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Application of simulation-based decision making in product development of an RF module
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.ORCID iD: 0000-0002-7095-1907
2004 (English)In: 5th IEEE conference in Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems: EuroSimE 2004, 2004, p. 233-240Conference paper, Published paper (Refereed)
Abstract [en]

This paper presents results of simulation-based design evaluation for thermal and thermo-mechanical performance and cost of packaging technology of an RF module for automotive applications. A combination of thermal, thermo-mechanical and cost analysis within the multi-attribute decision making framework enabled design ranking and revealed two MCM-L/D (multi-chip module-laminate/deposition) and MCM-D (deposition) designs with the wire bonding assembly preferred for use in automotive applications for different temperature environments. Simulation-based design guidelines were developed for designing electronic modules exhibiting good thermal and thermo-mechanical performance. By application-based partitioning of the importance weights assigned to the reliability and cost criteria, the guidelines were extended to cover other application areas.

Place, publisher, year, edition, pages
2004. p. 233-240
National Category
Reliability and Maintenance Manufacturing, Surface and Joining Technology Computational Mathematics
Identifiers
URN: urn:nbn:se:hj:diva-6006DOI: 10.1109/ESIME.2004.1304045ISBN: ISBN 0-7803-8420-2 (print)OAI: oai:DiVA.org:hj-6006DiVA, id: diva2:36826
Conference
EuroSimE 2004
Note

Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011

Available from: 2007-08-03 Created: 2007-08-03 Last updated: 2018-09-19Bibliographically approved

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Lindgren, MatsBelov, IljaLeisner, Peter

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JTH. Research area Materials and manufacturing - Surface technologyJTH. Research area Robust Embedded Systems
Reliability and MaintenanceManufacturing, Surface and Joining TechnologyComputational Mathematics

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