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Experimental and CFD evaluation of active anti-condensation methods for non-hermetic cabinets
Jönköping University, School of Engineering, JTH, Materials and Manufacturing. Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
Jönköping University, School of Engineering, JTH, Materials and Manufacturing. Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
Omnisys Instruments AB, Västra Frölunda, Sweden.
Saab AB, Göteborg, Sweden.
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2018 (English)In: 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE, 2018, Institute of Electrical and Electronics Engineers (IEEE), 2018, p. 1-6Conference paper, Published paper (Refereed)
Abstract [en]

Experimental evaluation of several active anti-condensation methods for application in non-hermetic electronics enclosures was performed in harsh climatic conditions, including RH = 70% and T = 43 °C. The studied methods included blowing the air along the exposed surface, combination of blowing and air heating as well as local heating of the exposed surface in natural convection conditions. The purpose was to prevent/remove the dew on/from the exposed surface of a micro-condensation sensor. The difference between the methods was quantified in terms of time for dew removal. The power consumption aspects were discussed. A CFD based optimization methodology was developed to determine the heating profiles for the local anti-condensation PCB heater in a non-hermetic cabinet exposed to the quickly changing climatic conditions. The potential for 60% energy savings was revealed by simulation.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2018. p. 1-6
Keywords [en]
Heating systems, Surface treatment, Humidity, Plastics, Electron tubes, Temperature measurement, Bars
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:hj:diva-40927DOI: 10.1109/EuroSimE.2018.8369863Scopus ID: 2-s2.0-85048877385ISBN: 9781538623596 OAI: oai:DiVA.org:hj-40927DiVA, id: diva2:1230370
Conference
19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018, 15 April 2018 through 18 April 2018
Available from: 2018-07-03 Created: 2018-07-03 Last updated: 2018-07-03Bibliographically approved

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Belov, IljaLeisner, Peter

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