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Thermal design evaluation of an electronic module for helicopter applications
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH. Research area Industrial Engineering and Management.ORCID iD: 0000-0002-0216-4493
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
2004 (English)Conference paper, Published paper (Other academic)
Place, publisher, year, edition, pages
2004.
National Category
Mechanical Engineering
Identifiers
URN: urn:nbn:se:hj:diva-6012OAI: oai:DiVA.org:hj-6012DiVA, id: diva2:36832
Conference
WEAG-CEPA2 Microelectronics Workshop on Thermal Management
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Available from: 2007-08-02 Created: 2007-08-02 Last updated: 2017-07-06Bibliographically approved

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Johansson, JonasBelov, IljaSäfsten, KristinaLeisner, Peter

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Johansson, JonasBelov, IljaSäfsten, KristinaLeisner, Peter
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JTH. Research area Materials and manufacturing - Surface technologyJTH. Research area Robust Embedded SystemsJTH. Research area Industrial Engineering and Management
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