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Fin‐Tube and Plate Heat Exchangers: Evaluation of Transient Performance
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
Jönköping University, School of Engineering, JTH, Product Development. Jönköping University, School of Engineering, JTH. Research area Product Development - Simulation and Optimization.ORCID iD: 0000-0003-0899-8939
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH, Materials and Manufacturing.ORCID iD: 0000-0002-7095-1907
2017 (English)Conference paper, Published paper (Refereed)
Abstract [en]

A methodology for evaluation of transient performance of, and comparison between plate heat exchanger and plate-fin-and-tube heat exchanger was developed and realized, including experiment and 3-D simulation. Heat transfer from water to a gas medium was addressed. The heated gas volume was the same for both heat exchanger designs. This was achieved by placing the plate-fin-and-tube heat exchanger into enclosure. The volume average temperature of the gas as function of time was computed. Estimated material cost for the studied designs was at least seven times lower than for the stainless steel plate heat exchanger. The performance of the selected plate-fin-and-tube heat exchanger design was found comparable to the plate heat exchanger, when both fin and tube materials were set to Al, and the enclosure was a light-weight thermal insulator. Transient behavior of the studied heat exchangers should be of interest for micro-grid applications, but also for thermal management in electronic cabinets and data centers.

Place, publisher, year, edition, pages
IEEE, 2017.
National Category
Engineering and Technology Materials Engineering
Identifiers
URN: urn:nbn:se:hj:diva-34638DOI: 10.1109/EuroSimE.2017.7926214ISI: 000403217700003Scopus ID: 2-s2.0-85020206472ISBN: 978-1-5090-4344-6 (electronic)ISBN: 978-1-5090-4343-9 (print)ISBN: 978-1-5090-4345-3 (print)OAI: oai:DiVA.org:hj-34638DiVA: diva2:1063220
Conference
18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017; Dresden; Germany; 3 April 2017 through 5 April 2017
Available from: 2017-01-09 Created: 2017-01-09 Last updated: 2017-07-10Bibliographically approved

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Belov, IljaSalomonsson, KentLeisner, Peter

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JTH. Research area Materials and manufacturing - Surface technologyJTH, Materials and ManufacturingJTH, Product DevelopmentJTH. Research area Product Development - Simulation and Optimization
Engineering and TechnologyMaterials Engineering

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