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An experimental setup for validating a CFD model of a double-sided PCB in a sealed enclosure at various power configurations
Högskolan i Jönköping, Tekniska Högskolan, JTH. Forskningsmiljö Material och tillverkning - Ytteknik. Högskolan i Jönköping, Tekniska Högskolan, JTH. Forskningsområde Robusta inbyggda system.
Högskolan i Jönköping, Tekniska Högskolan, JTH. Forskningsmiljö Material och tillverkning - Ytteknik. Högskolan i Jönköping, Tekniska Högskolan, JTH. Forskningsområde Robusta inbyggda system.
Högskolan i Jönköping, Tekniska Högskolan, JTH. Forskningsmiljö Material och tillverkning - Ytteknik. Högskolan i Jönköping, Tekniska Högskolan, JTH. Forskningsområde Robusta inbyggda system.ORCID-id: 0000-0002-7095-1907
2005 (engelsk)Inngår i: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005: EuroSimE 2005, Piscataway, NJ: IEEE Order Department , 2005, s. 127-133Konferansepaper, Publicerat paper (Fagfellevurdert)
Abstract [en]

A flexible experimental setup enabling power control of a fully populated double-sided PCB has been realized, and is described in detail. A CFD model of a double-sided PCB housed in a sealed enclosure has been validated in a 19/spl deg/C environment by means of temperature and flow measurement. The difference between simulated and measured component temperatures has been within 10%. Potential errors both in the model and in the experiments have been discussed and their impact on temperatures has been numerically evaluated.

sted, utgiver, år, opplag, sider
Piscataway, NJ: IEEE Order Department , 2005. s. 127-133
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Identifikatorer
URN: urn:nbn:se:hj:diva-5108DOI: 10.1109/ESIME.2005.1502787ISBN: 0-7803-9062-8 (tryckt)OAI: oai:DiVA.org:hj-5108DiVA, id: diva2:35928
Konferanse
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005
Merknad
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Tilgjengelig fra: 2008-07-08 Laget: 2008-07-08 Sist oppdatert: 2018-09-19bibliografisk kontrollert
Inngår i avhandling
1. Thermal Fatigue Life Prediction of Solder Joints in Avionics by Surrogate Modeling: a Contribution to Physics of Failure in Reliability Prediction
Åpne denne publikasjonen i ny fane eller vindu >>Thermal Fatigue Life Prediction of Solder Joints in Avionics by Surrogate Modeling: a Contribution to Physics of Failure in Reliability Prediction
2013 (engelsk)Doktoravhandling, med artikler (Annet vitenskapelig)
Abstract [en]

Manufacturers of aerospace, defense, and high performance (ADHP) equipment are currently facing multiple challenges related to the reliability of electronic systems. The continuing reduction in size of electronic components combined with increasing clock frequencies and greater functionality, results in increased power density. As an effect, controlling the temperature of electronic components is central in electronic product development in order to maintain and potentially improve the reliability of the equipment. Simultaneously, the transition to lead-free electronic equipment will most probably propagate also to the ADHP industry. Compared to well-proven tin-lead solder, the knowledge about field operation reliability of lead-free solders is still limited, as well as the availability of damage evaluation models validated for field temperature conditions. Hence, the need to fill in several knowledge gaps related to reliability and reliability prediction of lead-free solder alloys is emphasized. Having perceived increasing problems experienced in the reliability of fielded equipment, the ADHP industry has suggested inclusion of physics-of-failure (PoF) in reliability prediction of electronics as one potential measure to improve the reliability of the electronic systems.

This thesis aims to contribute to the development of reliable ADHP systems, with the main focus on electronic equipment for the aerospace industry. In order to accomplish this, the thesis provides design guidelines for power distribution on a double-sided printed circuit board assembly (PBA) as a measure to improve the thermal performance without increasing the weight of the system, and a novel, computationally efficient method for PoF-based evaluation of damage accumulation in solder joints in harsh, non-cyclic field operation temperature environments.

Thermal fatigue failure mechanisms and state‑of‑the‑art thermal design and design tools are presented, with focus on the requirements that may arise from avionic use, such as low weight, high reliability, and ability to sustain functional during high vibration levels and high g-forces. Paper I, II, and III describes an in-depth investigation that has been performed utilizing advanced thermal modeling of power distribution on a double-sided PBA as a measure to improve the thermal performance of electronic modules.

Paper IV contributes to increasing the accuracy of thermal fatigue life prediction in solder joints, by employing existing analytical models for predicting thermal fatigue life, but enhancing the prediction result by incorporating advanced thermal analysis in the procedure.

Papers V and VI suggest and elaborate on a computational method that utilizes surrogate stress and strain modeling of a solder joint, to quickly evaluate the damage accumulated in a critical solder joint from non-cyclic, non-simplified field operation temperature profiles, with accuracy comparable to finite element modeling. The method has been tested on a ball grid array package with SnAgCu solder joints. This package is included in an extensive set of accelerated tests that helps to qualify certain packages and solder alloys for avionic use. The tests include -20°C to +80°C and -55°C to +125°C thermal cycling of a statistically sound population of a number of selected packages, assembled with SnAgCu, Sn100C, and SnPbAg solder alloys. Statistical analysis of the results confirms that the SnAgCu-alloy may outperform SnPbAg solder at moderate thermal loads on the solder joints.

In Papers VII and VIII, the timeframe is extended to a future, in which validated life prediction models will be available, and the suggested method is expected to increase the accuracy of embedded prognostics of remaining useful thermal fatigue life of a critical solder joint.

The key contribution of the thesis is the added value of the proposed computational method utilized in the design phase for electronic equipment. Due to its ability for time-efficient operation on uncompressed temperature data, the method gives contribution to the accuracy, and thereby also to the credibility, of reliability prediction of electronic packages in the design phase. This especially relates to applications where thermal fatigue is a dominant contributor to the damage of solder joints.

sted, utgiver, år, opplag, sider
Linköping University Electronic Press, 2013. s. 64
Serie
Linköping studies in science and technology. Dissertations, ISSN 0345-7524 ; 1521
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Identifikatorer
urn:nbn:se:hj:diva-23017 (URN)
Tilgjengelig fra: 2014-01-13 Laget: 2014-01-09 Sist oppdatert: 2018-09-10bibliografisk kontrollert

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