Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Multi-disciplinary Approach to Design of a Power Electronics Module for Harsh Environments
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
Jönköping University, School of Engineering, JTH, Computer and Electrical Engineering.
Show others and affiliations
2009 (English)In: Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009: EuroSime 2009, 2009, p. 1-8Conference paper, Published paper (Refereed)
Abstract [en]

A set of experimental and computer simulation methods has been applied to reliability analysis of a newly designed resin transfer molded power electronics module for automotive applications, comprising the glass-fiber epoxy multi-layer PCB, populated with various electronic packages. Evaluation of thermo-mechanical stability, determination of moisture ingress, and testing the adhesion quality between the molding compound and the module PCB have been performed along with investigation of heat transfer paths in the module. The experiments in harsh environments have revealed thermo-mechanical stability and acceptable moisture ingress for the module test samples with relatively large BGA components on the glass-fiber epoxy PCBs of different thickness and different solder mask types. Thermal images of the module have been obtained and the CFD model was created and validated with temperature measurements in power-on tests. Extreme heat dissipation modes have been studied by modeling.

Place, publisher, year, edition, pages
2009. p. 1-8
National Category
Mechanical Engineering Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:hj:diva-10692DOI: 10.1109/ESIME.2009.4938500ISBN: 978-1-4244-4160-0 (print)OAI: oai:DiVA.org:hj-10692DiVA, id: diva2:273237
Conference
IEEE EuroSime 2009, Delft, The Netherlands, 27-29/4, 2009
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011 Available from: 2009-10-20 Created: 2009-10-20 Last updated: 2018-09-19Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full text

Authority records BETA

Belov, IljaJohansson, AlfLeisner, Peter

Search in DiVA

By author/editor
Belov, IljaJohansson, AlfLeisner, Peter
By organisation
JTH. Research area Materials and manufacturing - Surface technologyJTH. Research area Robust Embedded SystemsJTH, Computer and Electrical Engineering
Mechanical EngineeringManufacturing, Surface and Joining Technology

Search outside of DiVA

GoogleGoogle Scholar

doi
isbn
urn-nbn

Altmetric score

doi
isbn
urn-nbn
Total: 363 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf