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The effect of variations in temperature cycling profile and mechanical properties of solder on thermo-mechanical reliability of a lead-free BGA package
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
Saab.
SP Technical Research Institute of Sweden.
SP Technical Research Institute of Sweden.
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2015 (English)In: Proceedings of the 16th International Conference IEEE EuroSimE 2015, Piscataway: IEEE Press, 2015, 165-169 p.Conference paper, Published paper (Refereed)
Abstract [en]

The paper investigates the effect of variations both in temperature cycling profile and in SAC305 solder Young's modulus in the PBGA256 package on the thermo-mechanical reliability. FE simulations quantify the effect of cycle reduction and counting techniques by introducing different temperature profiles having identical dwell- and period time characteristics. A difference of 30% in predicted accumulated creep strain energy density per cycle has been determined for the studied profiles. Under the provided modelling assumptions and simplifications, the maximum variation of the thermal fatigue life of SAC305 solder joints is within 30% as the result of experimentally determined Young's modulus variation in as-delivered packages.

Place, publisher, year, edition, pages
Piscataway: IEEE Press, 2015. 165-169 p.
Keyword [en]
Elastic moduli, Fatigue of materials, Finite element method, Microelectronics, Microsystems, Soldered joints, Strain energy, Accumulated creep strain energy densities, Counting techniques, Maximum variations, Temperature cycling, Temperature profiles, Thermomechanical reliability, Time characteristics, Young's modulus variations
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:hj:diva-28912Scopus ID: 2-s2.0-84944810048ISBN: 978-1-4799-9951-4 (print)OAI: oai:DiVA.org:hj-28912DiVA: diva2:892137
Conference
16th International Conference IEEE EuroSimE 2015, Budapest, April 19-22, 2015.
Available from: 2016-01-08 Created: 2016-01-08 Last updated: 2017-07-06Bibliographically approved

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CiteExportLink to record
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Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
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