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Printing of Metal Interconnects for Microelectronics: the Electro Chemical Pattern Replication (ECPR) Project
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.ORCID iD: 0000-0002-7095-1907
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2004 (English)Conference paper, Oral presentation with published abstract (Other academic)
Place, publisher, year, edition, pages
2004.
National Category
Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:hj:diva-6348OAI: oai:DiVA.org:hj-6348DiVA, id: diva2:37168
Conference
SSoCC´04, Båstad
Note

Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011

Available from: 2007-08-03 Created: 2007-08-03 Last updated: 2018-09-19Bibliographically approved

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http://ma.ecsdl.org/content/MA2005-02/17/682.full.pdf

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Leisner, Peter

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JTH. Research area Materials and manufacturing - Surface technologyJTH. Research area Robust Embedded Systems
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