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Electrodeposition of CuSn from choline chloride-ethylene glycol deep eutectic solvent
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
(English)In: Electrochimica Acta, ISSN 0013-4686, E-ISSN 0019-4686Article in journal (Refereed) Submitted
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Engineering and Technology
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URN: urn:nbn:se:hj:diva-25500OAI: oai:DiVA.org:hj-25500DiVA: diva2:775690
Available from: 2015-01-05 Created: 2015-01-05 Last updated: 2015-01-05

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JTH. Research area Materials and manufacturing - Surface technology
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