Control of silver throwing power by pulse reverse electroplating
2017 (English)In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, Vol. 95, no 1, 25-30 p.Article in journal (Refereed) Published
The influence of electroplating parameters on throwing power (TP) is studied in additive-free silver cyanide solutions under direct current and pulse reverse electroplating conditions. It is found that the best TP is obtained when no agitation of the electrolyte is applied. The most important parameters for controlling the TP are the cathodic current density, the anodic to cathodic charge ratio, and the ratio between the anodic and cathodic current densities. Guidelines for process optimisation are given.
Place, publisher, year, edition, pages
Taylor & Francis, 2017. Vol. 95, no 1, 25-30 p.
Agitation, Pulse reverse electrodeposition, Silver, Throwing power, Electrolytes, Electroplating, Optimization, Cathodic charge, Cathodic current density, Direct current, Process optimisation, Pulse-reverse electrodeposition, Silver cyanide, Electroplating solutions
IdentifiersURN: urn:nbn:se:hj:diva-35017DOI: 10.1080/00202967.2017.1260895ScopusID: 2-s2.0-85009956051Local ID: JTHMaterialISOAI: oai:DiVA.org:hj-35017DiVA: diva2:1071922