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Thermal resistance and temperature distribution in blue and white high-power LED arrays
SHM R&E Center, RAS, St.Petersburg, Russia.
SHM R&E Center, RAS, St.Petersburg, Russia.
Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
SHM R&E Center, RAS, St.Petersburg, Russia.
2017 (English)In: Proceedings of the 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2017, IEEE, 2017, p. 1-4, article id Code 132094Conference paper, Published paper (Refereed)
Abstract [en]

Thermal resistance and temperature distribution for high-power AlGaInN LED chip-on-board arrays in blue and white versions were measured by different methods and tools. The p-n junction temperature was determined through measuring a temperature-dependent forward voltage drop on the p-n junction, at a low measuring current after applying a high heating current. Furthermore, the infrared thermal imaging technique was employed to obtain the temperature map for the test object. A steady-state 3D computational model of the experimental setup was created including temperature-dependent power dissipation in the LED chips and partitioned interfacial thermal resistance between the heatsink and the LED array. Simulations of the heat transfer in the LED array were performed to further investigate temperature gradients observed in the measurements.

Place, publisher, year, edition, pages
IEEE, 2017. p. 1-4, article id Code 132094
Keywords [en]
Aluminum compounds, Gallium compounds, Heat transfer, Indium compounds, Infrared imaging, Integrated circuits, Semiconductor junctions, Temperature distribution, Blue and whites, Computational model, Forward voltage drops, Heating current, High-power LED arrays, Infrared thermal imaging, Interfacial thermal resistance, Temperature dependent, Light emitting diodes
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:hj:diva-38685DOI: 10.1109/THERMINIC.2017.8233814Scopus ID: 2-s2.0-85045835540ISBN: 9781538619285 (electronic)ISBN: 9781538619292 (print)OAI: oai:DiVA.org:hj-38685DiVA, id: diva2:1178362
Conference
23rd International Workshop on Thermal Investigations of ICs and Systems, 27-29 September 2017, Amsterdam, the Netherlands
Available from: 2018-01-29 Created: 2018-01-29 Last updated: 2018-09-19Bibliographically approved

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Belov, Ilja

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