The use of mathematical modelling in optimisation of the pulse plating of copper on printed circuit boards 2000 (English)Conference paper, Published paper (Other academic)

Place, publisher, year, edition, pages

2000.

National Category

Manufacturing, Surface and Joining Technology

Identifiers

URN: urn:nbn:se:hj:diva-6323OAI: oai:DiVA.org:hj-6323DiVA, id: diva2:37143

Conference

15th World Interfinish Congress Garmisch-Partenkirchen

Note

Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Available from: 2007-08-02 Created: 2007-08-02 Last updated: 2018-09-19Bibliographically approved

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Leisner, Peter

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Leisner, Peter

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JTH. Research area Materials and manufacturing - Surface technologyJTH. Research area Robust Embedded Systems

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Manufacturing, Surface and Joining Technology

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