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Low cost large area panel processing of MCM-D substrates and packages
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2001 (English)In: Proceedings of IPACK’01: Kauai, Hawaii, 2001, p. -8Conference paper, Published paper (Refereed)
Abstract [en]

The paper describes the results of the EU research project LAP that had the target to develop and to demonstrate a low-cost high-density substrate manufacturing technology for 1st-level die assemblies. The cost target of 1€€/in2 had to be obtained by increasing toady’s 4x4in2 panel sizes to panels upto 24x24in2. The results focus on RF characterization (integrated antennas up to 83GHz, inductors up a Q value of 50), novel packaging strategies (integration of substrate and package), and cost achievements (approaching the cost target). The technology capabilities have been demonstrated with a 9:4 satellite switch operating up to 2.4GHz and readout electronics for physics experiments.

Place, publisher, year, edition, pages
2001. p. -8
National Category
Materials Engineering Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:hj:diva-6328OAI: oai:DiVA.org:hj-6328DiVA, id: diva2:37148
Conference
The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition July 8-13, 2001, Kauai, Hawaii, USA
Note

Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011

Available from: 2007-08-03 Created: 2007-08-03 Last updated: 2018-09-19Bibliographically approved

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Leisner, Peter

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CiteExportLink to record
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Citation style
  • apa
  • harvard1
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  • modern-language-association-8th-edition
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Language
  • de-DE
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  • Other locale
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Output format
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