Change search
Link to record
Permanent link

Direct link
BETA
Johansson, Jonas
Publications (7 of 7) Show all publications
Johansson, J., Belov, I. & Leisner, P. (2007). CFD Analysis of an Avionic Module for Evaluating Power Distribution as a Thermal Management Measure for a Double-sided PCB. In: Twenty Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium: SEMI-THERM Proceedings 2007, San Jose, CA USA, March 18-22, 2007 (pp. 233-243). Piscataway, N.J.: IEEE
Open this publication in new window or tab >>CFD Analysis of an Avionic Module for Evaluating Power Distribution as a Thermal Management Measure for a Double-sided PCB
2007 (English)In: Twenty Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium: SEMI-THERM Proceedings 2007, San Jose, CA USA, March 18-22, 2007, Piscataway, N.J.: IEEE , 2007, p. 233-243Conference paper, Published paper (Refereed)
Abstract [en]

Thermal design aspects of an avionic module including fully populated PCBs housed in a sealed enclosure have been studied by means of computational fluid dynamics. Effect of power distribution between the sides of a double-sided PCB on the case temperature of surface-mounted components has been investigated within a proposed simulation strategy. Simulation-based guidelines have been developed for thermal design of avionic modules, regarding preferable power configuration on a double-sided PCB, representing an alternative approach to thermal management, as compared to introducing additional cooling devices.

Place, publisher, year, edition, pages
Piscataway, N.J.: IEEE, 2007
National Category
Mechanical Engineering Computational Mathematics
Identifiers
urn:nbn:se:hj:diva-6146 (URN)10.1109/STHERM.2007.352429 (DOI)1-4244-09589-4 (ISBN)
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Available from: 2007-08-02 Created: 2007-08-02 Last updated: 2018-09-19Bibliographically approved
Johansson, J., Leisner, P., Lee, J. C., Twigg, D. W. & Rassaian, M. (2007). On thermomechanical durability analysis combined with computational fluid dynamics thermal analysis. In: Volume 5: Electronics and Photonics. Paper presented at ASME 2007 International Mechanical Engineering Congress and Exposition (IMECE2007) November 11–15, 2007 , Seattle, Washington, USA (pp. 233-240).
Open this publication in new window or tab >>On thermomechanical durability analysis combined with computational fluid dynamics thermal analysis
Show others...
2007 (English)In: Volume 5: Electronics and Photonics, 2007, p. 233-240Conference paper, Published paper (Refereed)
Abstract [en]

Results are presented on durability analysis of an electronic module subjected to thermal and power cycles, and vibration. A hierarchical analysis process for analyzing the durability of the module is described. The initial step is a transient thermal analysis of the unit in which the module is located. The three operating modes of the unit are modeled and analyzed using acommercially available computational fluid dynamics (CFD) tool. The tool generates a time history of the temperature at all points within the unit and module. The second step comprises exporting temperatures from the transient temperature analysis to a durability prediction tool. The temperatures calculated by the global analysis are mapped to the printed wiring assembly (PWA) mounted within the box, yielding the temperature distribution of the PWA as functions of time. The durability tool utilizes a modified Coffin Manson formula together with the transient temperature profile to estimate the durability of each lead and solder joint included in the module. Thermomechanical fatigue level of leads and solder joints within the unit are reported as a cumulative damage index (CDI). The CDI is the ratio of the number of cycles required for the test item to endure under a life time to the number of cycles the item is predicted to sustain before failure. Durability analysis of solder joint due to vibration is performed separately. The environment is specified according to the location where the unit is mounted. CDI due to vibration is added to form an overall CDI based on Miner's rule.

National Category
Mechanical Engineering
Identifiers
urn:nbn:se:hj:diva-5194 (URN)10.1115/IMECE2007-41254 (DOI)0-7918-4299-1 (ISBN)
Conference
ASME 2007 International Mechanical Engineering Congress and Exposition (IMECE2007) November 11–15, 2007 , Seattle, Washington, USA
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011 Available from: 2008-01-09 Created: 2008-01-09 Last updated: 2018-09-19Bibliographically approved
Johansson, J., Belov, I. & Leisner, P. (2005). An experimental setup for validating a CFD model of a double-sided PCB in a sealed enclosure at various power configurations. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005: EuroSimE 2005. Paper presented at Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (pp. 127-133). Piscataway, NJ: IEEE Order Department
Open this publication in new window or tab >>An experimental setup for validating a CFD model of a double-sided PCB in a sealed enclosure at various power configurations
2005 (English)In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005: EuroSimE 2005, Piscataway, NJ: IEEE Order Department , 2005, p. 127-133Conference paper, Published paper (Refereed)
Abstract [en]

A flexible experimental setup enabling power control of a fully populated double-sided PCB has been realized, and is described in detail. A CFD model of a double-sided PCB housed in a sealed enclosure has been validated in a 19/spl deg/C environment by means of temperature and flow measurement. The difference between simulated and measured component temperatures has been within 10%. Potential errors both in the model and in the experiments have been discussed and their impact on temperatures has been numerically evaluated.

Place, publisher, year, edition, pages
Piscataway, NJ: IEEE Order Department, 2005
National Category
Mechanical Engineering Computational Mathematics
Identifiers
urn:nbn:se:hj:diva-5108 (URN)10.1109/ESIME.2005.1502787 (DOI)0-7803-9062-8 (ISBN)
Conference
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Available from: 2008-07-08 Created: 2008-07-08 Last updated: 2018-09-19Bibliographically approved
Johansson, J., Belov, I. & Leisner, P. (2005). Investigating the effect of power distribution on cooling a double-sided PCB: Numerical simulation and experiment. In: Heat Transfer: Volume 4. Paper presented at ASME Summer Heat Transfer Conference 2005 (pp. 649).
Open this publication in new window or tab >>Investigating the effect of power distribution on cooling a double-sided PCB: Numerical simulation and experiment
2005 (English)In: Heat Transfer: Volume 4, 2005, p. 649-Conference paper, Published paper (Refereed)
Abstract [en]

Anexperimental procedure for investigating the effect of power distribution onthe cooling of a double-sided PCB is implemented. A numberof computational fluid dynamics (CFD) models are validated by laboratoryexperiments performed in 19.5°C temperature environment. Case temperatures of surface-mountedcomponents fully populating the PCB sides are measured and monitoredin simulations. Different combinations of power distribution with other coolingmethods, such as a heatsink tooled on a sealed oropen enclosure, at natural or forced convection, are studied. Thermallyefficient uniform and non-uniform power configurations are determined on adouble sided PCB. It is concluded that managing power distributionon a double-sided PCB can be considered as a measureto improve the thermal performance of electronic modules.

National Category
Mechanical Engineering
Identifiers
urn:nbn:se:hj:diva-6032 (URN)0-7918-4734-9 (ISBN)
Conference
ASME Summer Heat Transfer Conference 2005
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Available from: 2007-08-02 Created: 2007-08-02 Last updated: 2018-09-19Bibliographically approved
Johansson, J. (2005). Thermal Management of Electronics in Avionics Applications. (Licentiate dissertation). Linköping: Department of Science and Technology, Linköpings Universitet
Open this publication in new window or tab >>Thermal Management of Electronics in Avionics Applications
2005 (English)Licentiate thesis, monograph (Other academic)
Place, publisher, year, edition, pages
Linköping: Department of Science and Technology, Linköpings Universitet, 2005. p. 39
Series
Linköping Studies in Science and Technology, ISSN 0280-7971 ; 1177
Identifiers
urn:nbn:se:hj:diva-6190 (URN)91-85299-77-4 (ISBN)
Presentation
(English)
Available from: 2008-07-08 Created: 2008-07-08
Johansson, J., Belov, I., Säfsten, K. & Leisner, P. (2004). Thermal Analysis of an Electronic Module with a Double-sided PCB Housed in a 2-MCU Enclosure for Avionic Applications. In: Proceedings: 2004 International Symposium on Microelectronics, November 14-18, 2004, Long Beach Convention Center, Long Beach, Ca. Paper presented at 2004 International Symposium on Microelectronics, November 14-18, 2004, Long Beach Convention Center, Long Beach, Ca. Washington, D.C.: IMAPS--International Microelectronics and Packaging Society
Open this publication in new window or tab >>Thermal Analysis of an Electronic Module with a Double-sided PCB Housed in a 2-MCU Enclosure for Avionic Applications
2004 (English)In: Proceedings: 2004 International Symposium on Microelectronics, November 14-18, 2004, Long Beach Convention Center, Long Beach, Ca, Washington, D.C.: IMAPS--International Microelectronics and Packaging Society , 2004Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
Washington, D.C.: IMAPS--International Microelectronics and Packaging Society, 2004
National Category
Mechanical Engineering
Identifiers
urn:nbn:se:hj:diva-6027 (URN)0-930815-74-2 (ISBN)
Conference
2004 International Symposium on Microelectronics, November 14-18, 2004, Long Beach Convention Center, Long Beach, Ca
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Available from: 2007-08-02 Created: 2007-08-02 Last updated: 2018-09-19Bibliographically approved
Johansson, J., Belov, I., Säfsten, K. & Leisner, P. (2004). Thermal design evaluation of an electronic module for helicopter applications. Paper presented at WEAG-CEPA2 Microelectronics Workshop on Thermal Management.
Open this publication in new window or tab >>Thermal design evaluation of an electronic module for helicopter applications
2004 (English)Conference paper, Published paper (Other academic)
National Category
Mechanical Engineering
Identifiers
urn:nbn:se:hj:diva-6012 (URN)
Conference
WEAG-CEPA2 Microelectronics Workshop on Thermal Management
Note
Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011Available from: 2007-08-02 Created: 2007-08-02 Last updated: 2018-09-19Bibliographically approved
Organisations

Search in DiVA

Show all publications