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Recent progress in pulse reversal plating of copper for electronics applications
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.ORCID iD: 0000-0002-7095-1907
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
2007 (English)In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 85, no 1, p. 40-45Article in journal (Refereed) Published
Abstract [en]

Based on demands for modern printed circuit board (pcb) manufacturing, the copper electroplating process is discussed. Electroplating from an additive free solution using low frequency pulse reversal plating with superimposed cathodic pulsation is suggested, which meets the demands for precise dimensions, high ductility and conductivity, low costs and environmental friendliness.

Place, publisher, year, edition, pages
2007. Vol. 85, no 1, p. 40-45
National Category
Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:hj:diva-6044DOI: 10.1179/174591907X161973OAI: oai:DiVA.org:hj-6044DiVA, id: diva2:36864
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011 Available from: 2007-08-03 Created: 2007-08-03 Last updated: 2018-09-19Bibliographically approved

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Leisner, PeterBelov, Ilja

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JTH. Research area Materials and manufacturing - Surface technologyJTH. Research area Robust Embedded Systems
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