Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
A computational method for evaluating the damage in a solder joint of an electronic package subjected to thermal loads
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Electronic Defence Systems, Saab AB, Jönköping, Sweden.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
SP Technical Research Institute of Sweden, Borås, Sweden.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. SP Technical Research Institute of Sweden, Borås, Sweden.
2014 (English)In: Engineering computations, ISSN 0264-4401, E-ISSN 1758-7077, Vol. 31, no 3, 467-489 p.Article in journal (Refereed) Published
Abstract [en]

Purpose – The purpose of this paper is to introduce a novel computational method to evaluate damage accumulation in a solder joint of an electronic package, when exposed to operating temperature environment. A procedure to implement the method is suggested, and a discussion of the method and its possible applications is provided in the paper.

Design/methodology/approach – Methodologically, interpolated response surfaces based on specially designed finite element (FE) simulation runs, are employed to compute a damage metric at regular time intervals of an operating temperature profile. The developed method has been evaluated on a finite-element model of a lead-free PBGA256 package, and accumulated creep strain energy density has been chosen as damage metric.

Findings – The method has proven to be two orders of magnitude more computationally efficient compared to FE simulation. A general agreement within 3 percent has been found between the results predicted with the new method, and FE simulations when tested on a number of temperature profiles from an avionic application. The solder joint temperature ranges between +25 and +75°C.

Practical implications – The method can be implemented as part of reliability assessment of electronic packages in the design phase.

Originality/value – The method enables increased accuracy in thermal fatigue life prediction of solder joints. Combined with other failure mechanisms, it may contribute to the accuracy of reliability assessment of electronic packages.

Place, publisher, year, edition, pages
2014. Vol. 31, no 3, 467-489 p.
Keyword [en]
Computational method, Thermal fatigue, Finite element analysis, Electronic package, Lead-free solder, Operating temperature environment
National Category
Materials Engineering Computational Mathematics Reliability and Maintenance
Identifiers
URN: urn:nbn:se:hj:diva-19483DOI: 10.1108/EC-07-2012-0163ISI: 000339628800006Scopus ID: 2-s2.0-84901003795OAI: oai:DiVA.org:hj-19483DiVA: diva2:555381
Available from: 2012-09-19 Created: 2012-09-19 Last updated: 2017-07-06Bibliographically approved
In thesis
1. Thermal Fatigue Life Prediction of Solder Joints in Avionics by Surrogate Modeling: a Contribution to Physics of Failure in Reliability Prediction
Open this publication in new window or tab >>Thermal Fatigue Life Prediction of Solder Joints in Avionics by Surrogate Modeling: a Contribution to Physics of Failure in Reliability Prediction
2013 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Manufacturers of aerospace, defense, and high performance (ADHP) equipment are currently facing multiple challenges related to the reliability of electronic systems. The continuing reduction in size of electronic components combined with increasing clock frequencies and greater functionality, results in increased power density. As an effect, controlling the temperature of electronic components is central in electronic product development in order to maintain and potentially improve the reliability of the equipment. Simultaneously, the transition to lead-free electronic equipment will most probably propagate also to the ADHP industry. Compared to well-proven tin-lead solder, the knowledge about field operation reliability of lead-free solders is still limited, as well as the availability of damage evaluation models validated for field temperature conditions. Hence, the need to fill in several knowledge gaps related to reliability and reliability prediction of lead-free solder alloys is emphasized. Having perceived increasing problems experienced in the reliability of fielded equipment, the ADHP industry has suggested inclusion of physics-of-failure (PoF) in reliability prediction of electronics as one potential measure to improve the reliability of the electronic systems.

This thesis aims to contribute to the development of reliable ADHP systems, with the main focus on electronic equipment for the aerospace industry. In order to accomplish this, the thesis provides design guidelines for power distribution on a double-sided printed circuit board assembly (PBA) as a measure to improve the thermal performance without increasing the weight of the system, and a novel, computationally efficient method for PoF-based evaluation of damage accumulation in solder joints in harsh, non-cyclic field operation temperature environments.

Thermal fatigue failure mechanisms and state‑of‑the‑art thermal design and design tools are presented, with focus on the requirements that may arise from avionic use, such as low weight, high reliability, and ability to sustain functional during high vibration levels and high g-forces. Paper I, II, and III describes an in-depth investigation that has been performed utilizing advanced thermal modeling of power distribution on a double-sided PBA as a measure to improve the thermal performance of electronic modules.

Paper IV contributes to increasing the accuracy of thermal fatigue life prediction in solder joints, by employing existing analytical models for predicting thermal fatigue life, but enhancing the prediction result by incorporating advanced thermal analysis in the procedure.

Papers V and VI suggest and elaborate on a computational method that utilizes surrogate stress and strain modeling of a solder joint, to quickly evaluate the damage accumulated in a critical solder joint from non-cyclic, non-simplified field operation temperature profiles, with accuracy comparable to finite element modeling. The method has been tested on a ball grid array package with SnAgCu solder joints. This package is included in an extensive set of accelerated tests that helps to qualify certain packages and solder alloys for avionic use. The tests include -20°C to +80°C and -55°C to +125°C thermal cycling of a statistically sound population of a number of selected packages, assembled with SnAgCu, Sn100C, and SnPbAg solder alloys. Statistical analysis of the results confirms that the SnAgCu-alloy may outperform SnPbAg solder at moderate thermal loads on the solder joints.

In Papers VII and VIII, the timeframe is extended to a future, in which validated life prediction models will be available, and the suggested method is expected to increase the accuracy of embedded prognostics of remaining useful thermal fatigue life of a critical solder joint.

The key contribution of the thesis is the added value of the proposed computational method utilized in the design phase for electronic equipment. Due to its ability for time-efficient operation on uncompressed temperature data, the method gives contribution to the accuracy, and thereby also to the credibility, of reliability prediction of electronic packages in the design phase. This especially relates to applications where thermal fatigue is a dominant contributor to the damage of solder joints.

Place, publisher, year, edition, pages
LiU-Tryck, Sweden, 2013. 64 p.
Series
Linköping studies in scince and technology. Dissertations, ISSN 0345-7524 ; 1521
National Category
Engineering and Technology
Identifiers
urn:nbn:se:hj:diva-23017 (URN)
Available from: 2014-01-13 Created: 2014-01-09 Last updated: 2014-01-13Bibliographically approved

Open Access in DiVA

No full text

Other links

Publisher's full textScopus

Search in DiVA

By author/editor
Belov, IljaLeisner, Peter
By organisation
JTH. Research area Materials and manufacturing - Surface technology
In the same journal
Engineering computations
Materials EngineeringComputational MathematicsReliability and Maintenance

Search outside of DiVA

GoogleGoogle Scholar

Altmetric score

Total: 510 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf