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Influence of process parameters on crack formation in direct current and pulse reversal plated hard chromium
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.ORCID iD: 0000-0002-7095-1907
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.
2009 (English)In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 87, no 2, p. 90-96Article in journal (Refereed) Published
Abstract [en]

It has for a long time been known that crack free chromium coatings can be obtained by pulse reversal plating, but it has only much later been understood that reoxidation of hydrogen from the surface during the anodic periods is essential for obtaining crack free deposits. In this paper, it is shown that a specific anodic charge depending on the charge of the previous cathodic pulse is needed to obtain a crack free coating and that residual stress in the coating will be less at more frequent current reversals. Furthermore, too large an anodic charge will result in redissolution of chromium and thereby decrease the current efficiency.

Place, publisher, year, edition, pages
2009. Vol. 87, no 2, p. 90-96
National Category
Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:hj:diva-10691DOI: 10.1179/174591909X424078OAI: oai:DiVA.org:hj-10691DiVA, id: diva2:273236
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011 Available from: 2009-10-20 Created: 2009-10-20 Last updated: 2018-09-19Bibliographically approved

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Leisner, PeterBelov, Ilja

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JTH. Research area Materials and manufacturing - Surface technologyJTH. Research area Robust Embedded Systems
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