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On the Use of Conformal Cooling in High-Pressure Die-Casting and Semisolid Casting
Jönköping University, School of Engineering, JTH, Materials and Manufacturing.ORCID iD: 0000-0002-0101-0062
Uddeholms AB, Hagfors, Sweden.
Uddeholms AB, Hagfors, Sweden.
Jönköping University, School of Engineering, JTH, Materials and Manufacturing.ORCID iD: 0000-0002-0431-4352
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2021 (English)In: Technologies, E-ISSN 2227-7080, Vol. 9, no 2, article id 39Article in journal (Refereed) Published
Abstract [en]

Today, tool life in high pressure die casting (HPDC) is of growing interest. A common agreement is that die life is primarily decided by the thermal load and temperature gradients in the die materials. Conformal cooling with the growth of additive manufacturing has raised interest as a means of extending die life. In the current paper, conformal cooling channels’ performance and effect on the thermal cycle in high-pressure die casting and rheocasting are investigated for conventional HPDC and semisolid processing. It was found that conformal cooling aids die temperature reduction, and the use of die spray may be reduced and support the die-life extension. For the die filling, the increased temperature was possibly counterproductive. Instead, it was found that the main focus for conformal cooling should be focused to manage temperature around the in-let bushing and possibly the runner system. Due to the possible higher inlet pressures for semisolid casting, particular benefits could be seen.

Place, publisher, year, edition, pages
MDPI, 2021. Vol. 9, no 2, article id 39
Keywords [en]
additive manufacturing, conformal cooling, high pressure die casting, tooling, semisolid casting, heat flux, solidification, casting, component
National Category
Metallurgy and Metallic Materials
Identifiers
URN: urn:nbn:se:hj:diva-54108DOI: 10.3390/technologies9020039ISI: 000667840400001Local ID: GOA;;54108OAI: oai:DiVA.org:hj-54108DiVA, id: diva2:1580844
Funder
Knowledge Foundation, 20160327Available from: 2021-07-16 Created: 2021-07-16 Last updated: 2023-11-22Bibliographically approved

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Jarfors, Anders E.W.Zhang, QingSteggo, JacobStolt, Roland

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