Open this publication in new window or tab >>2007 (English)In: Twenty Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium: SEMI-THERM Proceedings 2007, San Jose, CA USA, March 18-22, 2007, Piscataway, N.J.: IEEE , 2007, p. 233-243Conference paper, Published paper (Refereed)
Abstract [en]
Thermal design aspects of an avionic module including fully populated PCBs housed in a sealed enclosure have been studied by means of computational fluid dynamics. Effect of power distribution between the sides of a double-sided PCB on the case temperature of surface-mounted components has been investigated within a proposed simulation strategy. Simulation-based guidelines have been developed for thermal design of avionic modules, regarding preferable power configuration on a double-sided PCB, representing an alternative approach to thermal management, as compared to introducing additional cooling devices.
Place, publisher, year, edition, pages
Piscataway, N.J.: IEEE, 2007
National Category
Mechanical Engineering Computational Mathematics
Identifiers
urn:nbn:se:hj:diva-6146 (URN)10.1109/STHERM.2007.352429 (DOI)1-4244-09589-4 (ISBN)
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01
Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-20112007-08-022007-08-022018-09-19Bibliographically approved