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  • 1.
    Ahlgren, Dennis
    et al.
    Jönköping University, School of Engineering, JTH, Mechanical Engineering.
    Patriksson, Daniel
    Jönköping University, School of Engineering, JTH, Mechanical Engineering.
    Konstruktion av värmeelement2008Independent thesis Basic level (degree of Bachelor), 10 points / 15 hpStudent thesis
    Abstract [en]

    This report aims to describing the work behind the development of a masonry heater.

    The masonry heater is developed in collaboration with the company Transient Design KB that is a product development company located in Alingsås. The company sees a possibility to cover a market segment where modern technology and design are missing.

    The report presents those methods and approaches that have been used and gives an overview to how the project has been carried out. It describes how the ideas behind the final results have produced and how they have been developed during the project's time. In the report you can also read about the final concept with its choices of construction and materials.

    The report is completed with a presentation of a final concept and a ground for possible future production.

  • 2.
    Ahmadkhaniha, Donya
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Pinate, Santiago.
    Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
    Leisner, P.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. RISE Research Institute of Sweden, Borås.
    Zanella, Caterina
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
    Electrodeposition of Ni high P composite coatings containing nano and submicro ceramic particles2017Conference paper (Other academic)
    Abstract [en]

    In this study, electrodeposition of Ni-P composite coatings has been carried out to investigate the possibility of replacing hard chromium coatings. Therefore, electrodeposition of Ni-P based composite coating with different SiC particle size (50 nm, 100 nm and 500 nm) or B4C (500 nm) was performed. The coating’s composition was evaluated by energy dispersive spectroscopy (EDS), microhardness of the coatings was measured by Vickers indentor and polarization measurements were carried out to study the corrosion behavior of the coatings. The results showed that B4C particles can codeposit in higher percent respect to SiC ones. Ceramic particles increased microhardness of Ni-P coatings to 700HV0.01. The polarization behavior of all the coatings in 3.5% NaCl was similar in as plated state proving that particles did not hindered the passive behaviour. Finally, the effect of heat-treatment (at 400 ºC for 1 hour) on the coating’s properties was studied to compare the contribution of particles and heat-treatment on mechanical and corrosion properties of the coatings. Heat-treatment increased the coating’s microhardness and changed the anodic polarization behavior of the coatings respect to the as plated conditions.

  • 3.
    Andersson, Petter
    et al.
    Jönköping University, School of Engineering, JTH, Lighting design.
    Petersson, Marcus
    Jönköping University, School of Engineering, JTH, Lighting design.
    En undersökning av projicerat ljus i inomhusmiljö2011Independent thesis Basic level (degree of Bachelor), 10 credits / 15 HE creditsStudent thesis
  • 4.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Johansson, Alf
    Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Danielsson, Torkel
    Sarius, Niklas
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Thermal Analysis of a Power Electronics Module in the Prototyping Phase2009In: Electronic Environment, no 4, p. 6-9Article in journal (Other academic)
  • 5.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bergner, Fredrik
    Bornoff, Robin
    CFD aided reflow oven profiling for PCB preheating in a soldering process2007In: Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems: EuroSimE 2007, Piscataway, NJ.: IEEE , 2007, p. 535-542Conference paper (Refereed)
    Abstract [en]

    A CFD-aided reflow oven profile prediction algorithm has been developed and applied to modelling of preheating of a PCB with non-uniform distribution of component thermal mass in a forced air convection solder reflow oven. The iterative algorithm combines an analytic approach with CFD modelling. It requires an experimentally validated CFD model of the solder reflow oven and a CFD model of the PCB as main inputs. Results of computational experiments have been presented to reveal good agreement between predicted PCB profiles and corresponding CFD calculations. Application guidelines contained in the description of the algorithm will assist potential users both during the virtual prototyping phase of a PCB including designing for assembly and in the phase of reflow oven profiling.

  • 6.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bergner, Fredrik
    Bornoff, Robin
    CFD aided reflow oven profiling for PCB preheating in a soldering process: Part 1(2)2007In: Electronic Environment, no 3, p. 25-28Article in journal (Other academic)
  • 7.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Lindgren, Mats
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Bergner, Fredrik
    Bornoff, Robin
    CFD aided reflow oven profiling for PCB preheating in a soldering process: Part 2(2)2007In: Electronic Environment, no 4, p. 25-27Article in journal (Other academic)
  • 8.
    Belov, Ilja
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wingbrant, Helena
    Spetz, Anita-Lloyd
    Sundgren, Hans
    Thuner, Bo
    Svenningstorp, Henrick
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Thermal and flow analysis of SiC-based gas sensors for automotive applications2004In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004: EuroSimE 2004., IEEE , 2004, p. 475-482Conference paper (Refereed)
    Abstract [en]

    Different block and tube mounting alternatives for SiC-based gas sensors were studied by means of temperature measurements and simulation of heat transfer and gas flow for steady state conditions. The most preferable tube mounting design was determined. Simulation-based guidelines were developed for designing tube-mounted gas sensors in the exhaust pipes of diesel and petrol engines, taking into account thermal constraints and flow conditions.

  • 9.
    Bergman, Martin
    et al.
    Jönköping University, School of Engineering.
    Wassenius, Christofer
    Jönköping University, School of Engineering.
    Knob Design - For The Senses2011Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE creditsStudent thesis
    Abstract [en]

    This journal handles a development process towards a company called Tylö. The framework from the method Kansei Engineering (KE) is used to evaluate the semantic issues regarding functional surfaces1 of new knobs for heating devices. The physical target in this project was the development of new knobs for heater devices in the sauna environment. The development process is based on surveys, discussions with the target audience, factor analysis and measurements of the surfaces. The reader will have a general understanding of how the semantic of a product affects its users, and how a product developer could affect the final interaction between the product and the consumer. Further, the reader will become aware of the implementation of a product development process in general.  

    The survey in the project is based on a fairly unused method (KE), which basically is used for; seizing target groups feelings about a specific product to make it more optimized. KE was developed to find relationships between product experience and product properties, in order to use these properties to design products that elicit desired experiences.  

    In this project, it was more about a development process and an evaluation of specific structures on surfaces for the sauna environment, which eventually lead to a number of specially selected materials and surfaces. The design, together with special surfaces and materials, probably come to create a more elegant feeling in upcoming knobs for the heater devices in the sauna environment.

  • 10.
    Cheung, Ching Chi
    Jönköping University, School of Engineering, JTH, Mechanical Engineering.
    Semi-automated process planning and cost estimation of turned components based on CATIA V5 Machining2008Independent thesis Advanced level (degree of Magister), 20 points / 30 hpStudent thesis
    Abstract [en]

    To be more competitive in the market, many companies are trying to speed up the quotation process and quote more attractive prices. Therefore, they have identified a need for support in the quotation process in order to reduce the quotation lead-time and ensure a higher level of accuracy in the cost estimations. The Quotation Calculator, an application program, has been developed as part of the degree thesis which was carried out at AB Norrahammars Mekaniska Verkstad, NMW 2006/07. This Quotation Calculator can be operated to calculate the material and manufacturing costs of a new product.

    NMW has recently acquired licenses for CATIA V5, Dassault Systems, for the purpose of making process planning and NC-programming more efficient. NMW wants to generate the data needed from the machining module for the cost calculations. Hence this project was initiated in order to extract data from CATIA V5 for further use in Quotation Calculator or other computer system in NMW.

    This work has resulted in a system developed with a common hosted programming language to extract and transfer information. The system retrieves model geometry from CAD and information on process planning from CAM, then matches the information in the application for the purpose of cost estimation. The system once developed, is supposed to be used for every new product. For this approach, the relationship of the data from CATIA V5 and the Quotation Calculator has been analyzed.

    Within this thesis, the focus is on production cost estimation. The method used here is programming in Visual Basic Editor to extract information from the machining module in CATIA V5 and then import them to Microsoft Excel. With standard operations, tables of data and several inputs, the cost calculation and hence the quotation process can be automatically implemented. This work has been generated with the Quotation Calculator. With the correct input data to process planning and this new quotation system, the machining time and the costs can be estimated more accurately and easier. The time and cost information is made available for decision making. As a result, the lead time for the quotation process will be shortened and a relatively more attractive price can be quoted to the customers.

  • 11.
    Eklund, Peter
    et al.
    Jönköping University, School of Engineering, JTH, Mathematics.
    Haugthon, Johan
    JTH, Mechanical Engineering.
    Utveckling av universaladapter för torkblad i samarbete med European Automotive Supplier AB2007Independent thesis Basic level (degree of Bachelor), 10 points / 15 hpStudent thesis
    Abstract [en]

    This report looks at the possibility of designing a universal adapter for Flat Blade windshield wipers in cooperation with European Automotive Supplier AB.

    To understand and see if this is possible, a research and an extensive patent search where done. Then to add structure to the project a Ganttschematic were developed. To generate good and solid ideas, different methods for product development were looked upon.

    When a method was chosen and applied, a series of concepts emerged. Now the focus was to design and construct all the pieces. The desired manufacture procedures were looked upon as well as materials. Lot of time where spent on designing a lock mechanism to meet the demands European Automotive Supplier AB hade given. To choose the right concept the team used a set of selection matrix for the different ideas.

    After the choices were made, different prototypes were made of the concepts. Then they were tested, and improvement on them was done to make the end product better.

  • 12. Fredenberg, Mikael
    et al.
    Möller, Patrick
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Simulation of copper deposition by electrochemical pattern replication2009In: Timitikos Tomos sti mnimn toi Kathijiti Nikolaoi Spirelli: [¨Honorary volume dedicated to the memory of professor Nicolas Spyrellis] / [ed] P. Gyftou & E. Pavlatou, Athina: Ethniko Metsivio Polytechneio , 2009, p. 153-160Chapter in book (Other academic)
  • 13. Fredenberg, Mikael
    et al.
    Möller, Patrick
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Östling, M.
    Recent Progress in the Development of ECPR (ElectroChemical Pattern Replication) Metal Printing for Microelectronics2005Conference paper (Other academic)
  • 14.
    Ghasemi, Rohollah
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing – Casting.
    Elmquist, Lennart
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing – Casting.
    The relationship between flake graphite orientation, smearing effect, and closing tendency under abrasive wear conditions2014In: Wear, ISSN 0043-1648, E-ISSN 1873-2577, Vol. 317, no 1–2, p. 153-162Article in journal (Refereed)
    Abstract [en]

    Abstract Plastic deformation of the matrix during the wear process results in closing the graphite flakes. In this study, the relationship between the deformation of the matrix and the closing tendency of flake graphite was investigated, both qualitatively and quantitatively. Two representative piston rings, which belonged to the same two-stroke marine engine but were operated for different periods of time, were studied. Initial microstructural observations indicated a uniform distribution of graphite flakes on unworn surfaces, whereas worn surfaces demonstrated a tendency towards a preferred orientation. Approximately 40% of the open flakes of the unworn surfaces were closed during sliding, which may result in the deterioration of the self-lubricating capability of cast iron. Moreover, flakes within the orientation range of 0 to 30° relative to the sliding direction showed a maximum closing tendency when subjected to sliding. The closing tendency gradually decreased as the angle increased, approaching a minimum between 30 and 70°. A slight increase in the closing tendency was observed for flakes with orientations between 70 and 90°. A similar trend was observed on both rings. Furthermore, SEM and EDS analysis indicated substantial deformation of the matrix in the area around the flakes. An insignificant corrosion attack was observed on both worn piston ring surfaces.

  • 15.
    Gunnarsson, Niklas
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Hald, J
    Hultman, L
    Influence of Ultrasound on filling of Grooves during Ni Electrodeposition2009Conference paper (Other academic)
  • 16. Gunnarsson, Niklas
    et al.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wang, X.
    Svensson, M.
    Vieider, C.
    Hultman, L.
    Electrochemically based low-cost high precision processing in MOEMS packaging2009In: Electrochimica Acta, ISSN 0013-4686, E-ISSN 1873-3859, Vol. 54, no 9, p. 2458-2465Article in journal (Refereed)
    Abstract [en]

    Precision processing in MOEMS (micro-opto-electromechanical systems) packaging has been studied based on electrochemical processes with the purpose of establishing technology for low-cost multifunctional encapsulation of microsystems and assembly of opto-electric access links in polymer.

    The electrochemically based processes studied in this paper include:

    1.Electroforming of a polymer moulding tool (stamper) in a nickel sulphamate electrolyte on a high-precision 3D etched silicon template.

    2.Patterning of 3D surfaces by an electrophoretic photoresist.

    3.Precision plating of Au and Sn for self-alignment of chips by eutectic Au–Sn solder.

    The results show that nickel stampers with adequately low internal stress can be electroformed on 3D silicon wafers. Furthermore, 3D polymer samples manufactured by the nickel stampers can be patterned with metal lines down to 20 μm width using electrophoretic photoresist. Finally, eutectic Au–Sn solder bumps are realized by electroplating of Au and Sn followed by reflowing, satisfying the demands on dimension and alloy composition control over a 4 in. Si wafer.

  • 17.
    Gunnarsson, Niklas
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wang, X.
    Svensson, M.
    Vieider, C.
    Hultman, L.
    Low-cost high precision processing in MEMs packaging based on electrochemical processes2007Conference paper (Other academic)
  • 18.
    Hansal, W.E.G.
    et al.
    Happy Plating, Austria.
    Sandalache, G.
    Happy Plating, Austria.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Pulse-electrodeposited NiP-SiC composite coatings2013In: Electrochimica Acta, ISSN 0013-4686, E-ISSN 1873-3859, Vol. 114, p. 851-858Article in journal (Refereed)
    Abstract [en]

    This paper describes the effect of modulated bipolar current (pulse reverse plating) on the incorporation of micron and submicron sized SiC particles within an electrodeposited Ni–P alloy matrix (dispersion coating). Based on electrochemical measurements, a pulse plating process has been defined and the effects of pulse parameters (type of current, frequency of current pulses and current density), the electrolyte composition and the size of the silicon carbide on the particles incorporation rate, phosphorus co-deposition rate, surface morphology, structure, micro hardness and wear resistance of the deposits has been investigated.

    The experimental results show that the phosphorus co-deposition and the particles incorporation rate decrease applying higher current density. The reduction of particle size decreases the co-deposition content of the particles within the coating. Application of pulsed current leads to a more compact composite coating, significantly improving the hardness and the tribological behaviour of the Ni/SiC deposits, mainly at higher frequency of the applied current pulses. DC and bipolar pulses generate unfavourable higher co-deposition rate of phosphorus, hence a loss in hardness has been observed. Tailored shift of the properties and alloy composition during the deposition process can be achieved by change of matrix properties via alternation of the pulse sequences.

  • 19. Helbo, C.
    et al.
    Møller, Patrick
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Acreo.
    The use of mathematical modelling in optimisation of the pulse plating of copper on printed circuit boards2000Conference paper (Other academic)
  • 20.
    Kus, Ömer
    et al.
    Jönköping University, School of Engineering, JTH, Mechanical Engineering.
    Mojtabavi, Hamed
    Jönköping University, School of Engineering, JTH, Mechanical Engineering.
    Redesign of a Shock Absorber Piston Using Sintering2012Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE creditsStudent thesis
    Abstract [en]

    The main objective of this report is to re-design of a product by substituting for another manufacturing process in order to get a cheaper product with the same function and quality. The current shock absorber piston is manufactured by the machining process at Öhlins Racing AB Company. Power Metallurgy (P/M) method could be a good substitute process to meet the technical requirements of the current piston with total lower cost. In this case, the whole process of product development gets involved in designing two new pistons from base-design to final product. One design is assigned to a cheaper P/M process as called Conventional Press and Sinter. Another P/M process as called Metal Injection Molding (MIM) is considered to produce the more expensive piston. According to the design guidelines of P/M processes, the base pistons are modelled in a three dimensional environment, and then an appropriate powder metal is selected for each. Consequently, the next stage is to analyse the piston strengths by Finite Element Method under the static and dynamic loadings. Fatigue analysis is taken into consideration for the cyclic loadings, and the static strength can be assessed for the static loading mode. The results show the infinite fatigue life for two different designs, and no plastic deformation is observed during analysing of the pistons under static loading. Cost estimation is the last stage of this master thesis. Compared to the total costs for the current design, the total estimations for the whole final P/M products can prove the significant drop in the final prise for each design. Thus, environmental and financial issues are already met in achieving the new pistons in this project by saving considerably money and energy. On-going stages will be to make prototype and get them tested under the real working conditions in respect to the standards.

  • 21.
    Larsson, Kristoffer
    Jönköping University, School of Engineering, JTH, Mechanical Engineering.
    Nyutveckling av Huddigs spakkonsoler för modellerna 1060 och 12602008Independent thesis Basic level (degree of Bachelor), 10 points / 15 hpStudent thesis
    Abstract [en]

    Abstract

    The author Kristoffer Larsson wrote this examinations paper for the excavator loader company Huddig AB in Hudiksvall. The subject for this bachelor’s thesis is development of joystick pads at Huddig. The background for the bachelor's thesis is that Huddig have been during the last years developed and redesigning the interior of the cabin. The problem is that the joystick brackets haven’t followed the same development. The goal with this bachelor's thesis is to develop and manufacture four prototypes with consideration on design, ergonomics, bottom positions, control of steering, rototilt, choice of material and manufacturing method.

    To get a picture of what the drivers want and theirs aspect of the development of the joysticks pads the author did a market research with Huddigs customers. After the market research was done some methods and functions solving methods was used to break down the product to different functions.

    Eight different concepts were generated and the finial concepts were selected of a group from Huddig and Kristoffer Larsson. They selected the concepts because they taught that they were best suited to manufacture prototypes of. These are the subjects of the concepts:

    − Conic underpart

    − Angular design

    − Double rows with bottoms at left bracket

    − Tilted steering control

    − Tilted transport direction shifter

    − Two hand grip for steering

    − Placement of hydraulic lifters

    From these comments and aspects the author drew four sketches to have as guidelines for the prototypes. The reason to make prototypes was that it is hard to anticipate if a concept works in the real life based from a sketch.

    The goal with this bachelor's thesis was to design and manufacture innovated concepts which have been done. From the result of the bachelor's thesis Huddig can use it to continue to develop the joystick brackets to a successful product.

  • 22.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    About the effect of anodic pulses and periodic current reversion on electrodeposits2012Conference paper (Refereed)
  • 23.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Deposizione pulsate di cromo duro con inversione di corrente2008In: Galvanotecnica e nuove finiture, ISSN 1121-855X, Vol. 2, p. 84-89Article in journal (Other academic)
  • 24.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Pulse plating of copper on printed circuit boards2012In: Pulse Plating: including 25 tables / [ed] W. Hansal & S. Roy, Eugen G. Leuze Verlag , 2012Chapter in book (Refereed)
  • 25.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Pulse reversal plating of hard chromium2008Conference paper (Other academic)
  • 26.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Pulse reversal plating of hard chromium2008In: Galvanotecnica e nuove finiture, ISSN 1121-855X, Vol. 2, p. 84-89Article in journal (Other academic)
  • 27.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Survey of pulse plating of copper from sulphuric acid solutions2010Conference paper (Other academic)
  • 28.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Influence of process parameters on crack formation in direct current and pulse reversal plated hard chromium2009In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 87, no 2, p. 90-96Article in journal (Refereed)
    Abstract [en]

    It has for a long time been known that crack free chromium coatings can be obtained by pulse reversal plating, but it has only much later been understood that reoxidation of hydrogen from the surface during the anodic periods is essential for obtaining crack free deposits. In this paper, it is shown that a specific anodic charge depending on the charge of the previous cathodic pulse is needed to obtain a crack free coating and that residual stress in the coating will be less at more frequent current reversals. Furthermore, too large an anodic charge will result in redissolution of chromium and thereby decrease the current efficiency.

  • 29.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Møller, Patrick
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Additive-free pulse reversal plating of cupper on printed circuit boards2003In: EAST-Forum 2003, 2003Conference paper (Refereed)
  • 30.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Hansal, W.
    Pulse plating of chromium2012In: Pulse Plating / [ed] Wolfgang E. G. Hansal & Sudipta Roy, Bad Saulgau: Eugen G. Leuze Verlag , 2012, p. 250-268Chapter in book (Refereed)
  • 31.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Möller, Patrick
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Fredenberg, Mikael
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Pulse reversal plating of copper for electronics applications2006Conference paper (Other academic)
  • 32.
    Leisner, Peter
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Möller, Patrick
    Fredenberg, Mikael
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Recent progress in pulse reversal plating of copper for electronics applications2007In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 85, no 1, p. 40-45Article in journal (Refereed)
    Abstract [en]

    Based on demands for modern printed circuit board (pcb) manufacturing, the copper electroplating process is discussed. Electroplating from an additive free solution using low frequency pulse reversal plating with superimposed cathodic pulsation is suggested, which meets the demands for precise dimensions, high ductility and conductivity, low costs and environmental friendliness.

  • 33. Lindgren, Mats
    et al.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Johansson, Alf
    Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
    Danielsson, Torkel
    Gunnarsson, Niklas
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Multi-disciplinary Approach to Design of a Power Electronics Module for Harsh Environments2009In: Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009: EuroSime 2009, 2009, p. 1-8Conference paper (Refereed)
    Abstract [en]

    A set of experimental and computer simulation methods has been applied to reliability analysis of a newly designed resin transfer molded power electronics module for automotive applications, comprising the glass-fiber epoxy multi-layer PCB, populated with various electronic packages. Evaluation of thermo-mechanical stability, determination of moisture ingress, and testing the adhesion quality between the molding compound and the module PCB have been performed along with investigation of heat transfer paths in the module. The experiments in harsh environments have revealed thermo-mechanical stability and acceptable moisture ingress for the module test samples with relatively large BGA components on the glass-fiber epoxy PCBs of different thickness and different solder mask types. Thermal images of the module have been obtained and the CFD model was created and validated with temperature measurements in power-on tests. Extreme heat dissipation modes have been studied by modeling.

  • 34.
    Lindgren, Mats
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Thermal and thermo-mechanical analysis for design evaluation of an automotive radar module2004In: Quality and Reliability Engineering International, ISSN 0748-8017, E-ISSN 1099-1638, Vol. 20, no 7, p. 709-726Article in journal (Refereed)
    Abstract [en]

    The influence of the substrate technology, assembly method, and housing material on the thermal, thermo-mechanical and cost performance of a radar module for automotive applications has been studied to address the product reliability aspects during the design phase. Flip chip and wire bonding have been evaluated for Multi-Chip Module—Laminate/Deposition (MCM-L/D) and Multi-Chip Module—Deposition (MCM-D) substrate technologies used for electronic packaging solutions in a harsh environment. Solder ball and direct attachment have been investigated as second-level assembly. As a result of thermal and thermo-mechanical simulations and cost analysis, radar module designs combining MCM-D and MCM-L/D with wire bonding have been revealed, which are preferable for use in different temperature environments with respect to two performance criteria, the maximum junction temperature and the manufacturing cost. Simulation-based guidelines have been developed for designing radar modules used in automotive applications while satisfying temperature and stress constraints provided for the module.

  • 35.
    Lindgren, Mats
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Törnvall, Magnus
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Application of simulation-based decision making in product development of an RF module2004In: 5th IEEE conference in Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems: EuroSimE 2004, 2004, p. 233-240Conference paper (Refereed)
    Abstract [en]

    This paper presents results of simulation-based design evaluation for thermal and thermo-mechanical performance and cost of packaging technology of an RF module for automotive applications. A combination of thermal, thermo-mechanical and cost analysis within the multi-attribute decision making framework enabled design ranking and revealed two MCM-L/D (multi-chip module-laminate/deposition) and MCM-D (deposition) designs with the wire bonding assembly preferred for use in automotive applications for different temperature environments. Simulation-based design guidelines were developed for designing electronic modules exhibiting good thermal and thermo-mechanical performance. By application-based partitioning of the importance weights assigned to the reliability and cost criteria, the guidelines were extended to cover other application areas.

  • 36.
    Lindgren, Mats
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Belov, Ilja
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Törnvall, Magnus
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Application of simulation-based decision making in product development of an RF module2007In: Microelectronics and reliability, ISSN 0026-2714, E-ISSN 1872-941X, Vol. 47, no 2-3, p. 302-309Article in journal (Refereed)
    Abstract [en]

    This paper presents results of simulation-based design evaluation for thermal and thermo-mechanical performance and cost of packaging technology of a RF module for automotive application. Combination of thermal, thermo-mechanical and cost analysis within the multi-attribute decision making enabled design ranking and revealed two MCM-L/D and MCM-D designs with wire bonding assembly preferred for use in automotive applications for different temperature environments. Simulation-based design guidelines were developed for designing electronic modules exhibiting good thermal and thermo-mechanical performance. By application-based partitioning of the importance weights assigned to the reliability and cost criteria, the guidelines were extended to cover other application areas.

  • 37. Möller, Patrick
    et al.
    Fredenberg, M.
    Dainese, M.
    Aronsson, C.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Östling, M.
    Metal printing of copper interconnects down to 500 nm using ECPR: Electrochemical pattern replication2006In: Microelectronic Engineering, ISSN 0167-9317, E-ISSN 1873-5568, Vol. 83, no 4-9, p. 1410-1413Article in journal (Refereed)
    Abstract [en]

    rinting of copper patterns with dimensions from 100 μm down to 500 nm lines and 280 nm space was demonstrated using electrochemical pattern replication with a master electrode (template) having a pattern depth of 2500 nm. SEM measurements were done to measure the mean line width as well as CD variations on the master and the replicated copper lines. It was found that accurate replication of 500 nm thick metal patterns was enabled by the process and that CD variations in the master were dominating compared to the variations introduced by the electrochemical pattern transfer itself.

  • 38.
    Möller, Patrick
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Fredenberg, Mikael
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Dainese, M.
    Aronsson, C.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Östling, M.
    Metal Printing of Interconnects Down to 500 nm Using ECPR: ElectroChemical Pattern Replication2005Conference paper (Other academic)
  • 39.
    Möller, Patrick
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wiwen-Nilsson, P.
    Fredenberg, M.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Östling, M.
    Printing of Metal Interconnects for Microelectronics: the Electro Chemical Pattern Replication (ECPR) Project2004Conference paper (Other academic)
  • 40.
    Möller, Patrick
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wiwen-Nilsson, P.
    Fredenberg, M.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Montelius, L.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Östling, M.
    ElectroChemical Pattern Replication (ECPR): metal printing for microelectronics2004In: Sur/Fin Interfinish 2004: Chicago, 2004Conference paper (Other academic)
  • 41.
    Möller, Patrick
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Wiwen-Nilsson, P.
    Fredenberg, Mikael
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Montelius, L.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Östling, M.
    ECPR – ElectroChemical Pattern Replication for direct metallization2003Conference paper (Other academic)
  • 42.
    Navarro Aranda, Monica
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing – Casting. Jönköping University, School of Engineering, JTH. Research area Product Development - Simulation and Optimization. Scania CV AB.
    Comparative study of casting simulation softwares for future use during early stages of product development2015Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE creditsStudent thesis
    Abstract [en]

    Within industrial product development processes there is an increasing demand towards reliable predictions of the material behavior, which aims to promote a property driven development that can reduce the lead times. The implementation of simulation based product development with integrated casting simulation may enable the design engineers to gain an early understanding of the products with relation to castability, and orient the subsequent design refinement so as to achieve the desired mechanical properties.

    This work investigates the suitability of three commercial casting simulation softwares –MAGMA 5.2, NovaFlow & Solid 4.7.5 (NFS) and Click2Cast 3.0 (C2C)–, with respect to the needs of design engineers, such as prediction of shrinkage porosity and mechanical properties with relation to the design. Simplified solidification simulations suitable for this stage were thus performed for three high pressure die cast components with different geometrical constraints.

    The comparability between the solidification and cooling behaviour predicted by the three softwares was studied, and showed that a reasonably good agreement between predicted solidification times by MAGMA and NFS could be obtained, albeit not between predictions by MAGMA and C2C. Predictions by the three softwares of the hot spot/porosity areas showed to have a good agreement. The calculation times by each software were compared, and MAGMA was seen to have the best performance, yielding significantly shorter times than NFS and C2C.

    The results obtained were also compared to experimental investigations of porosity, microstructural coarseness, and mechanical properties. There was a good agreement between the predicted hot spot areas –i.e. areas in the geometry that solidify last– and the findings of porosities in the actual castings, meaning that solidification simulations might be able to provide important information for the prediction of most of shrinkage related porosity locations that are related to the casting geometry. However, the lack of a detailed knowledge at the design stage of the casting process limits the possibilities to predict all porosities.

    The predicted microstructure and mechanical properties by MAGMA non-ferrous were seen to have a good agreement in trend with the experimental data, albeit the predicted values showed large differences in magnitude with the experimental data. Although, the MAGMA non-ferrous module was not developed for HPDC components, it was interesting to study if it could be applied in this context. However, the models seem to need adoption to the HPDC process and alloys.

    In conclusion, with a limited knowledge of the manufacturing parameters, simplified solidification simulations may still be able to provide reasonably reliable and useful information during early development stages in order to optimise the design of castings.

  • 43. Ottesen-Hansen, E.
    et al.
    Ambat, R.
    Møller, Patrick
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Minari, D.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Gunnarsson, Niklas
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Ljungcrants, H.
    Corrosion behaviour of nano-crystalline MAX phase nc-TiC/a-SiC2008Conference paper (Other academic)
  • 44.
    Pinate, Santiago
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Surface treatment for medical devices: Analysis of coating materials in High-Frequency surgery instruments2016Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE creditsStudent thesis
    Abstract [en]

    Electric burn and tissue sticking are two major concerns in electrosurgery. The improvement of the surgical instrumentation to avoid these two problems could be achieved by surface treatment. A material selection criteria was used to assist with the selection of suitable candidates to be use as coating material in order to improve the performance of the stainless steel as the current state-of-the-art material in electrosurgery instruments. Two target surfaces were chosen to be coated: inner and outer surface. The inner surface requires a conductive material with a non-stick capability. The outer surface requires an electrical insulation coating easy to clean. TiN, AlN, CrN, and Al2O3 were selected as candidates for the inner surface, while Parylene and ZrO2 were selected for the outer surface. Four research questions guided the investigation to determine the coating materials with the best performance, to assess the characterization techniques, and to evaluate eventual impact of the coating on the thermal spread. An active coated rectangular electrode was connected to a HF-unit in the bipolar cut mode and introduced to an organic testing gel to simulate electrosurgery conditions. A fully coated squared sample was tested to determine the voltage peak of the electric breakdown. The results of the present study reveal that TiN and Al2O3 improved the performance of the sample, when compared to the stainless steel and should assure the non-stick behavior. Both Parylene and ZrO2 failed to provide a continuous electrical insulation. Two new methods of testing that performs closer to real conditions were suggested as an improvement of the existing measurement technics. Moreover, a relationship between the coating and the thermal spread was identified and proposed as a mechanism that enhances tissue adhesion. 

  • 45.
    Sarius, N.G.
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Lauridsen, J.
    Thin Film Physics Division, Department of Physics, Chemistry, and Biology, IFM, Linköping University, Linköping, Sweden .
    Lewin, E.
    Department of Materials Chemistry, The Ångström Laboratory, Uppsala University, Uppsala, Sweden .
    Jansson, U.
    Department of Materials Chemistry, The Ångström Laboratory, Uppsala University, Uppsala, Sweden.
    Högberg, H.
    Thin Film Physics Division, Department of Physics, Chemistry, and Biology, IFM, Linköping University, Linköping, Sweden.
    Öberg, Å.
    ABB Corporate Research, Västerås, Sweden .
    Sarova, G.
    Harting, Corporate Technology Services, Espelkamp, Germany .
    Staperfeld, G.
    Harting, Corporate Technology Services, Espelkamp, Germany.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Eklund, P.
    Thin Film Physics Division, Department of Physics, Chemistry, and Biology, IFM, Linköping University, Linköping, Sweden.
    Hultman, L.
    Thin Film Physics Division, Department of Physics, Chemistry, and Biology, IFM, Linköping University, Linköping, Sweden.
    Contact Resistance of Ti-Si-C-Ag and Ti-Si-C-Ag-Pd Nanocomposite Coatings2012In: Journal of Electronic Materials, ISSN 0361-5235, E-ISSN 1543-186X, Vol. 41, no 3, p. 560-567Article in journal (Refereed)
    Abstract [en]

    Ti-Si-C-Ag-Pd and Ti-Si-C-Ag nanocomposite coatings were deposited by direct-current magnetron sputtering on Cu substrates with an electroplated Ni layer. Analytical electron microscopy, x-ray diffraction, and x-ray photoelectron spectroscopy show that the nanocomposites consist of TiC, Ag:Pd, and amorphous SiC. The contact resistance of these coatings against a spherical Au-Co surface was measured for applied contact forces up to 5 N. Ti-Si-C-Ag-Pd coatings with Ag:Pd top coating had ~10 times lower contact resistance at contact forces below 1 N (~10 mΩ at ~0.1 N), and 2 to 3 times lower for contact forces around 5 N (<1 mΩ at 5 N), compared with the Ti-Si-C-Ag coating.

  • 46.
    Sarius, N.G.
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Lauridsen, J.
    Thin Film Physics Division, Department of Physics, IFM, Linköping University, Linköping, Sweden.
    Lewin, E.
    Department of Materials Chemistry, The Ångström Laboratory, Uppsala University, Uppsala, Sweden.
    Lu, J.
    Thin Film Physics Division, Department of Physics, IFM, Linköping University, Linköping, Sweden.
    Högberg, H.
    Thin Film Physics Division, Department of Physics, IFM, Linköping University, Linköping, Sweden.
    Öberg, Å.
    ABB Corporate Research, Västerås, Sweden.
    Ljungcrantz, H.
    Impact Coatings AB, Linköping, Sweden.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Eklund, P.
    Thin Film Physics Division, Department of Physics, IFM, Linköping University, Linköping, Sweden.
    Hultman, L.
    Thin Film Physics Division, Department of Physics, IFM, Linköping University, Linköping, Sweden.
    Ni and Ti diffusion barrier layers between Ti-Si-C and Ti-Si-C-Ag nanocomposite coatings and Cu-based substrates2012In: Surface & Coatings Technology, ISSN 0257-8972, E-ISSN 1879-3347, Vol. 206, no 8-9, p. 2558-2565Article in journal (Refereed)
    Abstract [en]

    Sputtered Ni and Ti layers were investigated as a diffusion barrier to substitute electroplated Ni between Ti–Si–C and Ti–Si–C–Ag nanocomposite coatings and Cu or CuSn substrates. Samples were subjected to thermal annealing studies by exposure to 400 °C for 11 h. Dense diffusion barrier and coating hindered Cu from diffusing to the surface. This condition was achieved for electroplated Ni in combination with magnetron-sputtered Ti–Si–C and Ti–Si–C–Ag layers deposited at 230 °C and 300 °C, and sputtered Ti or Ni layers in combination with Ti–Si–C–Ag deposited at 300 °C.

  • 47.
    Sarius, N.G.
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Leisner, P.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Hald, J.
    Hultman, L.
    Inverkan av ultraljud på fyllningsegenskaperna under elektroplätering av Ni2011In: Ytforum, ISSN 0349-4470, no 4, p. 31-32Article in journal (Other academic)
  • 48.
    Sarius, N.G.
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Hald, J.
    Hultman, L.
    Linköping University.
    Electroplating of nickel in grooves under the influence of low and medium frequency ultrasound2011In: Journal for Electrochemistry and Plating Technology, ISSN 1866-7406, Vol. 1, no 3, p. 19-28Article in journal (Refereed)
    Abstract [en]

    The effect of ultrasonics on filling properties has been studied by Ni electroplating from a sulphamate electrolyte in high aspect ratio grooves. The experiments have been performed with two different modes of ultrasound: a) 25 kHz ultrasound with an effect of 225 W directed perpendicular to the substrate surface; b) ultrasonic standing waves of 100 kHz and 400 kHz parallel to the substrate surface. It was found that both methods improve the filling in grooves that are between 0.35 and 1 mm wide with aspect ratios between 0.6 and 3, compared to electroplating with conventional agitation. Under the investigated conditions the 400 kHz standing wave parallel to the surface was most efficient to improve filling of grooves.

  • 49.
    Sarius, N.G.
    et al.
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
    Persson, P.
    Hald, J.
    Hultman, L.
    Influence of ultrasound and cathode rotation on the formation of intrinsic stress in Ni films during electrodeposition2011In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 89, no 3, p. 137-142Article in journal (Refereed)
    Abstract [en]

    The influence of 25 kHz ultrasound and cathode rotation during electroplating of Ni films on Si wafers has been studied with respect to intrinsic stress formation. Current densities from 1·6 up to 28·3 A dm−2 were used in an additive free Ni sulphamate electrolyte. In general, more efficient agitation by either ultrasound or cathode rotation was found to reduce intrinsic stress towards compressive levels compared with conventional agitation with an electrolyte circulation pump. Furthermore, intrinsic stresses become less dependent on changes in current density. The latter effect is most pronounced for ultrasonic agitation. Structure analysis of samples deposited by ultrasonic agitation shows dense deposits with initially smaller grains at high ultrasonic effect. Locally increased temperature at the substrate surface could be an important effect of ultrasound agitation.

  • 50. Scheffle, M.
    et al.
    Cottet, D.
    Grzyb, J.
    Tröster, G.
    Delaney, K.
    Fuchs, S.
    Ammann, N.
    Preyss, W.
    Baumbach, J.
    Poyet, P.
    Bodö, P.
    Leisner, Peter
    Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
    Karlsson, M.
    Wahlström, U.
    Persson, S-T.
    Ljungqvist, L.
    Wendel, W.
    Epple, R.
    Centro, T.
    Motto, S.
    Catarsi, F.
    Demmer, P.
    Low cost large area panel processing of MCM-D substrates and packages2001In: Proceedings of IPACK’01: Kauai, Hawaii, 2001, p. -8Conference paper (Refereed)
    Abstract [en]

    The paper describes the results of the EU research project LAP that had the target to develop and to demonstrate a low-cost high-density substrate manufacturing technology for 1st-level die assemblies. The cost target of 1€€/in2 had to be obtained by increasing toady’s 4x4in2 panel sizes to panels upto 24x24in2. The results focus on RF characterization (integrated antennas up to 83GHz, inductors up a Q value of 50), novel packaging strategies (integration of substrate and package), and cost achievements (approaching the cost target). The technology capabilities have been demonstrated with a 9:4 satellite switch operating up to 2.4GHz and readout electronics for physics experiments.

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