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Metal printing of copper interconnects down to 500 nm using ECPR: Electrochemical pattern replication
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2006 (English)In: Microelectronic Engineering, ISSN 0167-9317, E-ISSN 1873-5568, Vol. 83, no 4-9, p. 1410-1413Article in journal (Refereed) Published
Abstract [en]

rinting of copper patterns with dimensions from 100 μm down to 500 nm lines and 280 nm space was demonstrated using electrochemical pattern replication with a master electrode (template) having a pattern depth of 2500 nm. SEM measurements were done to measure the mean line width as well as CD variations on the master and the replicated copper lines. It was found that accurate replication of 500 nm thick metal patterns was enabled by the process and that CD variations in the master were dominating compared to the variations introduced by the electrochemical pattern transfer itself.

Place, publisher, year, edition, pages
2006. Vol. 83, no 4-9, p. 1410-1413
Keywords [en]
ECPR, Metal printing, Copper interconnects, Imprinting, Electroplating
National Category
Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:hj:diva-6194DOI: 10.1016/j.mee.2006.01.208OAI: oai:DiVA.org:hj-6194DiVA, id: diva2:37014
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011 Available from: 2007-08-03 Created: 2007-08-03 Last updated: 2017-12-12Bibliographically approved

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Leisner, Peter

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JTH. Research area Materials and manufacturing - Surface technologyJTH. Research area Robust Embedded Systems
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