ECPR ElectroChemical Pattern Replication : Metal Printing for Advanced Package Applications

Möller, Patrick; Fredenberg, Mikael; Nilsson, P-W; Karlsson, L.; Pelzer, R.; Lee, D.

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ECPR ElectroChemical Pattern Replication: Metal Printing for Advanced Package Applications

Möller, Patrick

Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.

Fredenberg, Mikael

Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.

Nilsson, P-W

Karlsson, L.

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2004 (English)In: Proceedings of the 6th Electronics Packaging Technology Conference, EPTC 2004 : 8 - 10 December 2004, Pan Pacific Hotel, Singapore, Piscataway, NJ.: IEEE , 2004, p. 294-297Conference paper, Published paper (Refereed)

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Piscataway, NJ.: IEEE , 2004. p. 294-297

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URN: urn:nbn:se:hj:diva-10707ISBN: 0-7803-8821-6 (print)OAI: oai:DiVA.org:hj-10707DiVA, id: diva2:273480

Available from: 2009-10-21 Created: 2009-10-21 Last updated: 2010-03-10Bibliographically approved

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