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  • 1.
    Ahmadkhaniha, Donya
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Huang, Y.
    University of Southampton, Southampton, UK.
    Jaskari, M.
    University of Oulu, Nivala, Finland.
    Järvenpää, A.
    University of Oulu, Nivala, Finland.
    Heydarzadeh Sohi, M.
    University of Tehran, Tehran, Iran.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
    Karjalainen, L.P.
    University of Oulu, Oulu, Finland.
    Langdon, T.G.
    University of Southampton, Southampton, UK..
    Effect of high-pressure torsion on microstructure, mechanical properties and corrosion resistance of cast pure Mg2017Conference paper (Refereed)
    Abstract [en]

    High-pressure torsion (HPT) processing was applied to cast pure Mg pieces and its effects on microstructure, hardness and tensile properties as well as corrosion resistance were evaluated. The microstructure of the processed samples was examined by electron backscatter diffraction (EBSD) and the mechanical properties were determined by microhardness and tensile tests. Corrosion resistance of the samples was studied via electrochemical impedance spectroscopy (EIS) in 3.5% NaCl solution. The results showed that HPT refined the grain size of Mg very effectively from millimeters in the cast structure to a few micrometers homogeneously through the thickness and created a basal texture on the surface. One or five turns of HPT produced no significant difference in the grain size of the processed Mg but the hardness was a maximum after one turn. The yield strength of the cast Mg was increased by seven times whereas the corrosion resistance was not affected by the HPT processing.

  • 2.
    Ahmadkhaniha, Donya
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Pinate, Santiago.
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
    Leisner, P.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. RISE Research Institute of Sweden, Borås.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
    Electrodeposition of Ni high P composite coatings containing nano and submicro ceramic particles2017Conference paper (Other academic)
    Abstract [en]

    In this study, electrodeposition of Ni-P composite coatings has been carried out to investigate the possibility of replacing hard chromium coatings. Therefore, electrodeposition of Ni-P based composite coating with different SiC particle size (50 nm, 100 nm and 500 nm) or B4C (500 nm) was performed. The coating’s composition was evaluated by energy dispersive spectroscopy (EDS), microhardness of the coatings was measured by Vickers indentor and polarization measurements were carried out to study the corrosion behavior of the coatings. The results showed that B4C particles can codeposit in higher percent respect to SiC ones. Ceramic particles increased microhardness of Ni-P coatings to 700HV0.01. The polarization behavior of all the coatings in 3.5% NaCl was similar in as plated state proving that particles did not hindered the passive behaviour. Finally, the effect of heat-treatment (at 400 ºC for 1 hour) on the coating’s properties was studied to compare the contribution of particles and heat-treatment on mechanical and corrosion properties of the coatings. Heat-treatment increased the coating’s microhardness and changed the anodic polarization behavior of the coatings respect to the as plated conditions.

  • 3.
    Arwidson, Jonas
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Thermal Fatigue Life Prediction of Solder Joints in Avionics by Surrogate Modeling: a Contribution to Physics of Failure in Reliability Prediction2013Doctoral thesis, comprehensive summary (Other academic)
    Abstract [en]

    Manufacturers of aerospace, defense, and high performance (ADHP) equipment are currently facing multiple challenges related to the reliability of electronic systems. The continuing reduction in size of electronic components combined with increasing clock frequencies and greater functionality, results in increased power density. As an effect, controlling the temperature of electronic components is central in electronic product development in order to maintain and potentially improve the reliability of the equipment. Simultaneously, the transition to lead-free electronic equipment will most probably propagate also to the ADHP industry. Compared to well-proven tin-lead solder, the knowledge about field operation reliability of lead-free solders is still limited, as well as the availability of damage evaluation models validated for field temperature conditions. Hence, the need to fill in several knowledge gaps related to reliability and reliability prediction of lead-free solder alloys is emphasized. Having perceived increasing problems experienced in the reliability of fielded equipment, the ADHP industry has suggested inclusion of physics-of-failure (PoF) in reliability prediction of electronics as one potential measure to improve the reliability of the electronic systems.

    This thesis aims to contribute to the development of reliable ADHP systems, with the main focus on electronic equipment for the aerospace industry. In order to accomplish this, the thesis provides design guidelines for power distribution on a double-sided printed circuit board assembly (PBA) as a measure to improve the thermal performance without increasing the weight of the system, and a novel, computationally efficient method for PoF-based evaluation of damage accumulation in solder joints in harsh, non-cyclic field operation temperature environments.

    Thermal fatigue failure mechanisms and state‑of‑the‑art thermal design and design tools are presented, with focus on the requirements that may arise from avionic use, such as low weight, high reliability, and ability to sustain functional during high vibration levels and high g-forces. Paper I, II, and III describes an in-depth investigation that has been performed utilizing advanced thermal modeling of power distribution on a double-sided PBA as a measure to improve the thermal performance of electronic modules.

    Paper IV contributes to increasing the accuracy of thermal fatigue life prediction in solder joints, by employing existing analytical models for predicting thermal fatigue life, but enhancing the prediction result by incorporating advanced thermal analysis in the procedure.

    Papers V and VI suggest and elaborate on a computational method that utilizes surrogate stress and strain modeling of a solder joint, to quickly evaluate the damage accumulated in a critical solder joint from non-cyclic, non-simplified field operation temperature profiles, with accuracy comparable to finite element modeling. The method has been tested on a ball grid array package with SnAgCu solder joints. This package is included in an extensive set of accelerated tests that helps to qualify certain packages and solder alloys for avionic use. The tests include -20°C to +80°C and -55°C to +125°C thermal cycling of a statistically sound population of a number of selected packages, assembled with SnAgCu, Sn100C, and SnPbAg solder alloys. Statistical analysis of the results confirms that the SnAgCu-alloy may outperform SnPbAg solder at moderate thermal loads on the solder joints.

    In Papers VII and VIII, the timeframe is extended to a future, in which validated life prediction models will be available, and the suggested method is expected to increase the accuracy of embedded prognostics of remaining useful thermal fatigue life of a critical solder joint.

    The key contribution of the thesis is the added value of the proposed computational method utilized in the design phase for electronic equipment. Due to its ability for time-efficient operation on uncompressed temperature data, the method gives contribution to the accuracy, and thereby also to the credibility, of reliability prediction of electronic packages in the design phase. This especially relates to applications where thermal fatigue is a dominant contributor to the damage of solder joints.

  • 4. Bakowski, M.
    et al.
    Nee, H.-P.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    High temperature electronic systems all in silicon carbide (SiC) for electric vehicles2011In: Workshop för 'Banbrytande IKT 2007, VINNOVA, Stockholm, 1 September 2011, 2011Conference paper (Other academic)
  • 5. Bakowski, Mietek
    et al.
    Nee, Hans-Peter
    Zetterling, Carl-Mikael
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    High temperature electronic systems all in silicon carbide for hybrid and electrical vehicles2015In: International SiC Power Electronics Applications Workshop, ISiCPEAW 2015, 2015Conference paper (Other academic)
  • 6.
    Belov, I.
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Alavizadeh, Z.
    Lindgren, M.
    Application of engineering optimization to evaluate heating-based humidity management in electronics enclosures2011In: Electronic Environment Konferens & Mässa 2011, Stockholm Älvsjö,5-6 April 2011, Invited speech, 2011, p. 161-162Conference paper (Other academic)
  • 7.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Anti-Moisture Methodology for Electronics Enclosures in Harsh Storage Environments2008Conference paper (Other academic)
  • 8.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Evaluation of Anti-Moisture Measures in Electronics Enclosure: Application of CFD Modelling2009Conference paper (Other academic)
  • 9.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Humidity Management in Electronics Enclosure under Severe Climatic Conditions2008Conference paper (Other academic)
  • 10.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Optimization of PCB Heater Heating Profile for Power-efficient Humidity Management in Electronics Enclosures: OPTIMUS Worldwide User Meeting 2010, Antwerp, Belgium, November 22-23, 20102010Other (Other academic)
  • 11.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing. Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Reliability study of GaN HEMTs2016Conference paper (Other academic)
  • 12.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Simulering av ytbeläggning på gjutna komponenter2015In: Gjuteriet, no 8, p. 49-Article in journal (Other (popular science, discussion, etc.))
    Abstract [sv]

    Inom forskningsområdet Ytteknik används modellering och simulering bland annat för att analysera ytbeläggningsprocesser på komplexa geometrier. Detta är ett multidisciplinärt område som täcker bl.a. elektrokemi, jontransport och Computational Fluid Dynamics (CFD) för beräkningar av strömningsfenomen. Numeriska modelleringsverktyg används i utformandet av processen för att optimera processparametrar både med avseende på ytbeläggningens struktur och förbättrad fördelning av ytbeläggningen. Genom M-ERA projektet som finansierats av VINNOVA har en modell tagits fram för att beskriva ytbeläggning av silver av ett gjutet radiofilter i en silvercyanidlösning. Med målet att ha en minsta ytbeläggningstjocklek på 1 μm har både den elektriska strömmen och ytbeläggningstiden varierats för att uppnå en jämn ytbeläggning och minska förbrukningen av silver. Med hjälp av mätningar på komponenter har man även kunnat validera modellerna.

  • 13.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing. Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Alavizadeh, Zahra
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing. Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Lindgren, Mats
    Omnisys Instruments AB, Västra Frölunda, Sweden.
    Ryden, Jan
    Saab AB, Göteborg, Sweden.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH, Materials and Manufacturing. RISE Research Institutes of Sweden, Borås, Sweden.
    Experimental and CFD evaluation of active anti-condensation methods for non-hermetic cabinets2018In: 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE, 2018, Institute of Electrical and Electronics Engineers (IEEE), 2018, p. 1-6Conference paper (Refereed)
    Abstract [en]

    Experimental evaluation of several active anti-condensation methods for application in non-hermetic electronics enclosures was performed in harsh climatic conditions, including RH = 70% and T = 43 °C. The studied methods included blowing the air along the exposed surface, combination of blowing and air heating as well as local heating of the exposed surface in natural convection conditions. The purpose was to prevent/remove the dew on/from the exposed surface of a micro-condensation sensor. The difference between the methods was quantified in terms of time for dew removal. The power consumption aspects were discussed. A CFD based optimization methodology was developed to determine the heating profiles for the local anti-condensation PCB heater in a non-hermetic cabinet exposed to the quickly changing climatic conditions. The potential for 60% energy savings was revealed by simulation.

  • 14.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Arwidson, Jonas
    Saab.
    Poder, Ralf
    SP Technical Research Institute of Sweden.
    Johannesson, Pär
    SP Technical Research Institute of Sweden.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    The effect of variations in temperature cycling profile and mechanical properties of solder on thermo-mechanical reliability of a lead-free BGA package2015In: Proceedings of the 16th International Conference IEEE EuroSimE 2015, Piscataway: IEEE Press, 2015, p. 165-169Conference paper (Refereed)
    Abstract [en]

    The paper investigates the effect of variations both in temperature cycling profile and in SAC305 solder Young's modulus in the PBGA256 package on the thermo-mechanical reliability. FE simulations quantify the effect of cycle reduction and counting techniques by introducing different temperature profiles having identical dwell- and period time characteristics. A difference of 30% in predicted accumulated creep strain energy density per cycle has been determined for the studied profiles. Under the provided modelling assumptions and simplifications, the maximum variation of the thermal fatigue life of SAC305 solder joints is within 30% as the result of experimentally determined Young's modulus variation in as-delivered packages.

  • 15.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Arwidson, Jonas
    Poder, Ralf
    Johannesson, Pär
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Thermal fatigue life prediction: consequences of cycle reduction and material property variation2016Conference paper (Other academic)
  • 16.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bespalov, Michail
    Klochkova, Ludmila
    Kuleshov, Alexander
    Suzan, Dmitriy
    Tishkin, Vladimir
    Транспортная модель распространения газообразных примесей в атмосфере города = Transport model of gas impurities spread processes in urban area2000In: Математическое моделирование: (Mathematical Modelling), ISSN 0234-0879, Vol. 12, no 11, p. 38-46Article in journal (Refereed)
  • 17.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bespalov, Michail
    Klochkova, Ludmila
    Pavlova, Natalya
    Suzan, Dmitriy
    Tishkin, Vladimir
    Сравнение моделей распространения загрязнений в атмосфере = Comparative Analysis of models of pollutions spreading in atmosphere1999In: Математическое моделирование: (Mathematical Modelling), ISSN 0234-0879, Vol. 11, no 8, p. 52-64Article in journal (Refereed)
  • 18.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Chedid, Michel
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Investigation of Snap-on Feeding Arrangements for a Wearable UHF Textile Patch Antenna2008In: Ambience 08 International Scientific Conference: proceedings 2008 : smart textiles - technology and design : Borås, Sweden / [ed] Lars Hallnäs, Pernilla Walkenström, Lennart Wasling, Borås: Centrum för textilforskning (CTF), The Swedish School of Textiles, University College of Borås , 2008, p. 84-88Conference paper (Refereed)
  • 19.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Jarfors, Anders E.W
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing – Casting.
    Simulering av prestandan hos rheogjutna kylflänsar2016In: Gjuteriet, ISSN 0017-0682, no 6, p. 49-Article in journal (Other academic)
  • 20.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Johansson, Alf
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Danielsson, Torkel
    Sarius, Niklas
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Thermal Analysis of a Power Electronics Module in the Prototyping Phase2009In: Electronic Environment, no 4, p. 6-9Article in journal (Other academic)
  • 21.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bergner, Fredrik
    Bornoff, Robin
    CFD aided reflow oven profiling for PCB preheating in a soldering process2007In: Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems: EuroSimE 2007, Piscataway, NJ.: IEEE , 2007, p. 535-542Conference paper (Refereed)
    Abstract [en]

    A CFD-aided reflow oven profile prediction algorithm has been developed and applied to modelling of preheating of a PCB with non-uniform distribution of component thermal mass in a forced air convection solder reflow oven. The iterative algorithm combines an analytic approach with CFD modelling. It requires an experimentally validated CFD model of the solder reflow oven and a CFD model of the PCB as main inputs. Results of computational experiments have been presented to reveal good agreement between predicted PCB profiles and corresponding CFD calculations. Application guidelines contained in the description of the algorithm will assist potential users both during the virtual prototyping phase of a PCB including designing for assembly and in the phase of reflow oven profiling.

  • 22.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bergner, Fredrik
    Bornoff, Robin
    CFD aided reflow oven profiling for PCB preheating in a soldering process: Part 1(2)2007In: Electronic Environment, no 3, p. 25-28Article in journal (Other academic)
  • 23.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bergner, Fredrik
    Bornoff, Robin
    CFD aided reflow oven profiling for PCB preheating in a soldering process: Part 2(2)2007In: Electronic Environment, no 4, p. 25-27Article in journal (Other academic)
  • 24.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Ryden, Jan
    Alavizadeh, Zahra
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    CFD Assisted Design Evaluation and Experimental Verification of a Logic-Controlled Local PCB Heater for Humidity Management in Electronics Enclosure2010In: IEEE EuroSimE 2010, 26-28 April, Bordeaux, France, 2010Conference paper (Refereed)
    Abstract [en]

    Humidity management of commercial-of-the-shelf electronic components in non-controlled climatic environments can be realized e.g. by introducing a local printed circuit board heater. By choosing appropriate size and location of the heater plate in the vicinity of the critical electronic packages, and utilizing logic control function, it is possible to improve the quality of local humidity management and reduce power consumption of the heater, which is important especially in case of battery driven portable or vehicle mounted devices. A computational fluid dynamics assisted methodology has been developed to determine the best feasible design of the heater, followed by experimental verification of the constructed logic controlled heater. The experiment has been performed in a harsh climatic environment including temperature variation from +33°C to +40°C, and relative humidity variation from 54% to 80%. Analysis of the experimental %RH and temperature curves as well as power profile of the heater has confirmed the feasibility of the chosen approach to maintain greater than 9°C difference between the electronics package surface temperature and the local dew point temperature, by applying discrete power pulses with the amplitude less than 6 W.

  • 25.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
    Nordh, Andreas
    Salomonsson, Kent
    Jönköping University, School of Engineering, JTH, Product Development. Jönköping University, School of Engineering, JTH. Research area Product Development - Simulation and Optimization.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
    Fin‐Tube and Plate Heat Exchangers: Evaluation of Transient Performance2017Conference paper (Refereed)
    Abstract [en]

    A methodology for evaluation of transient performance of, and comparison between plate heat exchanger and plate-fin-and-tube heat exchanger was developed and realized, including experiment and 3-D simulation. Heat transfer from water to a gas medium was addressed. The heated gas volume was the same for both heat exchanger designs. This was achieved by placing the plate-fin-and-tube heat exchanger into enclosure. The volume average temperature of the gas as function of time was computed. Estimated material cost for the studied designs was at least seven times lower than for the stainless steel plate heat exchanger. The performance of the selected plate-fin-and-tube heat exchanger design was found comparable to the plate heat exchanger, when both fin and tube materials were set to Al, and the enclosure was a light-weight thermal insulator. Transient behavior of the studied heat exchangers should be of interest for micro-grid applications, but also for thermal management in electronic cabinets and data centers.

  • 26.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Payandeh, Mostafa
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing – Casting.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Jarfors, Anders E.W.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing – Casting.
    Wessen, Magnus
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing – Casting.
    Effect of fillets on heat transfer in a rheocast aluminium heatsink2016In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016Conference paper (Refereed)
    Abstract [en]

    The effect of fillets formed between the base and plate fins of rheocast aluminium heatsinks on the thermal resistance of the heatsinks has been quantified by simulation. Simulation methodology, including sequential optimization has been developed in order to determine hotspot distributions where the fillets have the maximum effect. Combination of different fillet dimensions with various base thickness levels and aluminium alloys having inhomogeneous thermal conductivity have been investigated. For the studied cases, the effect of fillets on heatsink thermal resistance differs from negligible to 6%. The results would guide thermal designers on contribution of fillets to the heat transfer in multi-fin heatsinks for natural convection.

  • 27.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Rydén, Jan
    Lindblom, Joakim
    Zhang, Yafan
    Hansson, T
    Bergner, Fredrik
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Application of CFD Modelling for Energy Efficient Humidity Mangement of an Electronics Enclosure in Storage under Severe Climatic Conditions2008In: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008: EuroSimE 2008., IEEE , 2008, p. 430-437Conference paper (Refereed)
    Abstract [en]

    A CFD modelling methodology including experimental validation has been developed and applied for investigation of anti-moisture measures in a non- hermetic electronics enclosure containing a number of printed circuit boards, and placed in a severe storage environment. In the climatic test the temperature and the relative humidity have been varried from +33degC to +71degC and from 14% to 80%, respectively. Enclosure heater solutions have been parametrically studied by simulation. A heating strategy involving various power levels has been determined, which is just sufficient to maintain the internal relative humidity below 60%, thereby reducing the risk for dew formation on the electronics assembly.

  • 28.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wingbrant, Helena
    Spetz, Anita-Lloyd
    Sundgren, Hans
    Thuner, Bo
    Svenningstorp, Henrick
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Thermal and flow analysis of SiC-based gas sensors for automotive applications2004In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004: EuroSimE 2004., IEEE , 2004, p. 475-482Conference paper (Refereed)
    Abstract [en]

    Different block and tube mounting alternatives for SiC-based gas sensors were studied by means of temperature measurements and simulation of heat transfer and gas flow for steady state conditions. The most preferable tube mounting design was determined. Simulation-based guidelines were developed for designing tube-mounted gas sensors in the exhaust pipes of diesel and petrol engines, taking into account thermal constraints and flow conditions.

  • 29.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wingbrant, Helena
    Spetz, Anita-Lloyd
    Sundgren, Hans
    Thuner, Bo
    Svenningstorp, Henrik
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    CFD analysis of packaging and mounting solutions for SiC-based gas sensors in automotive applications2006In: Sensor Letters, ISSN 1546-198X, Vol. 4, no 1, p. 29-37Article in journal (Refereed)
    Abstract [en]

    Simulation-based guidelines were developed for designing tube-mounted gas sensors in the exhaust pipes of diesel and petrol engines, taking into account thermal constraints and gas flow conditions. Different block and tube mounting alternatives for SiC-based gas sensors were studied by means of temperature measurements and simulation of steady state heat transfer and gas flow. Design variables included the number of fins in the heat sink mounted on the inlet tube, the inlet construction, the mounting tube orientation, and the micro-heater substrate placement inside the mounting tube. The most preferable tube mounting design was determined with respect to the thermal performance of the sensor structure and with respect to the gas flow parameters, which are important for the sensor's selectivity, sensitivity and response time.

  • 30.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Edström, Curt
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Finite element modeling of silver electrodeposition for evaluation of thickness distribution on complex geometries2016In: Materials & design, ISSN 0264-1275, E-ISSN 1873-4197, Vol. 90, p. 693-703Article in journal (Refereed)
    Abstract [en]

    The paper reveals benefits of multi-disciplinary computer simulation and parametric studies in the design of silver plating process for improved coating distribution. A finite element model of direct current silver plating is experimentally validated for an Assaf panel without agitation. The model combines tertiary current distribution with Butler–Volmer electrode kinetics and computational fluid dynamics at a very low flow-rate. The effect of charge transfer coefficients on the throwing power of the process is quantified for the studied geometry, and variation of cathodic current density and exchange current density is investigated. A simpler model based on secondary current distribution is employed to quantify the effect of electrolyte conductivity on the throwing power of the process. A model combining tertiary current distribution and computational fluid dynamics has been developed and experimentally validated for simulation of complex telecom component electroplating in agitated electrolyte. The effect of current density on the process throwing power is quantified. Recommendations regarding modeling methodology and the effect of electrochemical and process parameters on the thickness distribution have been developed.

  • 31.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Edström, Curt
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Simulation based investigation of silver plating process parameters and their effect on throwing power2015In: International Conference EAST Forum 2015, Lund, June 25-26, 2015., 2015Conference paper (Refereed)
  • 32.
    Belov, Vladimir
    et al.
    Mordovian State Univ., Saransk, Russia.
    Butkina, Anna
    Mordovian State Univ., Saransk, Russia.
    Bolschikov, Feodor
    Convertor Ltd., Saransk, Russian Federation.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Power quality and EMC solutions in micro grids with energy-trading capability2014In: Proceedings of the international symposium on electromagnetic compatibility, EMC Europe, 1-4/9, 2014, Gothenburg, Sweden, Piscataway, N.J.: IEEE Press, 2014, p. 1203-1208Conference paper (Refereed)
    Abstract [en]

    A mathematical model of an AC/DC/AC power converter with an energy storage device has been developed on the basis of a bridge-element concept, that can be employed in the design phase for power quality and conducted emission analysis ofmicro grids. A prototype of a 5 kW AC/DC/AC power converter is built and a mockup of electric energy trading system is realized. Measurements conducted for three operating modes emulating electric energy transfer and power consumption intrading conditions have revealed a low voltage total harmonic distortion, not exceeding 1.3% for the tested cases.

  • 33.
    Belov, Vladimir
    et al.
    Ogarev Mordovia State University, Saransk, Russian Federation.
    Leisner, Peter
    RISE, Swedish Research Institute, Safety and Transport/Electronics, Borås, Sweden.
    Mannikoff, Anders
    Herrljunga Elektriska AB, Herrljunga, Sweden.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
    Mathematical Model of Multi-Phase Power Converter for Parallel Computation2018In: International Journal of Emerging Electric Power Systems, ISSN 2194-5756, E-ISSN 1553-779X, Vol. 19, no 1, article id 20170114Article in journal (Refereed)
    Abstract [en]

    A mathematical model of a multi-phase power conversion system composed of modified bridge-elements (B-system) capable for parallel computation has been developed. Experimental validation on the example of a power system including a synchronous generator and an AC-DC rectifier has been performed. A mathematical algorithm for B-system assembly and steps to obtain mathematical model of the B-system have been developed. Integration of mathematical models of conversion system into the complete model of a multi-phase power system has been explained and evaluation of computational efficiency of parallel computation techniques for the developed model of an AC-DC-AC converter has been performed. The presented modelling method can be employed in the design phase of smart grids, for power quality and conducted emission analysis. 

  • 34. Belov, Vladimir
    et al.
    Shamaev, Alexey
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Mannikoff, Anders
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Mathematical Model of Electric Power Conversion System - Experimental Validation and Evaluation of Parallel ComputingIn: Electric power components and systems, ISSN 1532-5008, E-ISSN 1532-5016Article in journal (Refereed)
  • 35. Casselgren, J.
    et al.
    Hällstig, E.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    True Ground Speed Sensor (TGSS)2009Conference paper (Other academic)
  • 36. Chedid, Michel
    et al.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Experimental Analysis and Modelling of Textile Transmission Line for Wearable Applications2007In: International Journal of Clothing Science and Technology, ISSN 0955-6222, E-ISSN 1758-5953, Vol. 19, no 1, p. 59-71Article in journal (Refereed)
    Abstract [en]

    Purpose – The paper seeks, by means of measurement and modelling, to evaluate frequency dependent per-unit-length parameters of conductive textile transmission line (CTTL) for wearable applications and to study deterioration of these parameters when CTTL is subjected to washing.

    Design/methodology/approach – The studied transmission line is made of Nickel/Copper (Ni/Cu) plated polyester ripstop fabric and is subjected to standard 60°C cycle in a commercial off-the-shelf washing machine. The per-unit-length parameters (resistance and inductance) and characteristic impedance of the line are extracted from measurements before and after washing. Using the measurement data an equivalent circuit is created to model the degradation of the line. The circuit is then integrated in a three-dimensional transmission line matrix (TLM) model of the transmission line.

    Findings – Both an electrical equivalent circuit and a TLM model are developed describing the degradation of the conductive textile when washed. A severe deterioration of the electrical parameters of the line is noticed. Experimental and modelling results are in good agreement in the addressed frequency band.

    Research limitations/implications – Analysis is performed for frequencies up to 10?MHz. The developed TLM model can be used to conduct parametric studies of the CTTL. To counteract the degradation of the line, protective coating is to be considered in further studies.

    Originality/value – This paper extends knowledge of the subject by experimental and simulation-based characterization of the CTTL when subjected to washing cycles.

  • 37. Chedid, Michel
    et al.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Modelling and Characterization of Electrostatic Current Noise Induced Mechanically in Wired Wearable Applications2010In: Journal of Electrostatics, ISSN 0304-3886, E-ISSN 1873-5738, Vol. 68, no 1, p. 21-26Article in journal (Refereed)
    Abstract [en]

    By means of statistical modelling and measurement, the triboelectric current noise spectral density is evaluated for shielded cables in body-borne wired network subjected to mechanical stresses. Assuming a shot noise model, an expression for the current spectral density of the noise is derived. The efficiency of the methodology is demonstrated by measuring the triboelectric current noise in two shielded cables subjected to bending. Thereafter the parameters of the noise pulses' waiting time and amplitude probability density functions are extracted from measurement, thus enabling the computation of the current spectral density of the noise induced mechanically in body-borne wired networks.

  • 38.
    Chedid, Michel
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Tomicic, Daniel
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Evaluation of Conductive Textile for Wearable Computer Applications2006In: The IMAPS Nordic Annual Conference, 2006, p. 220-227Conference paper (Refereed)
    Abstract [en]

    Wearable systems put high demands on wearability and robustness. Conductive fabrics are very likely to be used in wearable systems due to their textile-like characteristics. However conductive fabrics must be able to resist environmental stresses (wearing, laundering, etc.) in the same way as clothing in order to fully comply with the requirements.

    A demonstrator, TxWear, was constructed to exploit conductive fabrics in building a conductive textile transmission line for intermodular communication and power transmission (DC power line communication bus), thus eliminating the need for cables between the modules. The hardware modules are connected to the conductive line through connectors from textile industry, i.e., snap fasteners. Different types of conductive fabrics (Ni/Cu plated polyester fabrics and stainless-steel based elastic ribbon) were evaluated and compared according to their conductivity, flexibility and robustness characteristics. The effect of washing on the electrical properties (per-unit-length parameters) of the textile transmission line was studied. Different coating processes, i.e., parylene and silicone coating, were studied and evaluated in order to isolate and enhance the robustness of the conductive textile. Ni/Cu plated polyester ripstop fabric was found to be not appropriate for wearable applications, while conductive elastic ribbon showed good robustness to laundry induced stresses.

  • 39.
    Chernyakov, Anton E.
    et al.
    SHM R&E Center, RAS, St.Petersburg, Russia.
    Aladov, Andrey V.
    SHM R&E Center, RAS, St.Petersburg, Russia.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing. Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Zakgeim, Alexander L.
    SHM R&E Center, RAS, St.Petersburg, Russia.
    Thermal resistance and temperature distribution in blue and white high-power LED arrays2017In: Proceedings of the 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2017, IEEE, 2017, p. 1-4, article id Code 132094Conference paper (Refereed)
    Abstract [en]

    Thermal resistance and temperature distribution for high-power AlGaInN LED chip-on-board arrays in blue and white versions were measured by different methods and tools. The p-n junction temperature was determined through measuring a temperature-dependent forward voltage drop on the p-n junction, at a low measuring current after applying a high heating current. Furthermore, the infrared thermal imaging technique was employed to obtain the temperature map for the test object. A steady-state 3D computational model of the experimental setup was created including temperature-dependent power dissipation in the LED chips and partitioned interfacial thermal resistance between the heatsink and the LED array. Simulations of the heat transfer in the LED array were performed to further investigate temperature gradients observed in the measurements.

  • 40.
    Davidsson, Karin
    et al.
    SP, Technical Research Institute of Sweden.
    Karlsson, Ingvar
    SP, Technical Research Institute of Sweden.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Bobert, Magnus
    SP, Technical Research Institute of Sweden.
    Blomqvist, Per
    SP, Technical Research Institute of Sweden.
    Safety test methods for EV batteries2010In: World Electric Vehicle Journal, ISSN 2032-6653, Vol. 4, p. 414-420Article in journal (Refereed)
    Abstract [en]

    The aim of the present paper is to share our experience in battery safety testing and risk analysis from arecent project called BLIXT, which had the objective to speed up the progress of the paradigmatic shifttoward electric vehicles (EV). The batteries in question have been three different configurations of lithiumionbatteries (LiFePO4). The tests have involved fire, crash tests and sort circuit.

  • 41. Deflorian, F.
    et al.
    Rossi, S.
    Fedel, M.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Ambrosi, D.
    Hlede, E.
    Crevice corrosion study in marine environment of different materials for propulsion applications2014In: Proceedings of 19th Int. Corrosion Congress, Nov. 2-6, 2014, Jeju, Korea, 2014Conference paper (Refereed)
  • 42.
    Eslami, Maryam
    et al.
    Department of Industrial Engineering, University of Trento, Italy.
    Fedel, Michele
    Department of Industrial Engineering, University of Trento, Italy.
    Speranza, Giorgio
    Center for Materials and Microsystems, Bruno Kessler Foundation (FBK), Italy.
    Deflorian, Flavio
    Department of Industrial Engineering, University of Trento, Italy.
    Andersson, Nils-Eric
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing – Casting.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
    Study of selective deposition mechanism of cerium-based conversion coating on Rheo-HPDC aluminium-silicon alloys2017In: Electrochimica Acta, ISSN 0013-4686, E-ISSN 1873-3859, Vol. 255, p. 449-462Article in journal (Refereed)
    Abstract [en]

    Cerium-based conversion coatings were deposited on Rheo-High Pressure Die Cast (HPDC) Al-Si alloys by immersion in cerium nitrate aqueous solutions. Rheocast Al-Si alloys have a heterogeneous microstructure and present a challenge for the conversion treatment. Different parameters were studied to optimize the conversion coating, and NaCl or H2O2 were also added to the solution to modify or accelerate the deposition process. The mechanism of the coating formation was studied by means of focused ion beam milling (FIB) assisted SEM. The results show that applying cerium-based conversion coating to Al-Si alloys, is possible and a preferential deposition is obtained due to the presence of iron-rich intermetallic particles inside the eutectic region. The formation mechanism of selectively deposited cerium-based conversion coating includes dissolution of aluminium matrix, selective dissolution of aluminium from the noble intermetallic particles, oxidation of iron from the intermetallic particles, and the deposition of cerium hydroxide/oxide layer. The results reveal that the improvement in corrosion resistance in the presence of selectively deposited cerium-based conversion coating is more significant compared to the homogenous coating deposited from the conversion solution containing H2O2. 

    The full text will be freely available from 2019-09-29 00:00
  • 43.
    Eslami, Maryam
    et al.
    Department of Industrial Engineering, University of Trento, Italy.
    Fedel, Michele
    Department of Industrial Engineering, University of Trento, Italy.
    Speranza, Giorgio
    Center for Materials and Microsystems, Bruno Kessler Foundation (FBK), Trento, Italy.
    Deflorian, Flavio
    Department of Industrial Engineering, University of Trento, Italy.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
    Deposition and Characterization of Cerium-Based Conversion Coating on HPDC Low Si Content Aluminum Alloy2017In: Journal of the Electrochemical Society, ISSN 0013-4651, E-ISSN 1945-7111, Vol. 164, no 9, p. C581-C590Article in journal (Refereed)
    Abstract [en]

    Cerium-based conversion coatings were deposited on high pressure die cast (HPDC) Al-Si alloys using an immersion method. Hydrogen peroxide and sodium chloride were added to the conversion solution to accelerate the coating formation and to understand its formation mechanism. These studies showed that the deposition of cerium hydroxide/ oxide conversion layer starts from iron-rich intermetallic particles, which are located inside the eutectic region and then the coating growth continues to cover the entire alloy surface. This phenomenon passivates the active interfaces between iron-rich intermetallic particles and/ or the eutectic silicon phase and the aluminum matrix, which are prone to localized corrosion in chloride ions containing environments. Accordingly, values of the total impedance in EIS measurements significantly increased for the treated substrates. Morphologies of the conversion coatings and the oxidation state of cerium compounds were found to be dependent on the composition of the solution and the presence of chloride ions and/ or hydrogen peroxide. Aluminum alloy with higher silicon content showed a more active surface during immersion in the conversion solution. This makes it more difficult to be treated using aggressive conversion solutions. 

  • 44. Fast, Lars
    et al.
    Lang, Jenny
    Nygren, K.
    Bodén, A.
    Ofstad, A.B.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Successful Development of Coating for Bipolar Plates for Proton exchange Membrane Fuel Cell2015Conference paper (Refereed)
  • 45. Fedel, M.
    et al.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Rossi, S.
    Al2O3 and AlN atomic layer deposited coatings for the corrosion protection of silver and stainless steel substrates2014In: Proceedings of 28th Int. Conf. on Surface Modification Technologies, 16-18 June, 2014, Tampere, Finland, 2014Conference paper (Refereed)
  • 46. Fredenberg, Mikael
    et al.
    Möller, Patrick
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Simulation of copper deposition by electrochemical pattern replication2009In: Timitikos Tomos sti mnimn toi Kathijiti Nikolaoi Spirelli: [¨Honorary volume dedicated to the memory of professor Nicolas Spyrellis] / [ed] P. Gyftou & E. Pavlatou, Athina: Ethniko Metsivio Polytechneio , 2009, p. 153-160Chapter in book (Other academic)
  • 47. Fredenberg, Mikael
    et al.
    Möller, Patrick
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Östling, M.
    Recent Progress in the Development of ECPR (ElectroChemical Pattern Replication) Metal Printing for Microelectronics2005Conference paper (Other academic)
  • 48.
    Gunnarsson, Niklas
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Hald, J
    Hultman, L
    Influence of Ultrasound on filling of Grooves during Ni Electrodeposition2009Conference paper (Other academic)
  • 49. Gunnarsson, Niklas
    et al.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wang, X.
    Svensson, M.
    Vieider, C.
    Hultman, L.
    Electrochemically based low-cost high precision processing in MOEMS packaging2009In: Electrochimica Acta, ISSN 0013-4686, E-ISSN 1873-3859, Vol. 54, no 9, p. 2458-2465Article in journal (Refereed)
    Abstract [en]

    Precision processing in MOEMS (micro-opto-electromechanical systems) packaging has been studied based on electrochemical processes with the purpose of establishing technology for low-cost multifunctional encapsulation of microsystems and assembly of opto-electric access links in polymer.

    The electrochemically based processes studied in this paper include:

    1.Electroforming of a polymer moulding tool (stamper) in a nickel sulphamate electrolyte on a high-precision 3D etched silicon template.

    2.Patterning of 3D surfaces by an electrophoretic photoresist.

    3.Precision plating of Au and Sn for self-alignment of chips by eutectic Au–Sn solder.

    The results show that nickel stampers with adequately low internal stress can be electroformed on 3D silicon wafers. Furthermore, 3D polymer samples manufactured by the nickel stampers can be patterned with metal lines down to 20 μm width using electrophoretic photoresist. Finally, eutectic Au–Sn solder bumps are realized by electroplating of Au and Sn followed by reflowing, satisfying the demands on dimension and alloy composition control over a 4 in. Si wafer.

  • 50.
    Gunnarsson, Niklas
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wang, X.
    Svensson, M.
    Vieider, C.
    Hultman, L.
    Low-cost high precision processing in MEMs packaging based on electrochemical processes2007Conference paper (Other academic)
123 1 - 50 of 145
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