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CFD Assisted Design Evaluation and Experimental Verification of a Logic-Controlled Local PCB Heater for Humidity Management in Electronics Enclosure
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
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2010 (English)In: IEEE EuroSimE 2010, 26-28 April, Bordeaux, France, 2010Conference paper, (Refereed)
Abstract [en]

Humidity management of commercial-of-the-shelf electronic components in non-controlled climatic environments can be realized e.g. by introducing a local printed circuit board heater. By choosing appropriate size and location of the heater plate in the vicinity of the critical electronic packages, and utilizing logic control function, it is possible to improve the quality of local humidity management and reduce power consumption of the heater, which is important especially in case of battery driven portable or vehicle mounted devices. A computational fluid dynamics assisted methodology has been developed to determine the best feasible design of the heater, followed by experimental verification of the constructed logic controlled heater. The experiment has been performed in a harsh climatic environment including temperature variation from +33°C to +40°C, and relative humidity variation from 54% to 80%. Analysis of the experimental %RH and temperature curves as well as power profile of the heater has confirmed the feasibility of the chosen approach to maintain greater than 9°C difference between the electronics package surface temperature and the local dew point temperature, by applying discrete power pulses with the amplitude less than 6 W.

Place, publisher, year, edition, pages
2010.
National Category
Mechanical Engineering Computational Mathematics Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:hj:diva-12386DOI: 10.1109/ESIME.2010.5464561ISBN: 978-1-4244-7026-6 (print)OAI: oai:DiVA.org:hj-12386DiVA: diva2:322160
Conference
EuroSimE 2010
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Available from: 2010-06-03 Created: 2010-06-03 Last updated: 2017-07-06Bibliographically approved

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CiteExportLink to record
Permanent link

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Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
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  • fi-FI
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  • Other locale
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Output format
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