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Dynamic precipitation at elevated temperatures in a dual-phase AlCoCrFeNi high-entropy alloy: an in situ study
Jönköping University, School of Engineering, JTH, Materials and Manufacturing.ORCID iD: 0000-0002-7527-719X
Department of Materials Science and Engineering, Indian Institute of Technology, Kanpur, India.
Department of Materials Science and Engineering, Indian Institute of Technology, Kanpur, India.
Department of Materials Science and Engineering, Indian Institute of Technology, Kanpur, India.
2018 (English)In: Philosophical Magazine Letters, ISSN 0950-0839, E-ISSN 1362-3036, Vol. 98, no 9, p. 400-409Article in journal (Refereed) Published
Sustainable development
Sustainable Development
Abstract [en]

The effect of a possible phase transformation or precipitation of the face-centred cubic (FCC) phase on intermediate-temperature deformation of a dual-phase AlCoCrFeNi high-entropy alloy has been studied using in situ tensile testing at 550°C. Electron backscatter diffraction (EBSD) results showed localised precipitation of the FCC phase during the intermediate-temperature deformation. The overall fracture behaviour and crack propagation of the material was not altered much compared to the room-temperature behaviour, namely brittle trans-granular fracture. Deformation at higher temperatures (above 750°C) is suggested as a way to enhance the dynamic FCC phase precipitation, in order to improve the ductility or deformability of the alloy. 

Place, publisher, year, edition, pages
Taylor & Francis, 2018. Vol. 98, no 9, p. 400-409
Keywords [en]
AlCoCrFeNi, crack propagation, EBSD, fracture, precipitation, Aluminum alloys, Chromium alloys, Cobalt alloys, Cracks, Deformation, Entropy, Iron alloys, Metal testing, Tensile testing, Dynamic precipitation, Electron back scatter diffraction, Elevated temperature, High entropy alloys, In-situ tensile testing, Intermediate temperatures, Precipitation (chemical)
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:hj:diva-42886DOI: 10.1080/09500839.2018.1563728ISI: 000457092900004Scopus ID: 2-s2.0-85059606076Local ID: HOA JTH 2018;JTHMaterialISOAI: oai:DiVA.org:hj-42886DiVA, id: diva2:1286187
Available from: 2019-02-06 Created: 2019-02-06 Last updated: 2022-08-24Bibliographically approved

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Ghassemali, Ehsan

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