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Thermal design evaluation of an electronic module for helicopter applications
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH. Research area Industrial Engineering and Management.ORCID iD: 0000-0002-0216-4493
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.ORCID iD: 0000-0002-7095-1907
2004 (English)Conference paper, Published paper (Other academic)
Place, publisher, year, edition, pages
2004.
National Category
Mechanical Engineering
Identifiers
URN: urn:nbn:se:hj:diva-6012OAI: oai:DiVA.org:hj-6012DiVA, id: diva2:36832
Conference
WEAG-CEPA2 Microelectronics Workshop on Thermal Management
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Available from: 2007-08-02 Created: 2007-08-02 Last updated: 2018-09-19Bibliographically approved

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Johansson, JonasBelov, IljaSäfsten, KristinaLeisner, Peter

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Johansson, JonasBelov, IljaSäfsten, KristinaLeisner, Peter
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JTH. Research area Materials and manufacturing - Surface technologyJTH. Research area Robust Embedded SystemsJTH. Research area Industrial Engineering and Management
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