Change search
Refine search result
1234 101 - 150 of 196
CiteExportLink to result list
Permanent link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Rows per page
  • 5
  • 10
  • 20
  • 50
  • 100
  • 250
Sort
  • Standard (Relevance)
  • Author A-Ö
  • Author Ö-A
  • Title A-Ö
  • Title Ö-A
  • Publication type A-Ö
  • Publication type Ö-A
  • Issued (Oldest first)
  • Issued (Newest first)
  • Created (Oldest first)
  • Created (Newest first)
  • Last updated (Oldest first)
  • Last updated (Newest first)
  • Disputation date (earliest first)
  • Disputation date (latest first)
  • Standard (Relevance)
  • Author A-Ö
  • Author Ö-A
  • Title A-Ö
  • Title Ö-A
  • Publication type A-Ö
  • Publication type Ö-A
  • Issued (Oldest first)
  • Issued (Newest first)
  • Created (Oldest first)
  • Created (Newest first)
  • Last updated (Oldest first)
  • Last updated (Newest first)
  • Disputation date (earliest first)
  • Disputation date (latest first)
Select
The maximal number of hits you can export is 250. When you want to export more records please use the Create feeds function.
  • 101.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Jensen, A.
    Møller, Patrick
    Pulse Plating as Cleaner Technology1994In: Plating and Coating Today, no 4, p. 11-13Article in journal (Other academic)
  • 102.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Jensen, A.
    Møller, Patrick
    Pulse Plating used for Life-Cycle Design1994In: Electroplating and Surface Treatment (Galvanotekhnika i Obrabotka Poverkhnosti), ISSN 0869-5326, Vol. 3, p. 20-24Article in journal (Refereed)
  • 103.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing. RISE Research Institutes of Sweden, Borås/Stockholm, Sweden.
    Johansson, E.
    RISE Research Institutes of Sweden, Borås/Stockholm, Sweden.
    Aspects to be considered when making innovation out of promising research results in surface technology2019In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 97, no 2, p. 67-72Article in journal (Refereed)
    Abstract [en]

    In the eyes of industrialists, scientists often exaggerate the economic potential of their findings. The industrialists know that developing a new technology to production is associated with uncertainty and risks. To elucidate the challenges faced by the surface treatment industry, this paper discusses aspects that should be considered when making innovation out of promising research results. The Technology Readiness Level (TRL) metric for assessing maturity of a technology is discussed and exemplified. Additional risks of fluid character such as legislation, price of raw material and customer expectations are also discussed. Even though, the subject is of general relevance, the present discussion refers to surface technology and examples are given from copper plating of printed circuit boards, and durable and cost-efficient coatings on electrical connectors. 

  • 104.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Leu, R. Leu
    Møller, Patrick
    Electroplating of Porous Powder Metallugical Compacts1997In: Powder Metallurgy, ISSN 0032-5899, E-ISSN 1743-2901, Vol. 40, no 3, p. 207-210Article in journal (Refereed)
  • 105.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Möller, Patrick
    Alting, L.
    Neuere Entwicklungen auf dem Gebiet des Pulse-Plating1991In: Galvanotechnik, ISSN 0016-4232, Vol. 82, no 5, p. 1548-1554Article in journal (Refereed)
  • 106.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Möller, Patrick
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Fredenberg, Mikael
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Pulse reversal plating of copper for electronics applications2006Conference paper (Other academic)
  • 107.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Möller, Patrick
    Fredenberg, Mikael
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Recent progress in pulse reversal plating of copper for electronics applications2007In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 85, no 1, p. 40-45Article in journal (Refereed)
    Abstract [en]

    Based on demands for modern printed circuit board (pcb) manufacturing, the copper electroplating process is discussed. Electroplating from an additive free solution using low frequency pulse reversal plating with superimposed cathodic pulsation is suggested, which meets the demands for precise dimensions, high ductility and conductivity, low costs and environmental friendliness.

  • 108.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Møller, Patrick
    Chemical and Electrochemical Surface Treatment of Joined Materials1994In: Joining Aspects of High Performance Materials: European Institute for the Joining of Materials, Elsinore, 1994Conference paper (Refereed)
  • 109.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Møller, Patrick
    Every Surface has its Own 'Genetic Code'1991In: New Scandinavian Technology, ISSN 1100-956X, no 3, p. 21-22Article in journal (Other academic)
  • 110.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Møller, Patrick
    Alting, L.
    Charakteristische Aspekte bei Pulse-Plating1992In: Galvanotechnik, Vol. 83, no 11, p. 3729-3734Article in journal (Refereed)
  • 111.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Møller, Patrick
    McNelly, A.
    Throwing power and ductility of pulse reversal plated copper for PCBs1994In: Processing of Advanced Materials, ISSN 0960-3158, Vol. 9, no 3, p. 148-154Article in journal (Refereed)
  • 112.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Nielsen, C.
    Tang, P.
    Dörge, T.
    Møller, Patrick
    Methods for electrodepositing composition-modulated alloys 1996In: Journal of Materials Processing Technology, ISSN 0924-0136, E-ISSN 1873-4774, Vol. 58, no 1, p. 39-44Article in journal (Refereed)
  • 113.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing. RISE Research Institutes of Sweden, Borås, Sweden.
    Nielsen, Lars Pleth
    Danish Technological Institute, Tribology Centre, Aarhus, Denmark.
    Offshoring and backshoring of surface finishing from the perspective of the Nordic countries2019In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 97, no 2, p. 54-56Article in journal (Refereed)
    Abstract [en]

    Backshoring of production to Western Europe has become an increasingly important trend after decades of offshoring. The subject is introduced by a general discussion followed by a specific analysis of the Nordic surface finishing industry. The main finding is that production quality is the main driver for backshoring of surface finishing. 

  • 114.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Olsen, M.
    Wahlström, U.
    The Influence of Process Parameters on the quality of Cu-Ni CMA coatings1997In: Workshop on Electrodeposited CMA Coatings: Athens, 1997Conference paper (Refereed)
  • 115.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Svensson, M.
    Billman, Å.
    Read, M.
    Electrodeposition of Nickel for Microreplication1998In: Sur/Fin ’98: Minneapolis, 1998Conference paper (Refereed)
  • 116.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Tang, P.
    Influence of Structure Modification by Pulsed Electrodeposition on Corrosion Resistance and other Properties1994In: 6th European Workshop on the Electrodeposition of Metals: Interest Group on Applied Electrochemistry, Dresden, 1994Conference paper (Refereed)
  • 117.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Tang, P.
    Bech-Nielsen, G.
    The Optimazation of Throwing Power in Pulse Reversal Plating from a Silver Cyanid Solution1994In: Sur/Fin '94: Indianapolis, 1994Conference paper (Refereed)
  • 118.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Tang, T.
    Modifikation af egenskaber og struktur for metaler udfældet med pulserende strøm1995In: Danish Electrochemical society, 25th anniversary symposium: Lyngby, 1995Conference paper (Refereed)
  • 119.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Tang, T.
    Pulserende strøm ændrer egenskaberne af galvanisk udfældede metaller1996In: Dansk Kemi, ISSN 0011-6335, Vol. 77, no 5, p. 29-31Article in journal (Other academic)
  • 120.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Ulrich, D.
    Møller, Patrick
    Optimizing of Current Efficiency in Hard Chromium Pulse Plating by Taguchi Statistics1992In: Plating and surface finishing, ISSN 0360-3164, Vol. 79, no 7, p. 62-66Article in journal (Refereed)
  • 121.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Ulrich, D.
    Møller, Patrick
    The Application of the Taguchi Statistical Method in Pulse Plating. Example: Hard Chromium Plating1991In: 4th International Pulse Plating Symposium: Orlando, 1991Conference paper (Refereed)
  • 122.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing. RISE Res Inst Sweden, Elect Dept, Borås, Sweden.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
    Application of Assaf panel for evaluating throwing power of pulse reverse electroplating on complex geometries2018In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 96, no 5, p. 258-264Article in journal (Refereed)
    Abstract [en]

    The Assaf panel arrangement was used for evaluating pulse reverse plating processes and optimisation of the throwing power (TP) of complex three-dimensional (3D) geometries. Two different electroplating processes were investigated: an acid copper bath and a cyanide silver bath without additives. It has not been possible to establish a direct correlation factor for TP obtained with the Assaf panel and the 3D objects included in the trials. Nevertheless, the Assaf panel was found to be a useful tool for preliminary process parameter optimisation. The copper bath needs agitation to deposit coatings of good quality, whereas the silver bath obtains the best throwing power without agitation. The latter is probably due to inhibition by adsorbed cyanide.

  • 123.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Elektroplätering av antibakteriella beläggningar2015In: Ytforum, ISSN 0349-4470, no 1, p. 23-Article in journal (Other (popular science, discussion, etc.))
  • 124.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Introduction to pulse plating2016Conference paper (Refereed)
  • 125.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Structure modification and process control by pulsed electrodeposition2015In: EUROMAT 2015, Warsaw, Sep. 20-24, 2015., 2015Conference paper (Refereed)
  • 126.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing. SP Technical Research Institute of Sweden, Borås, Sweden.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
    Belov, Ilia
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
    Edström, C.
    SP Technical Research Institute of Sweden, Borås, Sweden.
    Sandulache, G.
    Happy Plating, Wiener Neustadt, Austria.
    Hansal, W. E. G.
    Happy Plating, Wiener Neustadt, Austria.
    Control of silver throwing power by pulse reverse electroplating2017In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 95, no 1, p. 25-30Article in journal (Refereed)
    Abstract [en]

    The influence of electroplating parameters on throwing power (TP) is studied in additive-free silver cyanide solutions under direct current and pulse reverse electroplating conditions. It is found that the best TP is obtained when no agitation of the electrolyte is applied. The most important parameters for controlling the TP are the cathodic current density, the anodic to cathodic charge ratio, and the ratio between the anodic and cathodic current densities. Guidelines for process optimisation are given.

  • 127.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Edström, Curt
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Sandulache, G.
    Hansal, W.
    Influence of pulse reverse plating parameters on throwing power in a silver cyanide bath2016Conference paper (Other academic)
  • 128.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Edström, Curt
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Wang, Hui
    Chang Zhou University, China.
    Influence of anodic pulses and periodic current reversion on electrodeposits2014In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 92, no 6, p. 336-341Article in journal (Refereed)
    Abstract [en]

    This paper discusses how anodic pulses and periodic current reversion influence electrodeposition. Depending on the involved metal and electrolyte, very different effects can be observed and taken advantage of. The Wagner number, Wa, describing the current distribution is shown to be useful for predicting the throwing power at low frequencies of current reversion, even in complex electrochemical systems, but is less useful at higher frequencies. Passivation can occur due to oxide formation, super-saturation of metal salts or depletion of complexing agents at the electrode surface. Furthermore, dissolution and desorption processes in the anodic period can have strong influence on the succeeding cathodic electrocrystallisation affecting preferred crystal orientation, intrinsic stress and current efficiency. A literature survey is combined with experiments from silver plating from a cyanide bath.

  • 129.
    Lekka, M.
    et al.
    University of Udine, Udine, Italy.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing. RISE Research Institutes of Sweden, Borås, Sweden.
    New European Training Network solving corrosion problems on micro- and nanoscale: mCBEEs2017In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 95, no 6, p. 297-298Article in journal (Other academic)
    Abstract [en]

    mCBEEs is an acronym for: Advanced integrative solutions to Corrosion problems beyond micro-scale: towards long-term durability of miniaturised Biomedical, Electronic and Energy systems. It is a doctoral student training network funded by the European Commission under the Marie Sklodowska-Curie Action scheme in the same way as the recently reported training network SELECTA that is focusing on smart electrodeposited alloys for environmentally sustainable applications.

  • 130. Leu, R.
    et al.
    Møller, Patrick
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Surface Treatment of Powder Metallurgical Compacts1995In: Sur/Fin '95: Baltimore, 1995Conference paper (Refereed)
  • 131. Lindgren, Mats
    et al.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Johansson, Alf
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Danielsson, Torkel
    Gunnarsson, Niklas
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Multi-disciplinary Approach to Design of a Power Electronics Module for Harsh Environments2009In: Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009: EuroSime 2009, 2009, p. 1-8Conference paper (Refereed)
    Abstract [en]

    A set of experimental and computer simulation methods has been applied to reliability analysis of a newly designed resin transfer molded power electronics module for automotive applications, comprising the glass-fiber epoxy multi-layer PCB, populated with various electronic packages. Evaluation of thermo-mechanical stability, determination of moisture ingress, and testing the adhesion quality between the molding compound and the module PCB have been performed along with investigation of heat transfer paths in the module. The experiments in harsh environments have revealed thermo-mechanical stability and acceptable moisture ingress for the module test samples with relatively large BGA components on the glass-fiber epoxy PCBs of different thickness and different solder mask types. Thermal images of the module have been obtained and the CFD model was created and validated with temperature measurements in power-on tests. Extreme heat dissipation modes have been studied by modeling.

  • 132.
    Lindgren, Mats
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Experimental Evaluation of Glob-top Materials for use in Harsh Environments2005In: Journal of Microelectronics and Electronic Packaging, ISSN 1551-4897, E-ISSN 1555-8037, Vol. 2, no 4, p. 253-268Article in journal (Refereed)
    Abstract [en]

    This article presents results of experimental evaluation of glob-top materials for multi-chip-modules (MCM) in harsh environments. Material and process tests have been performed with the purpose to find a material which would fulfill the reliability requirements for use e.g. in military or automotive applications. Seven polymer materials, i.e. four epoxies, two silicones and one polyurethane material have been selected and evaluated in the experiments. The most critical material and process parameters for glob-top have been identified and measured. Based on the experimental results, application-based scoring of studied epoxy materials has been performed. Material evaluation results have been summarized in conclusions about the most suitable glob-top material for use in harsh environments.

  • 133.
    Lindgren, Mats
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Thermal and thermo-mechanical analysis for design evaluation of an automotive radar module2004In: Quality and Reliability Engineering International, ISSN 0748-8017, E-ISSN 1099-1638, Vol. 20, no 7, p. 709-726Article in journal (Refereed)
    Abstract [en]

    The influence of the substrate technology, assembly method, and housing material on the thermal, thermo-mechanical and cost performance of a radar module for automotive applications has been studied to address the product reliability aspects during the design phase. Flip chip and wire bonding have been evaluated for Multi-Chip Module—Laminate/Deposition (MCM-L/D) and Multi-Chip Module—Deposition (MCM-D) substrate technologies used for electronic packaging solutions in a harsh environment. Solder ball and direct attachment have been investigated as second-level assembly. As a result of thermal and thermo-mechanical simulations and cost analysis, radar module designs combining MCM-D and MCM-L/D with wire bonding have been revealed, which are preferable for use in different temperature environments with respect to two performance criteria, the maximum junction temperature and the manufacturing cost. Simulation-based guidelines have been developed for designing radar modules used in automotive applications while satisfying temperature and stress constraints provided for the module.

  • 134.
    Lindgren, Mats
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Törnvall, Magnus
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Application of simulation-based decision making in product development of an RF module2007In: Microelectronics and reliability, ISSN 0026-2714, E-ISSN 1872-941X, Vol. 47, no 2-3, p. 302-309Article in journal (Refereed)
    Abstract [en]

    This paper presents results of simulation-based design evaluation for thermal and thermo-mechanical performance and cost of packaging technology of a RF module for automotive application. Combination of thermal, thermo-mechanical and cost analysis within the multi-attribute decision making enabled design ranking and revealed two MCM-L/D and MCM-D designs with wire bonding assembly preferred for use in automotive applications for different temperature environments. Simulation-based design guidelines were developed for designing electronic modules exhibiting good thermal and thermo-mechanical performance. By application-based partitioning of the importance weights assigned to the reliability and cost criteria, the guidelines were extended to cover other application areas.

  • 135.
    Lindgren, Mats
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Törnvall, Magnus
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Application of simulation-based decision making in product development of an RF module2004In: 5th IEEE conference in Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems: EuroSimE 2004, 2004, p. 233-240Conference paper (Refereed)
    Abstract [en]

    This paper presents results of simulation-based design evaluation for thermal and thermo-mechanical performance and cost of packaging technology of an RF module for automotive applications. A combination of thermal, thermo-mechanical and cost analysis within the multi-attribute decision making framework enabled design ranking and revealed two MCM-L/D (multi-chip module-laminate/deposition) and MCM-D (deposition) designs with the wire bonding assembly preferred for use in automotive applications for different temperature environments. Simulation-based design guidelines were developed for designing electronic modules exhibiting good thermal and thermo-mechanical performance. By application-based partitioning of the importance weights assigned to the reliability and cost criteria, the guidelines were extended to cover other application areas.

  • 136.
    Lindgren, Mats
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Poder, R.
    SP Technical Research Institute of Sweden A/S, Copenhagen, Denmark.
    Methods for predicting corrosion on electronic products2014In: Corrosion Engineering, Science and Technology, ISSN 1478-422X, E-ISSN 1743-2782, Vol. 49, no 7, p. 661-664Article in journal (Refereed)
    Abstract [en]

    Surface insulation resistance (SIR) measurements have become necessary to perform, especially due to the introduction of lead free solders. It has been reported that SIR and other test methods have to be used for evaluating the reliability of printed wiring boards. This paper presents an investigation on how the SIR test environment influences the test results. The factors varied were temperature and humidity. The temperature was varied between 40 and 85°C, and the relative humidity was varied between 60 and 85%. Furthermore, the influence of different types of process chemicals on SIR was evaluated. Seven lead free solder pastes, of which five were no-clean and two were water soluble, were compared. The influence of using conformal coating was also studied. These solder pastes were used to verify the developed method. A proper test method for SIR measurements is suggested in the paper, as well as a recommendation for use of conformal coating.

  • 137.
    Lindgren, Mats
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Tegehall, P-E.
    Factors influencing the surface insulation resistance2005In: IMAPS Nordic 2005: the IMAPS Nordic Annual Conference, Tönsberg, Norway, 2005 : 11-14 September 2005, 2005Conference paper (Refereed)
  • 138.
    Lindgren, Mats
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Meuwissen, M.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Simulation assisted investigation and improvement of the performance of an electronics assembly subjected to temperature cycling2005In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005: EuroSimE 2005, 2005, p. 269-276Conference paper (Refereed)
    Abstract [en]

    Numerical simulation techniques are used increasingly in the (re-)design of micro-electronics because of their time and cost saving potentials. The current paper describes the application of such techniques for analysing and improving the thermo-mechanical performance of an electronics assembly. An initial finite element model is implemented and its predictions are compared to measurements. Based on this comparison, the model is further refined by an improved assessment of the input to the model in the form of materials properties: the properties of the moulding compound, failure behaviour of the lead-compound interface and failure behaviour of the lead material itself. Finally an updated model is used to determine directions for improvement of the behaviour of the assembly design.

  • 139. Ludvigsson, M.
    et al.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Andersson, P.E.
    Dyreklev, P.
    Nilsson, D.
    Norberg, B.
    Grund-Bäck, L.
    Malmros, I.
    Falk, K.
    Clausén, U.
    Laminated display based on printed elelctronics2016In: Engineering Transparancy, 2016Conference paper (Refereed)
  • 140. Möller, Patrick
    et al.
    Fredenberg, M.
    Dainese, M.
    Aronsson, C.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Östling, M.
    Metal printing of copper interconnects down to 500 nm using ECPR: Electrochemical pattern replication2006In: Microelectronic Engineering, ISSN 0167-9317, E-ISSN 1873-5568, Vol. 83, no 4-9, p. 1410-1413Article in journal (Refereed)
    Abstract [en]

    rinting of copper patterns with dimensions from 100 μm down to 500 nm lines and 280 nm space was demonstrated using electrochemical pattern replication with a master electrode (template) having a pattern depth of 2500 nm. SEM measurements were done to measure the mean line width as well as CD variations on the master and the replicated copper lines. It was found that accurate replication of 500 nm thick metal patterns was enabled by the process and that CD variations in the master were dominating compared to the variations introduced by the electrochemical pattern transfer itself.

  • 141.
    Möller, Patrick
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Fredenberg, Mikael
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Dainese, M.
    Aronsson, C.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Östling, M.
    Metal Printing of Interconnects Down to 500 nm Using ECPR: ElectroChemical Pattern Replication2005Conference paper (Other academic)
  • 142.
    Möller, Patrick
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wiwen-Nilsson, P.
    Fredenberg, M.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Östling, M.
    Printing of Metal Interconnects for Microelectronics: the Electro Chemical Pattern Replication (ECPR) Project2004Conference paper (Other academic)
  • 143.
    Möller, Patrick
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wiwen-Nilsson, P.
    Fredenberg, M.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Montelius, L.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Östling, M.
    ElectroChemical Pattern Replication (ECPR): metal printing for microelectronics2004In: Sur/Fin Interfinish 2004: Chicago, 2004Conference paper (Other academic)
  • 144.
    Möller, Patrick
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wiwen-Nilsson, P.
    Fredenberg, Mikael
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Montelius, L.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Östling, M.
    ECPR – ElectroChemical Pattern Replication for direct metallization2003Conference paper (Other academic)
  • 145. Møller, Patrick
    et al.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Experiences from field corrosion test of zinc and zinc alloy coatings1996In: Sur/Fin '96: Cleveland, 1996Conference paper (Refereed)
  • 146. Møller, Patrick
    et al.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Tang, P.
    Computergestütztes Pulse Plating: (Computer Aided Pulse Plating)1995In: EAST-Conference 1995: Schwäbisch Gmünd, 1995Conference paper (Refereed)
  • 147.
    Mølmen, L.
    et al.
    RISE Research Institute of Sweden, Borås/Lund, Sweden.
    Alexandersson, A.
    RISE Research Institute of Sweden, Borås/Lund, Sweden.
    Leisner, P.
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing. RISE Research Institute of Sweden, Borås/Lund, Sweden.
    Surface technology should improve PEM fuel cell performance2019In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 97, no 3, p. 112-114Article in journal (Refereed)
    Abstract [en]

    Leading industrial nations are investing in hydrogen technology as energy storage solution with fuel cells as the main converter to electric energy. Improvements in the performance of the key components: electrode catalyst, bipolar plates and polymer electrolyte membrane are needed to reduce costs for mass-market introduction. Consequently, surface technology has an essential role in meeting the goals. 

  • 148. NabiRahni, D.
    et al.
    Tang, P.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    The Investigation and Characterisation of Cobalt Multilayer Metal Nanostructures1994In: Sur/Fin '94: Indianapolis, 1994Conference paper (Refereed)
  • 149. NabiRahni, D.M.A.
    et al.
    Tang, P.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    The electrolytic plating of compositionally modulated alloys and laminated metal nano-structures based on an automated computer-controlled dual-bath system1996In: Nanotechnology, ISSN 0957-4484, E-ISSN 1361-6528, Vol. 7, no 2, p. 134-143Article in journal (Refereed)
  • 150. Nielsen, C.
    et al.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Horsewell, A.
    On Texture Formation of Chromium Electrodeposits1998In: Journal of Applied Electrochemistry, ISSN 0021-891X, E-ISSN 1572-8838, Vol. 28, no 2, p. 141-150Article in journal (Refereed)
1234 101 - 150 of 196
CiteExportLink to result list
Permanent link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf