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Additive-free pulse reversal plating of cupper on printed circuit boards
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.ORCID iD: 0000-0002-7095-1907
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
2003 (English)In: EAST-Forum 2003, 2003Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
2003.
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Manufacturing, Surface and Joining Technology
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URN: urn:nbn:se:hj:diva-6005OAI: oai:DiVA.org:hj-6005DiVA, id: diva2:36825
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011 Available from: 2007-08-03 Created: 2007-08-03 Last updated: 2018-09-19

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Leisner, PeterBelov, Ilja

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