at fault model works quite well at logic level. But no such fault model has been discovered at behavioral or higher level which is universally accepted. Several behavior level fault models have been proposed. One of the proposed models is the variable bit stuck-at fault model. This model has been derived from the logic level stuck-at fault model but it does not give adequate coverage of physical faults. Physical faults inside components, like arithmetic and logic units, cannot be modeled in this way. With the methods proposed so far, knowledge of the logic level implementation of the unit is needed to model such faults. In this survey, we describe three proposed classes of fault models - fault models derived from logic level stuck-at faults, operator mutation faults and physically induced faults.

    Testing at higher level of abstraction has a lot in common with software testing. The pattern generation methods can be classified into two main categories, namely, code oriented methods and fault oriented methods. Methods can also be classified into methods that use fault simulation for test pattern generation or use algorithmic approach for test pattern generation. These two classification approaches are orthogonal leading to four different categories of methods. We have tried to put existing approaches in this category. We also survey the experimental setups developed and used by various research groups for carrying out research in high level testing. Some very interesting conclusions can be drawn about the efficacy of various categories of test pattern generation methodologies for testing various types of systems at behavioral level. An interesting conclusion is that code oriented methods are not very effective for testing data dominated circuits at behavioral level.

    Approaches followed by five different research groups working in the area of high level testing is also summarized and compared. We feel that the hierarchical test pattern generation method, which works simultaneously on several levels of abstraction, to generate test patterns is the most promising of these methods. We also feel that new fault models need to be developed to make testing at higher level of abstraction achieve adequate coverage of physical faults and become practically useful.

  • 30.
    Bengtsson, Tomas
    et al.
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Kumar, Shashi
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Ubar, R.
    Jutman, Artur
    Peng, Zebo
    Test methods for crosstalk-induced delay and glitch faults in network-on-chip interconnects implementing asynchronous communication protocols2008In: IET Computers and Digital Techniques, ISSN 1751-8601, Vol. 2, no 6, p. 445-460Article in journal (Refereed)
  • 31. Carlsson, Jan
    et al.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Influence of a Slot on the Induced Current in a Wire Inside a Conducting Box with a Square Aperture2002In: Microwave and optical technology letters (Print), ISSN 0895-2477, E-ISSN 1098-2760, Vol. 32, no 1, p. 25-29Article in journal (Refereed)
  • 32. Casselgren, J.
    et al.
    Hällstig, E.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    True Ground Speed Sensor (TGSS)2009Conference paper (Other academic)
  • 33.
    Chedid, Michel
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wearable Computing in Harsh Environments2004In: SSoCC´04, Båstad 13-14/4 2004., 2004Conference paper (Refereed)
  • 34.
    Chedid, Michel
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wearable Systems in Harsh Environments – Evaluating New Architectural Concepts: LiU-TEK-LIC-2006:712006Licentiate thesis, monograph (Other academic)
  • 35.
    Chedid, Michel
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wearable Systems in Harsh Environments - Realizing New Architectural Concepts2010Doctoral thesis, monograph (Other academic)
  • 36.
    Chedid, Michel
    et al.
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Electromagnetic Coupling to a Wearable Application Based on Coaxial Cable Architecture2006In: Progress in Electromagnetics Research Symposium (PIERS), ISSN 1559-9450, Vol. 56, p. 109-128Article in journal (Refereed)
  • 37. Chedid, Michel
    et al.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Experimental Analysis and Modelling of Textile Transmission Line for Wearable Applications2007In: International Journal of Clothing Science and Technology, ISSN 0955-6222, E-ISSN 1758-5953, Vol. 19, no 1, p. 59-71Article in journal (Refereed)
    Abstract [en]

    Purpose – The paper seeks, by means of measurement and modelling, to evaluate frequency dependent per-unit-length parameters of conductive textile transmission line (CTTL) for wearable applications and to study deterioration of these parameters when CTTL is subjected to washing.

    Design/methodology/approach – The studied transmission line is made of Nickel/Copper (Ni/Cu) plated polyester ripstop fabric and is subjected to standard 60°C cycle in a commercial off-the-shelf washing machine. The per-unit-length parameters (resistance and inductance) and characteristic impedance of the line are extracted from measurements before and after washing. Using the measurement data an equivalent circuit is created to model the degradation of the line. The circuit is then integrated in a three-dimensional transmission line matrix (TLM) model of the transmission line.

    Findings – Both an electrical equivalent circuit and a TLM model are developed describing the degradation of the conductive textile when washed. A severe deterioration of the electrical parameters of the line is noticed. Experimental and modelling results are in good agreement in the addressed frequency band.

    Research limitations/implications – Analysis is performed for frequencies up to 10?MHz. The developed TLM model can be used to conduct parametric studies of the CTTL. To counteract the degradation of the line, protective coating is to be considered in further studies.

    Originality/value – This paper extends knowledge of the subject by experimental and simulation-based characterization of the CTTL when subjected to washing cycles.

  • 38.
    Chedid, Michel
    et al.
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Low Power High bandwidth Power-Line Communication Network for Wearable Applications2010In: BodyNets 2010 – Fifth International Conference on Body Area networks, Greece, 10-12 Sep. 2010, 2010Conference paper (Refereed)
  • 39. Chedid, Michel
    et al.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Modelling and Characterization of Electrostatic Current Noise Induced Mechanically in Wired Wearable Applications2010In: Journal of Electrostatics, ISSN 0304-3886, E-ISSN 1873-5738, Vol. 68, no 1, p. 21-26Article in journal (Refereed)
    Abstract [en]

    By means of statistical modelling and measurement, the triboelectric current noise spectral density is evaluated for shielded cables in body-borne wired network subjected to mechanical stresses. Assuming a shot noise model, an expression for the current spectral density of the noise is derived. The efficiency of the methodology is demonstrated by measuring the triboelectric current noise in two shielded cables subjected to bending. Thereafter the parameters of the noise pulses' waiting time and amplitude probability density functions are extracted from measurement, thus enabling the computation of the current spectral density of the noise induced mechanically in body-borne wired networks.

  • 40.
    Chedid, Michel
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Roadmap: Wearable Computers2005In: IMAPS Nordic 2005: Tönsberg, 2005Conference paper (Refereed)
  • 41.
    Chedid, Michel
    et al.
    Department of Electrical Engineering, Saab Training Systems AB, Sweden.
    Nilsson, Hans
    Department of Electrical Engineering, Saab Training Systems AB, Sweden.
    Johansson, Alf
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Welinder, Jan
    Department of Electronics, SP Technical Research Institute of Sweden, SE-50115 Borås, Sweden.
    Realisation of an Active Inductance for a Low Power High Bandwidth DC Power Line Communication Network Transceiver2010In: AEU - International Journal of Electronics and Communications, ISSN 1434-8411, E-ISSN 1618-0399, Vol. 64, no 10, p. 947-952Article in journal (Refereed)
    Abstract [en]

    An active inductor based on an improved gyrator circuit is proposed. The active inductor is developed to be implemented in a high impedance transceiver for a wearable DC power line communication network where requirements such as low power consumption, high bandwidth and numerous nodes support are prioritized. A load isolation step is introduced to ensure the stability of the active inductance's size on different load currents. The proposed gyrator circuit is analyzed and optimized by means of theoretical calculations. The theoretical results are then verified by simulations and experiments in the frequency range up to 10 MHz.

  • 42.
    Chedid, Michel
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Tomicic, Daniel
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Evaluation of Conductive Textile for Wearable Computer Applications2006In: The IMAPS Nordic Annual Conference, 2006, p. 220-227Conference paper (Refereed)
    Abstract [en]

    Wearable systems put high demands on wearability and robustness. Conductive fabrics are very likely to be used in wearable systems due to their textile-like characteristics. However conductive fabrics must be able to resist environmental stresses (wearing, laundering, etc.) in the same way as clothing in order to fully comply with the requirements.

    A demonstrator, TxWear, was constructed to exploit conductive fabrics in building a conductive textile transmission line for intermodular communication and power transmission (DC power line communication bus), thus eliminating the need for cables between the modules. The hardware modules are connected to the conductive line through connectors from textile industry, i.e., snap fasteners. Different types of conductive fabrics (Ni/Cu plated polyester fabrics and stainless-steel based elastic ribbon) were evaluated and compared according to their conductivity, flexibility and robustness characteristics. The effect of washing on the electrical properties (per-unit-length parameters) of the textile transmission line was studied. Different coating processes, i.e., parylene and silicone coating, were studied and evaluated in order to isolate and enhance the robustness of the conductive textile. Ni/Cu plated polyester ripstop fabric was found to be not appropriate for wearable applications, while conductive elastic ribbon showed good robustness to laundry induced stresses.

  • 43.
    Chen, Yaoming
    et al.
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Huo, Hongwei
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Xu, Youzhi
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Wireless E-Care Sensor Network Management2008In: 1st International Conference on M4D, Mobile Communication Technology for Development, 11–12 December, 2008, Karlstad University, Sweden, 2008Conference paper (Refereed)
  • 44. Frazzetta, D.
    et al.
    Dimartino, G.
    Palesi, Maurizio
    Kumar, Shashi
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering. Data-Och Electronik. Jönköping University, School of Engineering, JTH. Research area Embedded Systems.
    Catania, V.
    Efficient Application Specific Routing Algorithms for NoC Systems utilizing Partially Faulty Links2008In: 11th Euromicro Conference on Digital System Design (DSD 2008): Architectures, Methods and Tools, 2008, p. 18-25Conference paper (Refereed)
  • 45. Fredenberg, Mikael
    et al.
    Möller, Patrick
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Simulation of copper deposition by electrochemical pattern replication2009In: Timitikos Tomos sti mnimn toi Kathijiti Nikolaoi Spirelli: [¨Honorary volume dedicated to the memory of professor Nicolas Spyrellis] / [ed] P. Gyftou & E. Pavlatou, Athina: Ethniko Metsivio Polytechneio , 2009, p. 153-160Chapter in book (Other academic)
  • 46. Fredenberg, Mikael
    et al.
    Möller, Patrick
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Östling, M.
    Recent Progress in the Development of ECPR (ElectroChemical Pattern Replication) Metal Printing for Microelectronics2005Conference paper (Other academic)
  • 47.
    Gunnarsson, Niklas
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Multi-functional polymer based encapsulation of micro-systems for harsh environments2004In: SSoCC´04, Båstad 13-14/4 2004, 2004Conference paper (Refereed)
  • 48.
    Gunnarsson, Niklas
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Hald, J
    Hultman, L
    Influence of Ultrasound on filling of Grooves during Ni Electrodeposition2009Conference paper (Other academic)
  • 49. Gunnarsson, Niklas
    et al.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wang, X.
    Svensson, M.
    Vieider, C.
    Hultman, L.
    Electrochemically based low-cost high precision processing in MOEMS packaging2009In: Electrochimica Acta, ISSN 0013-4686, E-ISSN 1873-3859, Vol. 54, no 9, p. 2458-2465Article in journal (Refereed)
    Abstract [en]

    Precision processing in MOEMS (micro-opto-electromechanical systems) packaging has been studied based on electrochemical processes with the purpose of establishing technology for low-cost multifunctional encapsulation of microsystems and assembly of opto-electric access links in polymer.

    The electrochemically based processes studied in this paper include:

    1.Electroforming of a polymer moulding tool (stamper) in a nickel sulphamate electrolyte on a high-precision 3D etched silicon template.

    2.Patterning of 3D surfaces by an electrophoretic photoresist.

    3.Precision plating of Au and Sn for self-alignment of chips by eutectic Au–Sn solder.

    The results show that nickel stampers with adequately low internal stress can be electroformed on 3D silicon wafers. Furthermore, 3D polymer samples manufactured by the nickel stampers can be patterned with metal lines down to 20 μm width using electrophoretic photoresist. Finally, eutectic Au–Sn solder bumps are realized by electroplating of Au and Sn followed by reflowing, satisfying the demands on dimension and alloy composition control over a 4 in. Si wafer.

  • 50.
    Gunnarsson, Niklas
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wang, X.
    Svensson, M.
    Vieider, C.
    Hultman, L.
    Low-cost high precision processing in MEMs packaging based on electrochemical processes2007Conference paper (Other academic)
1234 1 - 50 of 159
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