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Solidification behaviour of AI-7% Si-0.3% Mg during rotary spray forming
Royal Institute of Technology, Department of Materials Processing, Stockholm, Sweden.ORCID iD: 0000-0002-0101-0062
1998 (English)In: Journal of Materials Science, ISSN 0022-2461, E-ISSN 1573-4803, Vol. 33, no 15, 3907-3918 p.Article in journal (Refereed) Published
Abstract [en]

The solidification behaviour of an AI-7% Si-0.3% Mg alloy during rotary spray forming was studied. The ability to form a coating was insensitive to the thermal processing parameters, yielding material exchangess greater than 90%. The level of porosity varied typically between 1.5 and 4.75%. The dendrite arm spacing was evaluated and used to estimate the cooling rates. Typical dendrite secondary arm spacings were of the orderof 3 jam, 12 (am and 25 ÎŒm, corresponding to cooling rates of 4630 K s-1 72 K s-1 and 8 K s -1 respectively. The fraction primary precipitation was experimentally determined and the partition coefficient calculated indirectly using the Scheil equation. The partition coefficient is increased during rotary spray forming. This is explained by the presence of trapped vacancies at the solidification front. The vacancies change the solid's free energy and thus change the phase diagram and the partition coefficient. A simplistic analysis of entrapment and condensation of vacancies and their influence on the partition coefficient is made. © 1998 Kluwer Academic Publishers.

Place, publisher, year, edition, pages
1998. Vol. 33, no 15, 3907-3918 p.
Keyword [en]
Calculations, Cooling, Free energy, Mathematical models, Phase diagrams, Porosity, Precipitation (chemical), Solidification, Aluminum silicon magnesium alloy, Dendrite arm spacing, Partition coefficient, Rotary spray forming, Scheil equation, Thermal processing parameter, Aluminum alloys
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:hj:diva-16659OAI: oai:DiVA.org:hj-16659DiVA: diva2:454536
Available from: 2011-11-07 Created: 2011-11-07 Last updated: 2015-06-01Bibliographically approved

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Jarfors, A. E. W.
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