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Thermal and thermo-mechanical analysis for design evaluation of an automotive radar module
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.ORCID iD: 0000-0002-7095-1907
2004 (English)In: Quality and Reliability Engineering International, ISSN 0748-8017, E-ISSN 1099-1638, Vol. 20, no 7, p. 709-726Article in journal (Refereed) Published
Abstract [en]

The influence of the substrate technology, assembly method, and housing material on the thermal, thermo-mechanical and cost performance of a radar module for automotive applications has been studied to address the product reliability aspects during the design phase. Flip chip and wire bonding have been evaluated for Multi-Chip Module—Laminate/Deposition (MCM-L/D) and Multi-Chip Module—Deposition (MCM-D) substrate technologies used for electronic packaging solutions in a harsh environment. Solder ball and direct attachment have been investigated as second-level assembly. As a result of thermal and thermo-mechanical simulations and cost analysis, radar module designs combining MCM-D and MCM-L/D with wire bonding have been revealed, which are preferable for use in different temperature environments with respect to two performance criteria, the maximum junction temperature and the manufacturing cost. Simulation-based guidelines have been developed for designing radar modules used in automotive applications while satisfying temperature and stress constraints provided for the module.

Place, publisher, year, edition, pages
2004. Vol. 20, no 7, p. 709-726
National Category
Reliability and Maintenance Manufacturing, Surface and Joining Technology Computational Mathematics
Identifiers
URN: urn:nbn:se:hj:diva-5983DOI: 10.1002/qre.594OAI: oai:DiVA.org:hj-5983DiVA, id: diva2:36803
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011 Available from: 2007-08-03 Created: 2007-08-03 Last updated: 2018-09-19Bibliographically approved

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Lindgren, MatsBelov, IljaLeisner, Peter

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JTH. Research area Materials and manufacturing - Surface technologyJTH. Research area Robust Embedded Systems
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Quality and Reliability Engineering International
Reliability and MaintenanceManufacturing, Surface and Joining TechnologyComputational Mathematics

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