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Application of CFD Modelling for Energy Efficient Humidity Mangement of an Electronics Enclosure in Storage under Severe Climatic Conditions
Högskolan i Jönköping, Tekniska Högskolan, JTH. Forskningsmiljö Material och tillverkning - Ytteknik. Högskolan i Jönköping, Tekniska Högskolan, JTH. Forskningsområde Robusta inbyggda system.
Vise andre og tillknytning
2008 (engelsk)Inngår i: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008: EuroSimE 2008., IEEE , 2008, s. 430-437Konferansepaper, Publicerat paper (Fagfellevurdert)
Abstract [en]

A CFD modelling methodology including experimental validation has been developed and applied for investigation of anti-moisture measures in a non- hermetic electronics enclosure containing a number of printed circuit boards, and placed in a severe storage environment. In the climatic test the temperature and the relative humidity have been varried from +33degC to +71degC and from 14% to 80%, respectively. Enclosure heater solutions have been parametrically studied by simulation. A heating strategy involving various power levels has been determined, which is just sufficient to maintain the internal relative humidity below 60%, thereby reducing the risk for dew formation on the electronics assembly.

sted, utgiver, år, opplag, sider
IEEE , 2008. s. 430-437
HSV kategori
Identifikatorer
URN: urn:nbn:se:hj:diva-10678DOI: 10.1109/ESIME.2008.4525069ISBN: 978-1-4244-2127-5 (tryckt)OAI: oai:DiVA.org:hj-10678DiVA, id: diva2:273208
Konferanse
EuroSimE 2008.
Merknad
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Tilgjengelig fra: 2009-10-20 Laget: 2009-10-20 Sist oppdatert: 2018-09-19bibliografisk kontrollert

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