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Belov, Ilja
Alternative names
Publications (10 of 82) Show all publications
Belov, I., Alavizadeh, Z., Lindgren, M., Ryden, J. & Leisner, P. (2018). Experimental and CFD evaluation of active anti-condensation methods for non-hermetic cabinets. In: 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE, 2018: . Paper presented at 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018, 15 April 2018 through 18 April 2018 (pp. 1-6). Institute of Electrical and Electronics Engineers (IEEE)
Open this publication in new window or tab >>Experimental and CFD evaluation of active anti-condensation methods for non-hermetic cabinets
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2018 (English)In: 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE, 2018, Institute of Electrical and Electronics Engineers (IEEE), 2018, p. 1-6Conference paper, Published paper (Refereed)
Abstract [en]

Experimental evaluation of several active anti-condensation methods for application in non-hermetic electronics enclosures was performed in harsh climatic conditions, including RH = 70% and T = 43 °C. The studied methods included blowing the air along the exposed surface, combination of blowing and air heating as well as local heating of the exposed surface in natural convection conditions. The purpose was to prevent/remove the dew on/from the exposed surface of a micro-condensation sensor. The difference between the methods was quantified in terms of time for dew removal. The power consumption aspects were discussed. A CFD based optimization methodology was developed to determine the heating profiles for the local anti-condensation PCB heater in a non-hermetic cabinet exposed to the quickly changing climatic conditions. The potential for 60% energy savings was revealed by simulation.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2018
Keywords
Heating systems, Surface treatment, Humidity, Plastics, Electron tubes, Temperature measurement, Bars
National Category
Materials Engineering
Identifiers
urn:nbn:se:hj:diva-40927 (URN)10.1109/EuroSimE.2018.8369863 (DOI)2-s2.0-85048877385 (Scopus ID)9781538623596 (ISBN)
Conference
19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018, 15 April 2018 through 18 April 2018
Available from: 2018-07-03 Created: 2018-07-03 Last updated: 2018-09-19Bibliographically approved
Belov, V., Leisner, P., Mannikoff, A. & Belov, I. (2018). Mathematical Model of Multi-Phase Power Converter for Parallel Computation. International Journal of Emerging Electric Power Systems, 19(1), Article ID 20170114.
Open this publication in new window or tab >>Mathematical Model of Multi-Phase Power Converter for Parallel Computation
2018 (English)In: International Journal of Emerging Electric Power Systems, ISSN 2194-5756, E-ISSN 1553-779X, Vol. 19, no 1, article id 20170114Article in journal (Refereed) Published
Abstract [en]

A mathematical model of a multi-phase power conversion system composed of modified bridge-elements (B-system) capable for parallel computation has been developed. Experimental validation on the example of a power system including a synchronous generator and an AC-DC rectifier has been performed. A mathematical algorithm for B-system assembly and steps to obtain mathematical model of the B-system have been developed. Integration of mathematical models of conversion system into the complete model of a multi-phase power system has been explained and evaluation of computational efficiency of parallel computation techniques for the developed model of an AC-DC-AC converter has been performed. The presented modelling method can be employed in the design phase of smart grids, for power quality and conducted emission analysis. 

Place, publisher, year, edition, pages
Walter de Gruyter, 2018
Keywords
mathematical model, parallel computation, power converter, power quality, power system, rectifier, AC-AC power converters, Computational efficiency, Electric inverters, Electric power transmission networks, Mathematical models, Power converters, Quality control, Rectifying circuits, Smart power grids, AC-DC-AC converters, Conducted emissions, Experimental validations, Mathematical algorithms, Power conversion systems, Electric rectifiers
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:hj:diva-39008 (URN)10.1515/ijeeps-2017-0114 (DOI)000425295100012 ()2-s2.0-85042112535 (Scopus ID)JTHMaterialIS (Local ID)JTHMaterialIS (Archive number)JTHMaterialIS (OAI)
Available from: 2018-03-19 Created: 2018-03-19 Last updated: 2018-09-19Bibliographically approved
Leisner, P., Zanella, C., Belov, I., Edström, C., Sandulache, G. & Hansal, W. E. (2017). Control of silver throwing power by pulse reverse electroplating. Transactions of the Institute of Metal Finishing, 95(1), 25-30
Open this publication in new window or tab >>Control of silver throwing power by pulse reverse electroplating
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2017 (English)In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 95, no 1, p. 25-30Article in journal (Refereed) Published
Abstract [en]

The influence of electroplating parameters on throwing power (TP) is studied in additive-free silver cyanide solutions under direct current and pulse reverse electroplating conditions. It is found that the best TP is obtained when no agitation of the electrolyte is applied. The most important parameters for controlling the TP are the cathodic current density, the anodic to cathodic charge ratio, and the ratio between the anodic and cathodic current densities. Guidelines for process optimisation are given.

Place, publisher, year, edition, pages
Taylor & Francis, 2017
Keywords
Agitation, Pulse reverse electrodeposition, Silver, Throwing power, Electrolytes, Electroplating, Optimization, Cathodic charge, Cathodic current density, Direct current, Process optimisation, Pulse-reverse electrodeposition, Silver cyanide, Electroplating solutions
National Category
Materials Engineering
Identifiers
urn:nbn:se:hj:diva-35017 (URN)10.1080/00202967.2017.1260895 (DOI)000394497000007 ()2-s2.0-85009956051 (Scopus ID)JTHMaterialIS (Local ID)JTHMaterialIS (Archive number)JTHMaterialIS (OAI)
Funder
VINNOVA, 2013-01883
Available from: 2017-02-06 Created: 2017-02-06 Last updated: 2018-09-19Bibliographically approved
Belov, I., Nordh, A., Salomonsson, K. & Leisner, P. (2017). Fin‐Tube and Plate Heat Exchangers: Evaluation of Transient Performance. In: : . Paper presented at 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017; Dresden; Germany; 3 April 2017 through 5 April 2017. IEEE
Open this publication in new window or tab >>Fin‐Tube and Plate Heat Exchangers: Evaluation of Transient Performance
2017 (English)Conference paper, Published paper (Refereed)
Abstract [en]

A methodology for evaluation of transient performance of, and comparison between plate heat exchanger and plate-fin-and-tube heat exchanger was developed and realized, including experiment and 3-D simulation. Heat transfer from water to a gas medium was addressed. The heated gas volume was the same for both heat exchanger designs. This was achieved by placing the plate-fin-and-tube heat exchanger into enclosure. The volume average temperature of the gas as function of time was computed. Estimated material cost for the studied designs was at least seven times lower than for the stainless steel plate heat exchanger. The performance of the selected plate-fin-and-tube heat exchanger design was found comparable to the plate heat exchanger, when both fin and tube materials were set to Al, and the enclosure was a light-weight thermal insulator. Transient behavior of the studied heat exchangers should be of interest for micro-grid applications, but also for thermal management in electronic cabinets and data centers.

Place, publisher, year, edition, pages
IEEE, 2017
National Category
Engineering and Technology Materials Engineering
Identifiers
urn:nbn:se:hj:diva-34638 (URN)10.1109/EuroSimE.2017.7926214 (DOI)000403217700003 ()2-s2.0-85020206472 (Scopus ID)978-1-5090-4344-6 (ISBN)978-1-5090-4343-9 (ISBN)978-1-5090-4345-3 (ISBN)
Conference
18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017; Dresden; Germany; 3 April 2017 through 5 April 2017
Available from: 2017-01-09 Created: 2017-01-09 Last updated: 2018-09-19Bibliographically approved
Chernyakov, A. E., Aladov, A. V., Belov, I. & Zakgeim, A. L. (2017). Thermal resistance and temperature distribution in blue and white high-power LED arrays. In: Proceedings of the 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2017: . Paper presented at 23rd International Workshop on Thermal Investigations of ICs and Systems, 27-29 September 2017, Amsterdam, the Netherlands (pp. 1-4). IEEE, Article ID Code 132094.
Open this publication in new window or tab >>Thermal resistance and temperature distribution in blue and white high-power LED arrays
2017 (English)In: Proceedings of the 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2017, IEEE, 2017, p. 1-4, article id Code 132094Conference paper, Published paper (Refereed)
Abstract [en]

Thermal resistance and temperature distribution for high-power AlGaInN LED chip-on-board arrays in blue and white versions were measured by different methods and tools. The p-n junction temperature was determined through measuring a temperature-dependent forward voltage drop on the p-n junction, at a low measuring current after applying a high heating current. Furthermore, the infrared thermal imaging technique was employed to obtain the temperature map for the test object. A steady-state 3D computational model of the experimental setup was created including temperature-dependent power dissipation in the LED chips and partitioned interfacial thermal resistance between the heatsink and the LED array. Simulations of the heat transfer in the LED array were performed to further investigate temperature gradients observed in the measurements.

Place, publisher, year, edition, pages
IEEE, 2017
Keywords
Aluminum compounds, Gallium compounds, Heat transfer, Indium compounds, Infrared imaging, Integrated circuits, Semiconductor junctions, Temperature distribution, Blue and whites, Computational model, Forward voltage drops, Heating current, High-power LED arrays, Infrared thermal imaging, Interfacial thermal resistance, Temperature dependent, Light emitting diodes
National Category
Materials Engineering
Identifiers
urn:nbn:se:hj:diva-38685 (URN)10.1109/THERMINIC.2017.8233814 (DOI)2-s2.0-85045835540 (Scopus ID)9781538619285 (ISBN)9781538619292 (ISBN)
Conference
23rd International Workshop on Thermal Investigations of ICs and Systems, 27-29 September 2017, Amsterdam, the Netherlands
Available from: 2018-01-29 Created: 2018-01-29 Last updated: 2018-09-19Bibliographically approved
Zhang, Y., Hammam, T., Belov, I., Sjögren, T., Bakowski, M. & Nee, H.-P. (2017). Thermomechanical Analysis and Characterization of a Press-Pack Structure for SiC Power Module Packaging Applications. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 7(7), 1089-1100
Open this publication in new window or tab >>Thermomechanical Analysis and Characterization of a Press-Pack Structure for SiC Power Module Packaging Applications
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2017 (English)In: IEEE Transactions on Components, Packaging, and Manufacturing Technology, ISSN 2156-3950, E-ISSN 2156-3985, Vol. 7, no 7, p. 1089-1100Article in journal (Refereed) Published
Abstract [en]

This paper presents an experimental methodology for the characterization of thermomechanical displacement and friction properties in a free-floating press-pack structure, and evaluation of the tensile stress on the semiconductor die through simulation of different mechanical and thermal loading conditions. The press-pack structure consists of a single silver-metallized (1 μm) silicon carbide die (400 μm) in contact with rhodium-coated (0.4 μm) molybdenum square plates. The thermomechanical displacements in the press-pack structure have been obtained using the digital image correlation technique, and the mean random error has been $± $0.1 μm, which is approximately 10 ppm of the measured length (10.5 mm). The developed experimental method has led to an analytical estimation of friction coefficients on the interfaces' silicon carbide-molybdenum and molybdenum-copper. The results demonstrate that the thin silver layer behaves as a solid film lubricant. A 2-D finite-element model representing the experimental setup has been implemented. The difference in displacement between measurement and simulation is less than 8%. Furthermore, the coinfluence of the design parameters on the thermomechanical performance of the stacked structure has been analyzed through simulations. Finally, design guidelines to reduce the tensile stress on the silicon carbide die have been proposed regarding free-floating press-pack power electronics packaging.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2017
Keywords
Bars, Finite-element (FE) analysis, Friction, Measurement techniques, Multichip modules, Optical imaging, Power electronics, Silicon carbide, Stress, Temperature measurement, Thermal expansion, Thermomechanical processes
National Category
Engineering and Technology Materials Engineering
Identifiers
urn:nbn:se:hj:diva-34637 (URN)10.1109/TCPMT.2017.2711272 (DOI)000409509300010 ()2-s2.0-85023771342 (Scopus ID)
Available from: 2017-01-09 Created: 2017-01-09 Last updated: 2018-09-19Bibliographically approved
Lang, J., Belov, I., Hellén, J., Lim, J.-K., Schodt, B., Nilsson, T. M. J., . . . Leisner, P. (2017). Thermo-mechanical reliability and performance degradation of a lead-free RF power amplifier with GaN-on-SiC HEMTs. In: Materials Science Forum: . Paper presented at 11th European Conference on Silicon Carbide and Related Materials, ECSCRM 2016; Halkidiki; Greece; 25 September 2016 through 29 September 2016 (pp. 715-718). Trans Tech Publications, 897
Open this publication in new window or tab >>Thermo-mechanical reliability and performance degradation of a lead-free RF power amplifier with GaN-on-SiC HEMTs
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2017 (English)In: Materials Science Forum, Trans Tech Publications, 2017, Vol. 897, p. 715-718Conference paper, Published paper (Refereed)
Abstract [en]

RF power amplifier demonstrators containing each one GaN-on-SiC, HEMT, CHZ015AQEG, from UMS in SMD quad-flat no-leads package (QFN) were subjected to thermal cycles (TC) and power cycles (PC) followed by electrical, thermal and structural evaluation. Two types of solders i.e. Sn63Pb36Ag2 and lead-free SnAgCu (SAC305) and two types of TIM materials (NanoTIM and TgonTM 805) for PCB attachment to liquid cold plate were tested for thermomechanical reliability. Changes in electrical performance of the devices namely reduction of the current saturation value, threshold voltage shift, increase of the leakage current and degradation of the HF performance were observed as a result of an accumulated current stress during PC. No significant changes in the investigated solder or TIM materials were observed.

Place, publisher, year, edition, pages
Trans Tech Publications, 2017
Keywords
GaN (gallium nitride), HEMT (high-electron-mobility transistor), PC (power cycle), Reliability, RF (radio frequency) power amplifier, SiC (silicon carbide), TC (thermal cycle), Gallium nitride, High electron mobility transistors, Lead, Lead-free solders, Polychlorinated biphenyls, Power amplifiers, Silicon, Silicon carbide, Soldering alloys, Thermal conductivity, Thermal cycling, Threshold voltage, Tin, Electrical performance, Performance degradation, Power cycle, Radio frequencies, Thermomechanical reliability, Threshold voltage shifts, Radio frequency amplifiers
National Category
Electrical Engineering, Electronic Engineering, Information Engineering Materials Engineering
Identifiers
urn:nbn:se:hj:diva-36611 (URN)10.4028/www.scientific.net/MSF.897.715 (DOI)2-s2.0-85019987879 (Scopus ID)9783035710434 (ISBN)
Conference
11th European Conference on Silicon Carbide and Related Materials, ECSCRM 2016; Halkidiki; Greece; 25 September 2016 through 29 September 2016
Available from: 2017-07-06 Created: 2017-07-06 Last updated: 2018-09-19Bibliographically approved
Belov, I., Payandeh, M., Leisner, P., Jarfors, A. E. .. & Wessen, M. (2016). Effect of fillets on heat transfer in a rheocast aluminium heatsink. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE): . Paper presented at 17th International Conference IEEE EuroSimE, Montpellier, April 17-20, 2016.. IEEE
Open this publication in new window or tab >>Effect of fillets on heat transfer in a rheocast aluminium heatsink
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2016 (English)In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), IEEE, 2016Conference paper, Published paper (Refereed)
Abstract [en]

The effect of fillets formed between the base and plate fins of rheocast aluminium heatsinks on the thermal resistance of the heatsinks has been quantified by simulation. Simulation methodology, including sequential optimization has been developed in order to determine hotspot distributions where the fillets have the maximum effect. Combination of different fillet dimensions with various base thickness levels and aluminium alloys having inhomogeneous thermal conductivity have been investigated. For the studied cases, the effect of fillets on heatsink thermal resistance differs from negligible to 6%. The results would guide thermal designers on contribution of fillets to the heat transfer in multi-fin heatsinks for natural convection.

Place, publisher, year, edition, pages
IEEE, 2016
Keywords
Heating, Heat transfer, Metals, Conductivity, Temperature measurement, Thermal resistance
National Category
Materials Engineering
Identifiers
urn:nbn:se:hj:diva-28920 (URN)10.1109/EuroSimE.2016.7463320 (DOI)000381743700028 ()2-s2.0-84974569543 (Scopus ID)978-1-5090-2106-2 (ISBN)
Conference
17th International Conference IEEE EuroSimE, Montpellier, April 17-20, 2016.
Available from: 2016-01-08 Created: 2016-01-08 Last updated: 2018-09-12Bibliographically approved
Payandeh, M., Belov, I., Jarfors, A. E. . & Wessén, M. (2016). Effect of Material Inhomogeneity on Thermal Performance of a Rheocast Aluminum Heatsink for Electronics Cooling. Journal of materials engineering and performance (Print), 25(6), 2116-2127
Open this publication in new window or tab >>Effect of Material Inhomogeneity on Thermal Performance of a Rheocast Aluminum Heatsink for Electronics Cooling
2016 (English)In: Journal of materials engineering and performance (Print), ISSN 1059-9495, E-ISSN 1544-1024, Vol. 25, no 6, p. 2116-2127Article in journal (Refereed) Published
Abstract [en]

The relation between microstructural inhomogeneity and thermal conductivity of a rheocast componentmanufactured from two different aluminum alloys was investigated. The formation of two different primarya-Al particles was observed and related to multistage solidification process during slurry preparationand die cavity filling process. The microstructural inhomogeneity of the component was quantified as thefraction of a1-Al particles in the primary Al phase. A high fraction of coarse solute-lean a1-Al particles inthe primary Al phase caused a higher thermal conductivity of the component in the near-to-gate region. Avariation in thermal conductivity through the rheocast component of 10% was discovered. The effect of aninhomogeneous temperature-dependent thermal conductivity on the thermal performance of a largerheocast heatsink for electronics cooling in an operation environment was studied by means of simulation.Design guidelines were developed to account for the thermal performance of heatsinks with inhomogeneousthermal conductivity, as caused by the rheocasting process. Under the modeling assumptions, the simulationresults showed over 2.5% improvement in heatsink thermal resistance when the higher conductivity nearto-gate region was located at the top of the heatsink. Assuming homogeneous thermo-physical properties ina rheocast heatsink may lead to greater than 3.5% error in the estimation of maximum thermal resistanceof the heatsink. The variation in thermal conductivity within a large rheocast heatsink was found to beimportant for obtaining of a robust component design.

Place, publisher, year, edition, pages
Springer, 2016
Keywords
computer simulation, heatsink, microstructural inhomogeneity, rheocasting, thermal conductivity, thermal management
National Category
Metallurgy and Metallic Materials
Identifiers
urn:nbn:se:hj:diva-29918 (URN)10.1007/s11665-016-2102-8 (DOI)000376449100003 ()
Projects
CompCast
Funder
Knowledge Foundation, 20100203
Available from: 2016-05-16 Created: 2016-05-16 Last updated: 2018-06-08Bibliographically approved
Belov, I., Zanella, C., Edström, C. & Leisner, P. (2016). Finite element modeling of silver electrodeposition for evaluation of thickness distribution on complex geometries. Materials & design, 90, 693-703
Open this publication in new window or tab >>Finite element modeling of silver electrodeposition for evaluation of thickness distribution on complex geometries
2016 (English)In: Materials & design, ISSN 0264-1275, E-ISSN 1873-4197, Vol. 90, p. 693-703Article in journal (Refereed) Published
Abstract [en]

The paper reveals benefits of multi-disciplinary computer simulation and parametric studies in the design of silver plating process for improved coating distribution. A finite element model of direct current silver plating is experimentally validated for an Assaf panel without agitation. The model combines tertiary current distribution with Butler–Volmer electrode kinetics and computational fluid dynamics at a very low flow-rate. The effect of charge transfer coefficients on the throwing power of the process is quantified for the studied geometry, and variation of cathodic current density and exchange current density is investigated. A simpler model based on secondary current distribution is employed to quantify the effect of electrolyte conductivity on the throwing power of the process. A model combining tertiary current distribution and computational fluid dynamics has been developed and experimentally validated for simulation of complex telecom component electroplating in agitated electrolyte. The effect of current density on the process throwing power is quantified. Recommendations regarding modeling methodology and the effect of electrochemical and process parameters on the thickness distribution have been developed.

Keywords
Silver plating; Coating thickness distribution; Throwing power; Computer simulation; Finite element modeling
National Category
Materials Engineering
Identifiers
urn:nbn:se:hj:diva-28917 (URN)10.1016/j.matdes.2015.11.005 (DOI)000367235100082 ()2-s2.0-84953887544 (Scopus ID)
Funder
VINNOVA, 2013-01883
Available from: 2016-01-08 Created: 2016-01-08 Last updated: 2017-12-01Bibliographically approved
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