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Influence of ultrasound and cathode rotation on the formation of intrinsic stress in Ni films during electrodeposition
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
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2011 (English)In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, Vol. 89, no 3, 137-142 p.Article in journal (Refereed) Published
Abstract [en]

The influence of 25 kHz ultrasound and cathode rotation during electroplating of Ni films on Si wafers has been studied with respect to intrinsic stress formation. Current densities from 1·6 up to 28·3 A dm−2 were used in an additive free Ni sulphamate electrolyte. In general, more efficient agitation by either ultrasound or cathode rotation was found to reduce intrinsic stress towards compressive levels compared with conventional agitation with an electrolyte circulation pump. Furthermore, intrinsic stresses become less dependent on changes in current density. The latter effect is most pronounced for ultrasonic agitation. Structure analysis of samples deposited by ultrasonic agitation shows dense deposits with initially smaller grains at high ultrasonic effect. Locally increased temperature at the substrate surface could be an important effect of ultrasound agitation.

Place, publisher, year, edition, pages
2011. Vol. 89, no 3, 137-142 p.
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Metallurgy and Metallic Materials Other Materials Engineering Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:hj:diva-17249DOI: 10.1179/174591911X13013911711888OAI: oai:DiVA.org:hj-17249DiVA: diva2:480316
Available from: 2012-01-19 Created: 2012-01-19 Last updated: 2012-01-20Bibliographically approved

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Leisner, Peter
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JTH. Research area Materials and manufacturing - Surface technology
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