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Study of the effect of pulse plating parameters on the electrodeposition of NiP and NiP/SiC coatings and their microhardness values
Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
Centre for Research and Technology–Hellas, Institute for Bio-Economy and Agri-Technology, Thessaloniki, Greece.
Centre for Research and Technology–Hellas, Institute for Bio-Economy and Agri-Technology, Thessaloniki, Greece.
Jönköping University, School of Engineering, JTH, Materials and Manufacturing.ORCID iD: 0000-0003-2924-137X
2021 (English)In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 99, no 1, p. 29-37Article in journal (Refereed) Published
Abstract [en]

This study is focused on finding optimised conditions for electrodeposition of NiP and NiP/SiC coatings, which enhance the coatings' microhardness. Both the effect of particles and the effect of heat treatment at 400°C for 1 h on the microhardness of the coating were studied. The effects of pulse electrodeposition parameters including duty cycle, frequency, and peak current density on the composition of NiP and NiP/SiC composite coatings were examined, and the results were compared with those from direct current plating. Pulse plating increased the current efficiency of NiP deposition while decreasing the phosphorus content of these coatings in comparison to direct plating, resulting in higher microhardness values. It was also shown that wt.%P in NiP coating depends not only on peak current density but also on bath charge of pulse plating. Pulse plating parameters (duty cycle and frequency) and the low incorporation of SiC particles did not affect microstructure or the microhardness of the coatings, while heat treatment was the main factor that increased microhardness.

Place, publisher, year, edition, pages
Taylor & Francis, 2021. Vol. 99, no 1, p. 29-37
Keywords [en]
current efficiency, heat treatment, microhardness, microstructure, NiP/SiC, Pulse electrodeposition, Composite coatings, Electrodeposition, Electrodes, Nickel compounds, Nickel-Phosphorus, Plating, Silicon, Silicon carbide, Silicon compounds, Direct current plating, Effect of heat treatments, Effect of pulse, Optimised conditions, Peak current density, Phosphorus contents, Phosphorus compounds
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:hj:diva-51764DOI: 10.1080/00202967.2020.1819030ISI: 000608557500001Scopus ID: 2-s2.0-85099711933Local ID: HOA;intsamOAI: oai:DiVA.org:hj-51764DiVA, id: diva2:1524430
Available from: 2021-02-01 Created: 2021-02-01 Last updated: 2021-02-08Bibliographically approved

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Ahmadkhaniha, DonyaZanella, Caterina

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