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A critical review on the use of pulse and pulse reverse plating and their influence on electrodeposition of nanocomposite coatings
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.ORCID iD: 0000-0003-2924-137X
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.ORCID iD: 0000-0002-7095-1907
2016 (English)Conference paper, Oral presentation only (Other academic)
Abstract [en]

Application of pulse and reverse plating to the electrodeposition of composite coatings have been adopted in the last decades but the studies were lacking in consistency of experimental approach. No major conclusion were draw on the effect of using pulse or reverse pulse plating on the codeposition of nanoparticles. Pulse plating is characterized by an increased number of variables and therefore is often difficult to understand the relationship between the parameters and the final results and compare or correlate them to available literature data. In this paper a review of major contributions in this field is carried out trying to compare results and to discuss the effect of pulse parameters on the codeposition of nanoparticles focusing on copper and nickel matrixes.

Place, publisher, year, edition, pages
2016.
National Category
Engineering and Technology Materials Engineering
Identifiers
URN: urn:nbn:se:hj:diva-28935OAI: oai:DiVA.org:hj-28935DiVA: diva2:892332
Conference
7th European Pulse Plating Seminar, Vienna, March 3-4, 2016.
Note

Invited lecture

Available from: 2016-01-09 Created: 2016-01-09 Last updated: 2016-08-17Bibliographically approved

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Zanella, CaterinaLeisner, Peter
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