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CFD aided reflow oven profiling for PCB preheating in a soldering process
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. (Rubust Electronics)
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems. (Robust Electronics)
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2007 (English)In: Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems: EuroSimE 2007, Piscataway, NJ.: IEEE , 2007, p. 535-542Conference paper, Published paper (Refereed)
Abstract [en]

A CFD-aided reflow oven profile prediction algorithm has been developed and applied to modelling of preheating of a PCB with non-uniform distribution of component thermal mass in a forced air convection solder reflow oven. The iterative algorithm combines an analytic approach with CFD modelling. It requires an experimentally validated CFD model of the solder reflow oven and a CFD model of the PCB as main inputs. Results of computational experiments have been presented to reveal good agreement between predicted PCB profiles and corresponding CFD calculations. Application guidelines contained in the description of the algorithm will assist potential users both during the virtual prototyping phase of a PCB including designing for assembly and in the phase of reflow oven profiling.

Place, publisher, year, edition, pages
Piscataway, NJ.: IEEE , 2007. p. 535-542
National Category
Manufacturing, Surface and Joining Technology Computational Mathematics
Identifiers
URN: urn:nbn:se:hj:diva-4603DOI: 10.1109/ESIME.2007.359951ISBN: 1-4244-1105-X (print)OAI: oai:DiVA.org:hj-4603DiVA, id: diva2:35423
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Available from: 2007-11-19 Created: 2007-11-19 Last updated: 2017-07-06Bibliographically approved

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Belov, IljaLeisner, Peter

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JTH. Research area Materials and manufacturing - Surface technologyJTH. Research area Robust Embedded Systems
Manufacturing, Surface and Joining TechnologyComputational Mathematics

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