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Pulse plating of copper on printed circuit boards
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.ORCID iD: 0000-0002-7095-1907
2012 (English)In: Pulse Plating: including 25 tables / [ed] W. Hansal & S. Roy, Eugen G. Leuze Verlag , 2012Chapter in book (Refereed)
Place, publisher, year, edition, pages
Eugen G. Leuze Verlag , 2012.
National Category
Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:hj:diva-10715ISBN: 978-3-87480-265-9 (print)OAI: oai:DiVA.org:hj-10715DiVA, id: diva2:273495
Note

Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011

Available from: 2009-10-21 Created: 2009-10-21 Last updated: 2018-09-19Bibliographically approved

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Leisner, Peter

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