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CFD aided reflow oven profiling for PCB preheating in a soldering process: Part 1(2)
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. (Robust Electronics)
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. (Robust Electronics)ORCID iD: 0000-0002-7095-1907
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2007 (English)In: Electronic Environment, no 3, p. 25-28Article in journal (Other academic) Published
Place, publisher, year, edition, pages
Göteborg: Just media , 2007. no 3, p. 25-28
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Manufacturing, Surface and Joining Technology Computational Mathematics
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URN: urn:nbn:se:hj:diva-4607OAI: oai:DiVA.org:hj-4607DiVA, id: diva2:35427
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Available from: 2007-11-19 Created: 2007-11-19 Last updated: 2018-09-19Bibliographically approved

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Belov, IljaLeisner, Peter

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