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Electrochemically based low-cost high precision processing in MOEMS packaging
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH. Research area Robust Embedded Systems.ORCID iD: 0000-0002-7095-1907
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2009 (English)In: Electrochimica Acta, ISSN 0013-4686, E-ISSN 1873-3859, Vol. 54, no 9, p. 2458-2465Article in journal (Refereed) Published
Abstract [en]

Precision processing in MOEMS (micro-opto-electromechanical systems) packaging has been studied based on electrochemical processes with the purpose of establishing technology for low-cost multifunctional encapsulation of microsystems and assembly of opto-electric access links in polymer.

The electrochemically based processes studied in this paper include:

1.Electroforming of a polymer moulding tool (stamper) in a nickel sulphamate electrolyte on a high-precision 3D etched silicon template.

2.Patterning of 3D surfaces by an electrophoretic photoresist.

3.Precision plating of Au and Sn for self-alignment of chips by eutectic Au–Sn solder.

The results show that nickel stampers with adequately low internal stress can be electroformed on 3D silicon wafers. Furthermore, 3D polymer samples manufactured by the nickel stampers can be patterned with metal lines down to 20 μm width using electrophoretic photoresist. Finally, eutectic Au–Sn solder bumps are realized by electroplating of Au and Sn followed by reflowing, satisfying the demands on dimension and alloy composition control over a 4 in. Si wafer.

Place, publisher, year, edition, pages
2009. Vol. 54, no 9, p. 2458-2465
Keywords [en]
Electroforming, Micro-replication, 3D patterning, Self-aligning soldering, MOEMS packaging
National Category
Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:hj:diva-10688DOI: 10.1016/j.electacta.2008.03.084OAI: oai:DiVA.org:hj-10688DiVA, id: diva2:273231
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Available from: 2009-10-20 Created: 2009-10-20 Last updated: 2018-09-19Bibliographically approved

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Leisner, Peter

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JTH. Research area Materials and manufacturing - Surface technologyJTH. Research area Robust Embedded Systems
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