Change search
Refine search result
123 1 - 50 of 130
CiteExportLink to result list
Permanent link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Rows per page
  • 5
  • 10
  • 20
  • 50
  • 100
  • 250
Sort
  • Standard (Relevance)
  • Author A-Ö
  • Author Ö-A
  • Title A-Ö
  • Title Ö-A
  • Publication type A-Ö
  • Publication type Ö-A
  • Issued (Oldest first)
  • Issued (Newest first)
  • Created (Oldest first)
  • Created (Newest first)
  • Last updated (Oldest first)
  • Last updated (Newest first)
  • Disputation date (earliest first)
  • Disputation date (latest first)
  • Standard (Relevance)
  • Author A-Ö
  • Author Ö-A
  • Title A-Ö
  • Title Ö-A
  • Publication type A-Ö
  • Publication type Ö-A
  • Issued (Oldest first)
  • Issued (Newest first)
  • Created (Oldest first)
  • Created (Newest first)
  • Last updated (Oldest first)
  • Last updated (Newest first)
  • Disputation date (earliest first)
  • Disputation date (latest first)
Select
The maximal number of hits you can export is 250. When you want to export more records please use the Create feeds function.
  • 1.
    Arwidson, Jonas
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Thermal Fatigue Life Prediction of Solder Joints in Avionics by Surrogate Modeling: a Contribution to Physics of Failure in Reliability Prediction2013Doctoral thesis, comprehensive summary (Other academic)
    Abstract [en]

    Manufacturers of aerospace, defense, and high performance (ADHP) equipment are currently facing multiple challenges related to the reliability of electronic systems. The continuing reduction in size of electronic components combined with increasing clock frequencies and greater functionality, results in increased power density. As an effect, controlling the temperature of electronic components is central in electronic product development in order to maintain and potentially improve the reliability of the equipment. Simultaneously, the transition to lead-free electronic equipment will most probably propagate also to the ADHP industry. Compared to well-proven tin-lead solder, the knowledge about field operation reliability of lead-free solders is still limited, as well as the availability of damage evaluation models validated for field temperature conditions. Hence, the need to fill in several knowledge gaps related to reliability and reliability prediction of lead-free solder alloys is emphasized. Having perceived increasing problems experienced in the reliability of fielded equipment, the ADHP industry has suggested inclusion of physics-of-failure (PoF) in reliability prediction of electronics as one potential measure to improve the reliability of the electronic systems.

    This thesis aims to contribute to the development of reliable ADHP systems, with the main focus on electronic equipment for the aerospace industry. In order to accomplish this, the thesis provides design guidelines for power distribution on a double-sided printed circuit board assembly (PBA) as a measure to improve the thermal performance without increasing the weight of the system, and a novel, computationally efficient method for PoF-based evaluation of damage accumulation in solder joints in harsh, non-cyclic field operation temperature environments.

    Thermal fatigue failure mechanisms and state‑of‑the‑art thermal design and design tools are presented, with focus on the requirements that may arise from avionic use, such as low weight, high reliability, and ability to sustain functional during high vibration levels and high g-forces. Paper I, II, and III describes an in-depth investigation that has been performed utilizing advanced thermal modeling of power distribution on a double-sided PBA as a measure to improve the thermal performance of electronic modules.

    Paper IV contributes to increasing the accuracy of thermal fatigue life prediction in solder joints, by employing existing analytical models for predicting thermal fatigue life, but enhancing the prediction result by incorporating advanced thermal analysis in the procedure.

    Papers V and VI suggest and elaborate on a computational method that utilizes surrogate stress and strain modeling of a solder joint, to quickly evaluate the damage accumulated in a critical solder joint from non-cyclic, non-simplified field operation temperature profiles, with accuracy comparable to finite element modeling. The method has been tested on a ball grid array package with SnAgCu solder joints. This package is included in an extensive set of accelerated tests that helps to qualify certain packages and solder alloys for avionic use. The tests include -20°C to +80°C and -55°C to +125°C thermal cycling of a statistically sound population of a number of selected packages, assembled with SnAgCu, Sn100C, and SnPbAg solder alloys. Statistical analysis of the results confirms that the SnAgCu-alloy may outperform SnPbAg solder at moderate thermal loads on the solder joints.

    In Papers VII and VIII, the timeframe is extended to a future, in which validated life prediction models will be available, and the suggested method is expected to increase the accuracy of embedded prognostics of remaining useful thermal fatigue life of a critical solder joint.

    The key contribution of the thesis is the added value of the proposed computational method utilized in the design phase for electronic equipment. Due to its ability for time-efficient operation on uncompressed temperature data, the method gives contribution to the accuracy, and thereby also to the credibility, of reliability prediction of electronic packages in the design phase. This especially relates to applications where thermal fatigue is a dominant contributor to the damage of solder joints.

  • 2. Bakowski, M.
    et al.
    Nee, H.-P.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    High temperature electronic systems all in silicon carbide (SiC) for electric vehicles2011In: Workshop för 'Banbrytande IKT 2007, VINNOVA, Stockholm, 1 September 2011, 2011Conference paper (Other academic)
  • 3. Bakowski, Mietek
    et al.
    Nee, Hans-Peter
    Zetterling, Carl-Mikael
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    High temperature electronic systems all in silicon carbide for hybrid and electrical vehicles2015In: International SiC Power Electronics Applications Workshop, ISiCPEAW 2015, 2015Conference paper (Other academic)
  • 4.
    Belov, I.
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Alavizadeh, Z.
    Lindgren, M.
    Application of engineering optimization to evaluate heating-based humidity management in electronics enclosures2011In: Electronic Environment Konferens & Mässa 2011, Stockholm Älvsjö,5-6 April 2011, Invited speech, 2011, p. 161-162Conference paper (Other academic)
  • 5.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Anti-Moisture Methodology for Electronics Enclosures in Harsh Storage Environments2008Conference paper (Other academic)
  • 6.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Evaluation of Anti-Moisture Measures in Electronics Enclosure: Application of CFD Modelling2009Conference paper (Other academic)
  • 7.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Humidity Management in Electronics Enclosure under Severe Climatic Conditions2008Conference paper (Other academic)
  • 8.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Optimization of PCB Heater Heating Profile for Power-efficient Humidity Management in Electronics Enclosures: OPTIMUS Worldwide User Meeting 2010, Antwerp, Belgium, November 22-23, 20102010Other (Other academic)
  • 9.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing. Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Reliability study of GaN HEMTs2016Conference paper (Other academic)
  • 10.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Simulering av ytbeläggning på gjutna komponenter2015In: Gjuteriet, no 8, p. 49-Article in journal (Other (popular science, discussion, etc.))
    Abstract [sv]

    Inom forskningsområdet Ytteknik används modellering och simulering bland annat för att analysera ytbeläggningsprocesser på komplexa geometrier. Detta är ett multidisciplinärt område som täcker bl.a. elektrokemi, jontransport och Computational Fluid Dynamics (CFD) för beräkningar av strömningsfenomen. Numeriska modelleringsverktyg används i utformandet av processen för att optimera processparametrar både med avseende på ytbeläggningens struktur och förbättrad fördelning av ytbeläggningen. Genom M-ERA projektet som finansierats av VINNOVA har en modell tagits fram för att beskriva ytbeläggning av silver av ett gjutet radiofilter i en silvercyanidlösning. Med målet att ha en minsta ytbeläggningstjocklek på 1 μm har både den elektriska strömmen och ytbeläggningstiden varierats för att uppnå en jämn ytbeläggning och minska förbrukningen av silver. Med hjälp av mätningar på komponenter har man även kunnat validera modellerna.

  • 11.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Arwidson, Jonas
    Saab.
    Poder, Ralf
    SP Technical Research Institute of Sweden.
    Johannesson, Pär
    SP Technical Research Institute of Sweden.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    The effect of variations in temperature cycling profile and mechanical properties of solder on thermo-mechanical reliability of a lead-free BGA package2015In: Proceedings of the 16th International Conference IEEE EuroSimE 2015, Piscataway: IEEE Press, 2015, p. 165-169Conference paper (Refereed)
    Abstract [en]

    The paper investigates the effect of variations both in temperature cycling profile and in SAC305 solder Young's modulus in the PBGA256 package on the thermo-mechanical reliability. FE simulations quantify the effect of cycle reduction and counting techniques by introducing different temperature profiles having identical dwell- and period time characteristics. A difference of 30% in predicted accumulated creep strain energy density per cycle has been determined for the studied profiles. Under the provided modelling assumptions and simplifications, the maximum variation of the thermal fatigue life of SAC305 solder joints is within 30% as the result of experimentally determined Young's modulus variation in as-delivered packages.

  • 12.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Arwidson, Jonas
    Poder, Ralf
    Johannesson, Pär
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Thermal fatigue life prediction: consequences of cycle reduction and material property variation2016Conference paper (Other academic)
  • 13.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bespalov, Michail
    Klochkova, Ludmila
    Kuleshov, Alexander
    Suzan, Dmitriy
    Tishkin, Vladimir
    Транспортная модель распространения газообразных примесей в атмосфере города = Transport model of gas impurities spread processes in urban area2000In: Математическое моделирование: (Mathematical Modelling), ISSN 0234-0879, Vol. 12, no 11, p. 38-46Article in journal (Refereed)
  • 14.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bespalov, Michail
    Klochkova, Ludmila
    Pavlova, Natalya
    Suzan, Dmitriy
    Tishkin, Vladimir
    Сравнение моделей распространения загрязнений в атмосфере = Comparative Analysis of models of pollutions spreading in atmosphere1999In: Математическое моделирование: (Mathematical Modelling), ISSN 0234-0879, Vol. 11, no 8, p. 52-64Article in journal (Refereed)
  • 15.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Chedid, Michel
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Investigation of Snap-on Feeding Arrangements for a Wearable UHF Textile Patch Antenna2008In: Ambience 08 International Scientific Conference: proceedings 2008 : smart textiles - technology and design : Borås, Sweden / [ed] Lars Hallnäs, Pernilla Walkenström, Lennart Wasling, Borås: Centrum för textilforskning (CTF), The Swedish School of Textiles, University College of Borås , 2008, p. 84-88Conference paper (Refereed)
  • 16.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Jarfors, Anders E.W
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing – Casting.
    Simulering av prestandan hos rheogjutna kylflänsar2016In: Gjuteriet, ISSN 0017-0682, no 6, p. 49-Article in journal (Other academic)
  • 17.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Johansson, Alf
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Danielsson, Torkel
    Sarius, Niklas
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Thermal Analysis of a Power Electronics Module in the Prototyping Phase2009In: Electronic Environment, no 4, p. 6-9Article in journal (Other academic)
  • 18.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bergner, Fredrik
    Bornoff, Robin
    CFD aided reflow oven profiling for PCB preheating in a soldering process2007In: Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems: EuroSimE 2007, Piscataway, NJ.: IEEE , 2007, p. 535-542Conference paper (Refereed)
    Abstract [en]

    A CFD-aided reflow oven profile prediction algorithm has been developed and applied to modelling of preheating of a PCB with non-uniform distribution of component thermal mass in a forced air convection solder reflow oven. The iterative algorithm combines an analytic approach with CFD modelling. It requires an experimentally validated CFD model of the solder reflow oven and a CFD model of the PCB as main inputs. Results of computational experiments have been presented to reveal good agreement between predicted PCB profiles and corresponding CFD calculations. Application guidelines contained in the description of the algorithm will assist potential users both during the virtual prototyping phase of a PCB including designing for assembly and in the phase of reflow oven profiling.

  • 19.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bergner, Fredrik
    Bornoff, Robin
    CFD aided reflow oven profiling for PCB preheating in a soldering process: Part 1(2)2007In: Electronic Environment, no 3, p. 25-28Article in journal (Other academic)
  • 20.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bergner, Fredrik
    Bornoff, Robin
    CFD aided reflow oven profiling for PCB preheating in a soldering process: Part 2(2)2007In: Electronic Environment, no 4, p. 25-27Article in journal (Other academic)
  • 21.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Ryden, Jan
    Alavizadeh, Zahra
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    CFD Assisted Design Evaluation and Experimental Verification of a Logic-Controlled Local PCB Heater for Humidity Management in Electronics Enclosure2010In: IEEE EuroSimE 2010, 26-28 April, Bordeaux, France, 2010Conference paper (Refereed)
    Abstract [en]

    Humidity management of commercial-of-the-shelf electronic components in non-controlled climatic environments can be realized e.g. by introducing a local printed circuit board heater. By choosing appropriate size and location of the heater plate in the vicinity of the critical electronic packages, and utilizing logic control function, it is possible to improve the quality of local humidity management and reduce power consumption of the heater, which is important especially in case of battery driven portable or vehicle mounted devices. A computational fluid dynamics assisted methodology has been developed to determine the best feasible design of the heater, followed by experimental verification of the constructed logic controlled heater. The experiment has been performed in a harsh climatic environment including temperature variation from +33°C to +40°C, and relative humidity variation from 54% to 80%. Analysis of the experimental %RH and temperature curves as well as power profile of the heater has confirmed the feasibility of the chosen approach to maintain greater than 9°C difference between the electronics package surface temperature and the local dew point temperature, by applying discrete power pulses with the amplitude less than 6 W.

  • 22.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Payandeh, Mostafa
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing – Casting.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Jarfors, Anders E.W.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing – Casting.
    Wessen, Magnus
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing – Casting.
    Effect of fillets on heat transfer in a rheocast aluminium heatsink2016In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), IEEE, 2016Conference paper (Refereed)
    Abstract [en]

    The effect of fillets formed between the base and plate fins of rheocast aluminium heatsinks on the thermal resistance of the heatsinks has been quantified by simulation. Simulation methodology, including sequential optimization has been developed in order to determine hotspot distributions where the fillets have the maximum effect. Combination of different fillet dimensions with various base thickness levels and aluminium alloys having inhomogeneous thermal conductivity have been investigated. For the studied cases, the effect of fillets on heatsink thermal resistance differs from negligible to 6%. The results would guide thermal designers on contribution of fillets to the heat transfer in multi-fin heatsinks for natural convection.

  • 23.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Rydén, Jan
    Lindblom, Joakim
    Zhang, Yafan
    Hansson, T
    Bergner, Fredrik
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Application of CFD Modelling for Energy Efficient Humidity Mangement of an Electronics Enclosure in Storage under Severe Climatic Conditions2008In: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008: EuroSimE 2008., IEEE , 2008, p. 430-437Conference paper (Refereed)
    Abstract [en]

    A CFD modelling methodology including experimental validation has been developed and applied for investigation of anti-moisture measures in a non- hermetic electronics enclosure containing a number of printed circuit boards, and placed in a severe storage environment. In the climatic test the temperature and the relative humidity have been varried from +33degC to +71degC and from 14% to 80%, respectively. Enclosure heater solutions have been parametrically studied by simulation. A heating strategy involving various power levels has been determined, which is just sufficient to maintain the internal relative humidity below 60%, thereby reducing the risk for dew formation on the electronics assembly.

  • 24.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wingbrant, Helena
    Spetz, Anita-Lloyd
    Sundgren, Hans
    Thuner, Bo
    Svenningstorp, Henrick
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Thermal and flow analysis of SiC-based gas sensors for automotive applications2004In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004: EuroSimE 2004., IEEE , 2004, p. 475-482Conference paper (Refereed)
    Abstract [en]

    Different block and tube mounting alternatives for SiC-based gas sensors were studied by means of temperature measurements and simulation of heat transfer and gas flow for steady state conditions. The most preferable tube mounting design was determined. Simulation-based guidelines were developed for designing tube-mounted gas sensors in the exhaust pipes of diesel and petrol engines, taking into account thermal constraints and flow conditions.

  • 25.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wingbrant, Helena
    Spetz, Anita-Lloyd
    Sundgren, Hans
    Thuner, Bo
    Svenningstorp, Henrik
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    CFD analysis of packaging and mounting solutions for SiC-based gas sensors in automotive applications2006In: Sensor Letters, ISSN 1546-198X, Vol. 4, no 1, p. 29-37Article in journal (Refereed)
    Abstract [en]

    Simulation-based guidelines were developed for designing tube-mounted gas sensors in the exhaust pipes of diesel and petrol engines, taking into account thermal constraints and gas flow conditions. Different block and tube mounting alternatives for SiC-based gas sensors were studied by means of temperature measurements and simulation of steady state heat transfer and gas flow. Design variables included the number of fins in the heat sink mounted on the inlet tube, the inlet construction, the mounting tube orientation, and the micro-heater substrate placement inside the mounting tube. The most preferable tube mounting design was determined with respect to the thermal performance of the sensor structure and with respect to the gas flow parameters, which are important for the sensor's selectivity, sensitivity and response time.

  • 26.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Edström, Curt
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Finite element modeling of silver electrodeposition for evaluation of thickness distribution on complex geometries2016In: Materials & design, ISSN 0264-1275, E-ISSN 1873-4197, Vol. 90, p. 693-703Article in journal (Refereed)
    Abstract [en]

    The paper reveals benefits of multi-disciplinary computer simulation and parametric studies in the design of silver plating process for improved coating distribution. A finite element model of direct current silver plating is experimentally validated for an Assaf panel without agitation. The model combines tertiary current distribution with Butler–Volmer electrode kinetics and computational fluid dynamics at a very low flow-rate. The effect of charge transfer coefficients on the throwing power of the process is quantified for the studied geometry, and variation of cathodic current density and exchange current density is investigated. A simpler model based on secondary current distribution is employed to quantify the effect of electrolyte conductivity on the throwing power of the process. A model combining tertiary current distribution and computational fluid dynamics has been developed and experimentally validated for simulation of complex telecom component electroplating in agitated electrolyte. The effect of current density on the process throwing power is quantified. Recommendations regarding modeling methodology and the effect of electrochemical and process parameters on the thickness distribution have been developed.

  • 27.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Edström, Curt
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Simulation based investigation of silver plating process parameters and their effect on throwing power2015In: International Conference EAST Forum 2015, Lund, June 25-26, 2015., 2015Conference paper (Refereed)
  • 28.
    Belov, Vladimir
    et al.
    Mordovian State Univ., Saransk, Russia.
    Butkina, Anna
    Mordovian State Univ., Saransk, Russia.
    Bolschikov, Feodor
    Convertor Ltd., Saransk, Russian Federation.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Power quality and EMC solutions in micro grids with energy-trading capability2014In: Proceedings of the international symposium on electromagnetic compatibility, EMC Europe, 1-4/9, 2014, Gothenburg, Sweden, Piscataway, N.J.: IEEE Press, 2014, p. 1203-1208Conference paper (Refereed)
    Abstract [en]

    A mathematical model of an AC/DC/AC power converter with an energy storage device has been developed on the basis of a bridge-element concept, that can be employed in the design phase for power quality and conducted emission analysis ofmicro grids. A prototype of a 5 kW AC/DC/AC power converter is built and a mockup of electric energy trading system is realized. Measurements conducted for three operating modes emulating electric energy transfer and power consumption intrading conditions have revealed a low voltage total harmonic distortion, not exceeding 1.3% for the tested cases.

  • 29. Belov, Vladimir
    et al.
    Shamaev, Alexey
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Mannikoff, Anders
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Mathematical Model of Electric Power Conversion System - Experimental Validation and Evaluation of Parallel ComputingIn: Electric power components and systems, ISSN 1532-5008, E-ISSN 1532-5016Article in journal (Refereed)
  • 30. Casselgren, J.
    et al.
    Hällstig, E.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    True Ground Speed Sensor (TGSS)2009Conference paper (Other academic)
  • 31. Chedid, Michel
    et al.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Experimental Analysis and Modelling of Textile Transmission Line for Wearable Applications2007In: International Journal of Clothing Science and Technology, ISSN 0955-6222, E-ISSN 1758-5953, Vol. 19, no 1, p. 59-71Article in journal (Refereed)
    Abstract [en]

    Purpose – The paper seeks, by means of measurement and modelling, to evaluate frequency dependent per-unit-length parameters of conductive textile transmission line (CTTL) for wearable applications and to study deterioration of these parameters when CTTL is subjected to washing.

    Design/methodology/approach – The studied transmission line is made of Nickel/Copper (Ni/Cu) plated polyester ripstop fabric and is subjected to standard 60°C cycle in a commercial off-the-shelf washing machine. The per-unit-length parameters (resistance and inductance) and characteristic impedance of the line are extracted from measurements before and after washing. Using the measurement data an equivalent circuit is created to model the degradation of the line. The circuit is then integrated in a three-dimensional transmission line matrix (TLM) model of the transmission line.

    Findings – Both an electrical equivalent circuit and a TLM model are developed describing the degradation of the conductive textile when washed. A severe deterioration of the electrical parameters of the line is noticed. Experimental and modelling results are in good agreement in the addressed frequency band.

    Research limitations/implications – Analysis is performed for frequencies up to 10?MHz. The developed TLM model can be used to conduct parametric studies of the CTTL. To counteract the degradation of the line, protective coating is to be considered in further studies.

    Originality/value – This paper extends knowledge of the subject by experimental and simulation-based characterization of the CTTL when subjected to washing cycles.

  • 32. Chedid, Michel
    et al.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Modelling and Characterization of Electrostatic Current Noise Induced Mechanically in Wired Wearable Applications2010In: Journal of Electrostatics, ISSN 0304-3886, E-ISSN 1873-5738, Vol. 68, no 1, p. 21-26Article in journal (Refereed)
    Abstract [en]

    By means of statistical modelling and measurement, the triboelectric current noise spectral density is evaluated for shielded cables in body-borne wired network subjected to mechanical stresses. Assuming a shot noise model, an expression for the current spectral density of the noise is derived. The efficiency of the methodology is demonstrated by measuring the triboelectric current noise in two shielded cables subjected to bending. Thereafter the parameters of the noise pulses' waiting time and amplitude probability density functions are extracted from measurement, thus enabling the computation of the current spectral density of the noise induced mechanically in body-borne wired networks.

  • 33.
    Chedid, Michel
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Tomicic, Daniel
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Evaluation of Conductive Textile for Wearable Computer Applications2006In: The IMAPS Nordic Annual Conference, 2006, p. 220-227Conference paper (Refereed)
    Abstract [en]

    Wearable systems put high demands on wearability and robustness. Conductive fabrics are very likely to be used in wearable systems due to their textile-like characteristics. However conductive fabrics must be able to resist environmental stresses (wearing, laundering, etc.) in the same way as clothing in order to fully comply with the requirements.

    A demonstrator, TxWear, was constructed to exploit conductive fabrics in building a conductive textile transmission line for intermodular communication and power transmission (DC power line communication bus), thus eliminating the need for cables between the modules. The hardware modules are connected to the conductive line through connectors from textile industry, i.e., snap fasteners. Different types of conductive fabrics (Ni/Cu plated polyester fabrics and stainless-steel based elastic ribbon) were evaluated and compared according to their conductivity, flexibility and robustness characteristics. The effect of washing on the electrical properties (per-unit-length parameters) of the textile transmission line was studied. Different coating processes, i.e., parylene and silicone coating, were studied and evaluated in order to isolate and enhance the robustness of the conductive textile. Ni/Cu plated polyester ripstop fabric was found to be not appropriate for wearable applications, while conductive elastic ribbon showed good robustness to laundry induced stresses.

  • 34.
    Davidsson, Karin
    et al.
    SP, Technical Research Institute of Sweden.
    Karlsson, Ingvar
    SP, Technical Research Institute of Sweden.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Bobert, Magnus
    SP, Technical Research Institute of Sweden.
    Blomqvist, Per
    SP, Technical Research Institute of Sweden.
    Safety test methods for EV batteries2010In: World Electric Vehicle Journal, ISSN 2032-6653, Vol. 4, p. 414-420Article in journal (Refereed)
    Abstract [en]

    The aim of the present paper is to share our experience in battery safety testing and risk analysis from arecent project called BLIXT, which had the objective to speed up the progress of the paradigmatic shifttoward electric vehicles (EV). The batteries in question have been three different configurations of lithiumionbatteries (LiFePO4). The tests have involved fire, crash tests and sort circuit.

  • 35. Deflorian, F.
    et al.
    Rossi, S.
    Fedel, M.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Ambrosi, D.
    Hlede, E.
    Crevice corrosion study in marine environment of different materials for propulsion applications2014In: Proceedings of 19th Int. Corrosion Congress, Nov. 2-6, 2014, Jeju, Korea, 2014Conference paper (Refereed)
  • 36. Fast, Lars
    et al.
    Lang, Jenny
    Nygren, K.
    Bodén, A.
    Ofstad, A.B.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Successful Development of Coating for Bipolar Plates for Proton exchange Membrane Fuel Cell2015Conference paper (Refereed)
  • 37. Fedel, M.
    et al.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Rossi, S.
    Al2O3 and AlN atomic layer deposited coatings for the corrosion protection of silver and stainless steel substrates2014In: Proceedings of 28th Int. Conf. on Surface Modification Technologies, 16-18 June, 2014, Tampere, Finland, Tampere University of Technology, 2014Conference paper (Refereed)
  • 38. Fredenberg, Mikael
    et al.
    Möller, Patrick
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Simulation of copper deposition by electrochemical pattern replication2009In: Timitikos Tomos sti mnimn toi Kathijiti Nikolaoi Spirelli: [¨Honorary volume dedicated to the memory of professor Nicolas Spyrellis] / [ed] P. Gyftou & E. Pavlatou, Athina: Ethniko Metsivio Polytechneio , 2009, p. 153-160Chapter in book (Other academic)
  • 39. Fredenberg, Mikael
    et al.
    Möller, Patrick
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Östling, M.
    Recent Progress in the Development of ECPR (ElectroChemical Pattern Replication) Metal Printing for Microelectronics2005Conference paper (Other academic)
  • 40.
    Gunnarsson, Niklas
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Hald, J
    Hultman, L
    Influence of Ultrasound on filling of Grooves during Ni Electrodeposition2009Conference paper (Other academic)
  • 41. Gunnarsson, Niklas
    et al.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wang, X.
    Svensson, M.
    Vieider, C.
    Hultman, L.
    Electrochemically based low-cost high precision processing in MOEMS packaging2009In: Electrochimica Acta, ISSN 0013-4686, E-ISSN 1873-3859, Vol. 54, no 9, p. 2458-2465Article in journal (Refereed)
    Abstract [en]

    Precision processing in MOEMS (micro-opto-electromechanical systems) packaging has been studied based on electrochemical processes with the purpose of establishing technology for low-cost multifunctional encapsulation of microsystems and assembly of opto-electric access links in polymer.

    The electrochemically based processes studied in this paper include:

    1.Electroforming of a polymer moulding tool (stamper) in a nickel sulphamate electrolyte on a high-precision 3D etched silicon template.

    2.Patterning of 3D surfaces by an electrophoretic photoresist.

    3.Precision plating of Au and Sn for self-alignment of chips by eutectic Au–Sn solder.

    The results show that nickel stampers with adequately low internal stress can be electroformed on 3D silicon wafers. Furthermore, 3D polymer samples manufactured by the nickel stampers can be patterned with metal lines down to 20 μm width using electrophoretic photoresist. Finally, eutectic Au–Sn solder bumps are realized by electroplating of Au and Sn followed by reflowing, satisfying the demands on dimension and alloy composition control over a 4 in. Si wafer.

  • 42.
    Gunnarsson, Niklas
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wang, X.
    Svensson, M.
    Vieider, C.
    Hultman, L.
    Low-cost high precision processing in MEMs packaging based on electrochemical processes2007Conference paper (Other academic)
  • 43.
    Hansal, W.E.G.
    et al.
    Happy Plating, Austria.
    Sandalache, G.
    Happy Plating, Austria.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Pulse-electrodeposited NiP-SiC composite coatings2013In: Electrochimica Acta, ISSN 0013-4686, E-ISSN 1873-3859, Vol. 114, p. 851-858Article in journal (Refereed)
    Abstract [en]

    This paper describes the effect of modulated bipolar current (pulse reverse plating) on the incorporation of micron and submicron sized SiC particles within an electrodeposited Ni–P alloy matrix (dispersion coating). Based on electrochemical measurements, a pulse plating process has been defined and the effects of pulse parameters (type of current, frequency of current pulses and current density), the electrolyte composition and the size of the silicon carbide on the particles incorporation rate, phosphorus co-deposition rate, surface morphology, structure, micro hardness and wear resistance of the deposits has been investigated.

    The experimental results show that the phosphorus co-deposition and the particles incorporation rate decrease applying higher current density. The reduction of particle size decreases the co-deposition content of the particles within the coating. Application of pulsed current leads to a more compact composite coating, significantly improving the hardness and the tribological behaviour of the Ni/SiC deposits, mainly at higher frequency of the applied current pulses. DC and bipolar pulses generate unfavourable higher co-deposition rate of phosphorus, hence a loss in hardness has been observed. Tailored shift of the properties and alloy composition during the deposition process can be achieved by change of matrix properties via alternation of the pulse sequences.

  • 44.
    He, Kaifei
    et al.
    Jönköping University, School of Engineering, JTH, Industrial Engineering and Management. Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Industrial Production.
    Jin, Man
    Jönköping University, School of Engineering, JTH, Industrial Engineering and Management.
    Cyber-Physical systems for maintenance in Industry 4.02016Independent thesis Advanced level (degree of Master (Two Years)), 80 credits / 120 HE creditsStudent thesis
    Abstract [en]

    As two emerging terms in industry field, “Industry 4.0” and “Cyber-Physical System” have attracted an increasing amount of attention from both researchers and manufactures. Available advanced technologies brought by these terms, offers possible solutions and improvements for future maintenance. The purpose of the thesis is to identify how Industry 4.0 integrates with Cyber-Physical Systems regarding maintenance management and the requirements for companies to reach the ideal smart factory. Two researcher questions were studied to fulfill the purpose. Firstly, identifying the integration between Industry 4.0 and CPS regarding maintenance functions. Secondly, to investigate how such integration contribute to maintenance management in an ideal future factory.

  • 45. Helbo, C.
    et al.
    Møller, Patrick
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Acreo.
    The use of mathematical modelling in optimisation of the pulse plating of copper on printed circuit boards2000Conference paper (Other academic)
  • 46.
    Johansson, J.
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Belov, I.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Johnson, E.
    Leisner, P.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    An approach to life consumption monitoring of solder joints in operating temperature environment2012In: Proceedings of 13th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, Cascais, Portugal, April 16-17-18, 2012, IEEE, 2012, p. -8Conference paper (Refereed)
    Abstract [en]

    This paper elaborates the 3T-approach to life consumption monitoring of solder joints in operating temperature environment without requiring simplification of operating loads. An overview of the 3T-approach is provided including assumptions made for a proposed realization in an avionic application. Associated implementation routines are highlighted and exemplified for a lead-free PBGA256 package with creep strain energy density (SEDcr) as damage metric. Factors that affect the prediction accuracy are investigated. A data resolution has been determined that delivers response surfaces that provide results comparable to 3-D finite-element (FE) simulations, while bearing two orders of magnitude higher computational efficiency. A stress-free temperature modification routine is proposed and proves to further mitigate accuracy problems.

  • 47.
    Johansson, Jonas
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Johnson, Erland
    SP Technical Research Institute of Sweden, Borås, Sweden.
    Dudek, Rainer
    Fraunhofer ENAS, Micro Materials Center, Chemnitz, Germany.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments2014In: Microelectronics and reliability, ISSN 0026-2714, E-ISSN 1872-941X, Vol. 54, no 11, p. 2523-2535Article in journal (Refereed)
    Abstract [en]

    Thermal cycling tests have been performed for a range of electronic components intended for avionic applications, assembled with SAC305, SN100C and SnPbAg solder alloys. Two temperature profiles have been used, the first ranging between −20 °C and +80 °C (TC1), and the second between −55 °C and +125 °C (TC2). High level of detail is provided for the solder alloy composition and the component package dimensions, and statistical analysis, partially supported by FE modeling, is reported. The test results confirm the feasibility of SAC305 as a replacement for SnPbAg under relatively benign thermomechanical loads. Furthermore, the test results serve as a starting point for estimation of damage accumulation in a critical solder joint in field conditions, with increased accuracy by avoiding data reduction. A computationally efficient method that was earlier introduced by the authors and tested on relatively mild temperature environments has been significantly improved to become applicable on extended temperature range, and it has been applied to a PBGA256 component with SAC305 solder in TC1 conditions. The method, which utilizes interpolated response surfaces generated by finite element modeling, extends the range of techniques that can be employed in the design phase to predict thermal fatigue of solder joints under field temperature conditions.

  • 48.
    Johansson, Jonas
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Electronic Defence Systems, Saab AB, Jönköping, Sweden.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Johnson, Erland
    SP Technical Research Institute of Sweden, Borås, Sweden.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. SP Technical Research Institute of Sweden, Borås, Sweden.
    A computational method for evaluating the damage in a solder joint of an electronic package subjected to thermal loads2014In: Engineering computations, ISSN 0264-4401, E-ISSN 1758-7077, Vol. 31, no 3, p. 467-489Article in journal (Refereed)
    Abstract [en]

    Purpose – The purpose of this paper is to introduce a novel computational method to evaluate damage accumulation in a solder joint of an electronic package, when exposed to operating temperature environment. A procedure to implement the method is suggested, and a discussion of the method and its possible applications is provided in the paper.

    Design/methodology/approach – Methodologically, interpolated response surfaces based on specially designed finite element (FE) simulation runs, are employed to compute a damage metric at regular time intervals of an operating temperature profile. The developed method has been evaluated on a finite-element model of a lead-free PBGA256 package, and accumulated creep strain energy density has been chosen as damage metric.

    Findings – The method has proven to be two orders of magnitude more computationally efficient compared to FE simulation. A general agreement within 3 percent has been found between the results predicted with the new method, and FE simulations when tested on a number of temperature profiles from an avionic application. The solder joint temperature ranges between +25 and +75°C.

    Practical implications – The method can be implemented as part of reliability assessment of electronic packages in the design phase.

    Originality/value – The method enables increased accuracy in thermal fatigue life prediction of solder joints. Combined with other failure mechanisms, it may contribute to the accuracy of reliability assessment of electronic packages.

  • 49.
    Johansson, Jonas
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    An experimental setup for validating a CFD model of a double-sided PCB in a sealed enclosure at various power configurations2005In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005: EuroSimE 2005, Piscataway, NJ: IEEE Order Department , 2005, p. 127-133Conference paper (Refereed)
    Abstract [en]

    A flexible experimental setup enabling power control of a fully populated double-sided PCB has been realized, and is described in detail. A CFD model of a double-sided PCB housed in a sealed enclosure has been validated in a 19/spl deg/C environment by means of temperature and flow measurement. The difference between simulated and measured component temperatures has been within 10%. Potential errors both in the model and in the experiments have been discussed and their impact on temperatures has been numerically evaluated.

  • 50.
    Johansson, Jonas
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    CFD Analysis of an Avionic Module for Evaluating Power Distribution as a Thermal Management Measure for a Double-sided PCB2007In: Twenty Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium: SEMI-THERM Proceedings 2007, San Jose, CA USA, March 18-22, 2007, Piscataway, N.J.: IEEE , 2007, p. 233-243Conference paper (Refereed)
    Abstract [en]

    Thermal design aspects of an avionic module including fully populated PCBs housed in a sealed enclosure have been studied by means of computational fluid dynamics. Effect of power distribution between the sides of a double-sided PCB on the case temperature of surface-mounted components has been investigated within a proposed simulation strategy. Simulation-based guidelines have been developed for thermal design of avionic modules, regarding preferable power configuration on a double-sided PCB, representing an alternative approach to thermal management, as compared to introducing additional cooling devices.

123 1 - 50 of 130
CiteExportLink to result list
Permanent link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf