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Investigation of microstructure and hardness in microfoming of pure copper pins
School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore.
School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore.ORCID iD: 0000-0002-0101-0062
School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore.
Singapore Institute of Manufacturing Technology (SIMTech).
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2010 (English)In: Key Engineering Materials, ISSN 1013-9826, E-ISSN 1662-9795, Vol. 447-448, p. 381-385Article in journal (Refereed) Published
Abstract [en]

Microforming is defined as the process of production of metallic micro-parts with sub-millimeter dimension. There is as strong interaction between the scale of the microstructure and the size of the part affecting material flow, the so-called "size effect" in microforming processes. Conventional forming rules cannot be directly applied to the micro-scale forming. To better understand the implications for part geometry and properties, further investigation of the material flow related events is necessary. The aim of this work is to investigate microstructural evolution of pure copper during a micro-extrusion process - for production of micro-pins with diameters varying from 300 to 800Όm - by means of optical microscope (OM). Qualitative strain gradient distribution could be observed by those pictures. The results showed that change of micro-pins diameter and die angle affect the microstructure and strain distribution of the final product remarkably, that affect the mechanical properties of the pin formed. Furthermore, microhardness results were consistent with the microstructural observations. © (2010) Trans Tech Publications.

Place, publisher, year, edition, pages
2010. Vol. 447-448, p. 381-385
Keywords [en]
Microforming, Microstructure, Pure copper, Strain distribution, Die angle, Material Flow, Micro forming, Micro part, Micro-scales, Microextrusion, Microstructural observations, Optical microscopes, Part geometry, Size effects, Strain distributions, Strain gradients, Strong interaction, Submillimeters, Copper, Forming, Mechanical properties, Microfabrication, Strain, Precision engineering
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:hj:diva-16628DOI: 10.4028/www.scientific.net/KEM.447-448.381OAI: oai:DiVA.org:hj-16628DiVA, id: diva2:454455
Available from: 2011-11-07 Created: 2011-11-07 Last updated: 2017-12-08Bibliographically approved

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Jarfors, A. E. W.

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