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Pulse reversal plating of copper for electronics applications
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.ORCID iD: 0000-0002-7095-1907
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
2006 (English)Conference paper, Published paper (Other academic)
Place, publisher, year, edition, pages
2006.
National Category
Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:hj:diva-10710OAI: oai:DiVA.org:hj-10710DiVA, id: diva2:273484
Conference
1st European Pulse Plating Seminar, Vienna, March 2006
Note

Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011

Available from: 2009-10-21 Created: 2009-10-21 Last updated: 2018-09-19Bibliographically approved

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Leisner, Peter

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