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Thermomechanical Analysis and Characterization of a Press-Pack for SiC Power Module Packaging Applications
KTH, Sweden.
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology. Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
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2017 (English)In: IEEE Transactions on Components, Packaging, and Manufacturing Technology, ISSN 2156-3950, E-ISSN 2156-3985Article in journal (Refereed) Submitted
Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2017.
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Engineering and Technology Materials Engineering
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URN: urn:nbn:se:hj:diva-34637OAI: oai:DiVA.org:hj-34637DiVA: diva2:1063184
Available from: 2017-01-09 Created: 2017-01-09 Last updated: 2017-02-09

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Belov, Ilja
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JTH. Research area Materials and manufacturing - Surface technologyJTH, Materials and Manufacturing
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