This paper presents an ultra low power wireless insole sensor biofeedback and gait analysis system for rehabilitation of balance control for post stroke patients and gait related rehabilitation. The system integrates ANT wireless protocol, a wireless home E-health care sensor network and open-source mobile devices technology. The paper also presents methods to time synchronize the two sole sensors. The system has been evaluated and it shows good performance in power consumption, communication latency and coexistence with WiFi/Bluetooth/GSM.

Passive UHF RFID systems using Dynamic Frame-Slotted ALOHA (DFSA) adjust the frame size according to the number of tags, but frame size N is equals to 2^Q and cannot be adjusted exactly to the number of tags to be identified. In this paper, we propose an optimal Aloha algorithm (ODFSA), which uses probabilistic approach for tags to access the frame. The Query or Query Adjust packet contains both the parameter Q and P called frame access probability, which represents the ratio of number of active tags in the current frame to the estimated total number of tags which remain to be identified in the system. Estimation of number of unread tags is updated after end of each frame; parameters Q and P are calculated and informed at the beginning of each frame. Mathematical analysis and computer simulations show that the proposed Aloha achieves maximum system efficiency, utilizes less number of slots compared with other algorithms and also takes less identification time.

An active inductor based on an improved gyrator circuit is proposed. The active inductor is developed to be implemented in a high impedance transceiver for a wearable DC power line communication network where requirements such as low power consumption, high bandwidth and numerous nodes support are prioritized. A load isolation step is introduced to ensure the stability of the active inductance's size on different load currents. The proposed gyrator circuit is analyzed and optimized by means of theoretical calculations. The theoretical results are then verified by simulations and experiments in the frequency range up to 10 MHz.

A set of experimental and computer simulation methods has been applied to reliability analysis of a newly designed resin transfer molded power electronics module for automotive applications, comprising the glass-fiber epoxy multi-layer PCB, populated with various electronic packages. Evaluation of thermo-mechanical stability, determination of moisture ingress, and testing the adhesion quality between the molding compound and the module PCB have been performed along with investigation of heat transfer paths in the module. The experiments in harsh environments have revealed thermo-mechanical stability and acceptable moisture ingress for the module test samples with relatively large BGA components on the glass-fiber epoxy PCBs of different thickness and different solder mask types. Thermal images of the module have been obtained and the CFD model was created and validated with temperature measurements in power-on tests. Extreme heat dissipation modes have been studied by modeling.