Thermal Analysis of an Electronic Module with a Double-sided PCB Housed in a 2-MCU Enclosure for Avionic Applications 2004 (English)In: Proceedings: 2004 International Symposium on Microelectronics, November 14-18, 2004, Long Beach Convention Center, Long Beach, Ca, Washington, D.C.: IMAPS--International Microelectronics and Packaging Society , 2004Conference paper, Published paper (Refereed)

Place, publisher, year, edition, pages

Washington, D.C.: IMAPS--International Microelectronics and Packaging Society , 2004.

National Category

Mechanical Engineering

Identifiers

URN: urn:nbn:se:hj:diva-6027ISBN: 0-930815-74-2 (print)OAI: oai:DiVA.org:hj-6027DiVA, id: diva2:36847

Conference

2004 International Symposium on Microelectronics, November 14-18, 2004, Long Beach Convention Center, Long Beach, Ca

Note

Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Available from: 2007-08-02 Created: 2007-08-02 Last updated: 2018-09-19Bibliographically approved

Open Access in DiVA

No full text in DiVA

Authority records

Johansson, JonasBelov, IljaSäfsten, KristinaLeisner, Peter

Search in DiVA

By author/editor

Johansson, JonasBelov, IljaSäfsten, KristinaLeisner, Peter

By organisation

JTH. Research area Materials and manufacturing - Surface technologyJTH. Research area Robust Embedded SystemsJTH. Research area Industrial Engineering and Management

On the subject

Mechanical Engineering

Search outside of DiVA

GoogleGoogle ScholarTotal: 560 hits