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Electrodeposition of compositionally modulated Au/Co alloy layers
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.ORCID iD: 0000-0002-7095-1907
2002 (English)In: Journal of Applied Electrochemistry, ISSN 0021-891X, E-ISSN 1572-8838, Vol. 32, no 1, p. 97-104Article in journal (Refereed) Published
Abstract [en]

Au/Co multilayers were electrodeposited from a single bath based on acid citrate, cobalt sulphate and gold cyanide electrolyte. The Taguchi statistical method was used for experiment planning and optimisation. X-ray diffraction (XRD) investigations of the structure showed that the Au deposits exhibited a polycrystalline fcc 1 1 1 structure with an estimated grain size of 7 nm, while the Co deposits exhibited a nano-polycrystalline fcc structure with an estimated grain size ranging between 2 and 28 nm and a strong in-plane texture. The XRD investigation of the multilayer structure also indicated an interface roughness of about 1.5 nm between the Au and Co layers.

Place, publisher, year, edition, pages
2002. Vol. 32, no 1, p. 97-104
Keywords [en]
cobalt, gold, multilayers, pulse plating, single bath, Taguchi
National Category
Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:hj:diva-6189DOI: 10.1023/A:1014265727820OAI: oai:DiVA.org:hj-6189DiVA, id: diva2:37009
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011 Available from: 2007-08-03 Created: 2007-08-03 Last updated: 2018-09-19Bibliographically approved

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Leisner, Peter

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JTH. Research area Materials and manufacturing - Surface technologyJTH. Research area Robust Embedded Systems
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