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Modeling of Temperature Distribution Induced by Thermo-Mechanical Deformation of High-Power AlInGaN LED Arrays
RAS, SHM RandE Center, St. Petersburg, Russian Federation.
RAS, SHM RandE Center, St. Petersburg, Russian Federation.
Jönköping University, School of Engineering, JTH, Materials and Manufacturing.
Mordovian State University, Saransk, Russian Federation.
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2019 (English)In: THERMINIC 2019 - 2019 25th International Workshop Thermal Investigations of ICs and Systems, Institute of Electrical and Electronics Engineers Inc. , 2019Conference paper, Published paper (Refereed)
Abstract [en]

Thermo-mechanical deformation, thermal resistance, and lateral temperature distribution were experimentally studied for a high-power AlGaInN LED chip-on-board array at three different input powers. A fullscale CFD model of the LED assembly was developed and correlated with the temperature and average thermal resistance measurements to enable prediction of the temperature distribution on the surface of a thermally deformed LED assembly. Application of the thermal resistance partitioning approach to thermal modeling of the deformed LED assemblies was discussed. It can be useful for design engineers for estimation of the temperature distribution across the deformed LED array, at the minimum number of temperature measurements required for model calibration.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. , 2019.
Keywords [en]
Aluminum compounds, Deformation, Gallium compounds, Indium compounds, Integrated circuits, Temperature distribution, Temperature measurement, CFD modeling, Design engineers, High power, LED assemblies, Model calibration, Thermal model, Thermal resistance measurement, Thermomechanical deformations, Light emitting diodes
National Category
Other Materials Engineering
Identifiers
URN: urn:nbn:se:hj:diva-47732DOI: 10.1109/THERMINIC.2019.8923617Scopus ID: 2-s2.0-85078028468ISBN: 9781728120782 (print)OAI: oai:DiVA.org:hj-47732DiVA, id: diva2:1391584
Conference
25th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2019, Lecco; Italy; 25 - 27 September 2019
Available from: 2020-02-05 Created: 2020-02-05 Last updated: 2020-02-05

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Belov, Ilja

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CiteExportLink to record
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