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Application of Assaf panel for evaluating throwing power of pulse reverse electroplating on complex geometries
Jönköping University, School of Engineering, JTH, Materials and Manufacturing. RISE Res Inst Sweden, Elect Dept, Borås, Sweden.ORCID iD: 0000-0002-7095-1907
Jönköping University, School of Engineering, JTH, Materials and Manufacturing.ORCID iD: 0000-0003-2924-137X
2018 (English)In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 96, no 5, p. 258-264Article in journal (Refereed) Published
Abstract [en]

The Assaf panel arrangement was used for evaluating pulse reverse plating processes and optimisation of the throwing power (TP) of complex three-dimensional (3D) geometries. Two different electroplating processes were investigated: an acid copper bath and a cyanide silver bath without additives. It has not been possible to establish a direct correlation factor for TP obtained with the Assaf panel and the 3D objects included in the trials. Nevertheless, the Assaf panel was found to be a useful tool for preliminary process parameter optimisation. The copper bath needs agitation to deposit coatings of good quality, whereas the silver bath obtains the best throwing power without agitation. The latter is probably due to inhibition by adsorbed cyanide.

Place, publisher, year, edition, pages
Taylor & Francis, 2018. Vol. 96, no 5, p. 258-264
Keywords [en]
Throwing power; pulse reverse; silver; copper
National Category
Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:hj:diva-41719DOI: 10.1080/00202967.2018.1507331ISI: 000444095300006Scopus ID: 2-s2.0-85053235016Local ID: PP JTH 2018 embargo 12OAI: oai:DiVA.org:hj-41719DiVA, id: diva2:1252689
Available from: 2018-10-02 Created: 2018-10-02 Last updated: 2019-09-10Bibliographically approved

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Leisner, PeterZanella, Caterina

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Citation style
  • apa
  • harvard1
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  • de-DE
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