Multi-disciplinary Approach to Design of a Power Electronics Module for Harsh EnvironmentsShow others and affiliations
2009 (English)In: Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009: EuroSime 2009, 2009, p. 1-8Conference paper, Published paper (Refereed)
Abstract [en]
A set of experimental and computer simulation methods has been applied to reliability analysis of a newly designed resin transfer molded power electronics module for automotive applications, comprising the glass-fiber epoxy multi-layer PCB, populated with various electronic packages. Evaluation of thermo-mechanical stability, determination of moisture ingress, and testing the adhesion quality between the molding compound and the module PCB have been performed along with investigation of heat transfer paths in the module. The experiments in harsh environments have revealed thermo-mechanical stability and acceptable moisture ingress for the module test samples with relatively large BGA components on the glass-fiber epoxy PCBs of different thickness and different solder mask types. Thermal images of the module have been obtained and the CFD model was created and validated with temperature measurements in power-on tests. Extreme heat dissipation modes have been studied by modeling.
Place, publisher, year, edition, pages
2009. p. 1-8
National Category
Mechanical Engineering Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:hj:diva-10692DOI: 10.1109/ESIME.2009.4938500ISBN: 978-1-4244-4160-0 (print)OAI: oai:DiVA.org:hj-10692DiVA, id: diva2:273237
Conference
IEEE EuroSime 2009, Delft, The Netherlands, 27-29/4, 2009
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01
Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011
2009-10-202009-10-202018-09-19Bibliographically approved